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Infineon Technologies CY8C6247FDI-D02T

Part No.:
CY8C6247FDI-D02T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-XFBGA, WLCSP
Datasheet:
AetrixCY8C6247FDI-D02T.pdf
Description:
IC MCU 32BIT 1MB FLASH 80WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,913

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Product details

Overview

CY8C6247FDI-D02T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1-MB flash, 288-KB SRAM, integrated SIMO DC-DC converter, CAPSENSE™, and hardware cryptography accelerator-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.

For engineers reviewing the CY8C6247FDI-D02T datasheet, CY8C6247FDI-D02T pinout, CY8C6247FDI-D02T application, or CY8C6247FDI-D02T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), QSPI XIP with on-the-fly encryption, Deep Sleep current (7 µA w/64-KB SRAM retention), and programmable analog/digital subsystems for sensor fusion and human interface.

Technical Context

The CY8C6247FDI-D02T implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, TLS stack) while the Cortex-M0+ manages low-latency peripherals and power state coordination via IPC and shared memory. Both cores operate at independent voltages (0.9 V or 1.1 V) and support fine-grained power gating.

Its programmable analog subsystem includes a 12-bit 1-Msps SAR ADC with 16-channel sequencer and averaging, two low-power comparators active in Deep Sleep, and a 12-bit DAC with <2-µs settling time-enabling simultaneous sensor acquisition, threshold detection, and analog output without CPU wake-up.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with retention control
Power Efficiency7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 active current @ 0.9 V
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), 12-bit DAC (<2-µs settling), 2 opamps, 2 Deep Sleep comparators
Digital Peripherals9 SCBs (configurable as SPI/I2C/UART), USB Full-Speed device, 32 TCPWMs, QSPI/SMIF with XIP & AES encryption
SecurityROM-based Secure Boot, 8 Protection Contexts, hardware crypto accelerator (AES, ECC, SHA, TRNG)
Package124-BGA (7 mm × 7 mm × 0.8 mm), 0.4-mm pitch, RoHS-compliant

Pinout & Package

The CY8C6247FDI-D02T is housed in a 124-ball BGA package (7 mm × 7 mm × 0.8 mm, 0.4-mm pitch) with exposed thermal pad. Pin functions are organized into power domains (VDDIO, VDDD, VCCD, VBACKUP), clock inputs (XTAL_IN/OUT, IMO, ILO), debug (SWDIO/SWCLK), and configurable GPIO banks supporting Smart I/O Boolean logic in Deep Sleep.

Pin/TerminalCircuit RoleDesign Meaning
VDDDDigital core supplyProvides regulated 0.9 V or 1.1 V to both CPUs and digital logic; connects to internal SIMO buck converter output
VDDIOI/O bank supplyConfigurable 1.7–3.6 V per bank; enables mixed-voltage interfacing with sensors, displays, or transceivers
SWDIO / SWCLKJTAG/SWD debug interfaceTwo-pin serial wire debug port; supports firmware update and real-time trace without dedicated JTAG pins
XTAL_IN / XTAL_OUTExternal crystal oscillator terminalsSupports 32-kHz or 16–35-MHz crystals for precise timing; required for USB and high-accuracy RTC operation
P0[0]–P0[7]Programmable GPIO bank 0Eight pins with Smart I/O capability-perform Boolean logic (AND/OR/XOR) autonomously during Deep Sleep

Key Features

FeatureDesign Value
Dual-voltage core operationIndependent 0.9 V (ultra-low-power) or 1.1 V (performance) supply for each CPU-enables dynamic voltage scaling per workload
QSPI XIP with encryptionExecute-in-place from external flash with on-the-fly AES decryption-reduces code footprint and eliminates boot-time flash copy
CAPSENSE™ with SmartSenseHardware-accelerated capacitive sensing with auto-tuning-delivers >100:1 SNR and liquid-tolerant touch on buttons, sliders, and proximity sensors
Programmable UDBsTwelve universal digital blocks (8 macrocells each) implement custom logic (e.g., LIN, S/PDIF, PRS) without CPU overhead or FPGA complexity
Backup domain64-byte retention memory + RTC powered by VBACKUP-maintains timekeeping and critical state across full power cycles

Applications

Smart Home Sensor HubIndustrial Predictive Maintenance Node

Use Scenario: Multi-sensor aggregation (temp, humidity, vibration, gas) with local AI inference and BLE/Wi-Fi uplink.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles sensor polling and CAPSENSE™ button UI; M4 runs TinyML model and TLS-secured cloud upload.

Use Value: 7 µA Deep Sleep extends battery life to >5 years on coin cell; on-chip crypto enables zero-trust device attestation.

Use Scenario: Vibration analysis on rotating machinery using MEMS accelerometers and FFT processing at edge.

IC Role / Device Role / Timing Role: SAR ADC samples at 1 Msps with sequencer-driven channel switching; TCPWM triggers synchronized capture windows; M4 executes real-time FFT.

Use Value: On-chip 12-bit ADC with averaging reduces external signal conditioning; Smart I/O filters noise before CPU wake-up.

Medical Wearable MonitorSecure Access Control Terminal

Use Scenario: ECG/PPG biosensing with analog front-end, motion artifact cancellation, and encrypted data logging.

IC Role / Device Role / Timing Role: Opamps condition analog signals; DAC drives reference voltages; comparators detect R-wave peaks in Deep Sleep.

Use Value: Two opamps and comparators remain active at 15 µA/MHz M0+ current-enabling continuous arrhythmia detection without waking M4.

Use Scenario: Fingerprint reader + NFC card reader with tamper-evident secure boot and encrypted credential storage.

IC Role / Device Role / Timing Role: ROM-based Secure Boot validates firmware signature; eFuse array stores unique keys; crypto accelerator performs AES-256 and ECDSA signing.

Use Value: Hardware-enforced protection contexts isolate biometric processing from network stack-preventing side-channel leakage of templates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32WB55RGVSingle Cortex-M4 core + dedicated radio coprocessor; no M0+ companion core; 1-MB flash but only 256-KB SRAMLacks integrated capacitive sensing and programmable analog; requires external ADC for multi-channel biosensingPreferred when Bluetooth LE radio integration is primary requirement and dual-CPU task partitioning is unnecessary
nRF5340 DKDual-core (M33+M33) with separate network and application processors; no integrated SMIF/QSPI XIP or CAPSENSE™No on-chip analog subsystem-requires external ADC/DAC for sensor interface; lacks hardware crypto acceleration for asymmetric opsChosen for complex wireless protocol stacks (Thread/Zigbee) where RF coexistence and protocol offload outweigh analog integration needs

Compared with STM32WB55RGV and nRF5340 DK, the CY8C6247FDI-D02T uniquely combines dual heterogeneous cores, programmable analog/digital fabric, and production-ready CAPSENSE™-making it optimal for resource-constrained IoT endpoints requiring concurrent sensing, processing, and security without external components.

Availability

CY8C6247FDI-D02T is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, medical wearables, and secure access terminals requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for CY8C6247FDI-D02T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and automotive ICs-with over 30 years of embedded systems expertise and ISO/IEC 27001-certified development processes.

The PSoC™ 62 product line targets secure, ultra-low-power IoT endpoints-integrating Arm dual-core processing, programmable analog/digital fabric, and hardware-rooted security to eliminate discrete component count and accelerate certified device development.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6247FDI-D02T?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the official Infineon datasheet (Rev. *Q, p.1). This frequency is achievable under 1.1-V core supply and ambient temperatures ≤85°C. At 0.9-V operation, maximum frequency is reduced to maintain timing closure and power integrity-details are specified in the "Device-Level Specifications" section (p.53).

Does CY8C6247FDI-D02T support external quad SPI flash with execute-in-place (XIP)?

Yes, the device supports XIP from external quad SPI flash via its Serial Memory Interface (SMIF), with hardware-accelerated on-the-fly AES-128 decryption. The SMIF includes a 4-KB cache to reduce latency and power consumption during instruction fetch. Supported interfaces include single, dual, quad, dual-quad, and octal modes, with throughput up to 640 Mbps in octal mode.

How many GPIO pins support Smart I/O functionality in Deep Sleep mode?

16 GPIO pins-organized as two Smart I/O ports (P0[0]–P0[7] and P12[0]–P12[7])-retain Boolean logic capability (AND, OR, XOR, invert) during Deep Sleep. These pins can process input combinations and trigger wake events without CPU intervention, reducing average system current in sensor-monitoring applications.

Is the CAPSENSE™ subsystem on CY8C6247FDI-D02T compatible with wet or gloved touch?

Yes, CAPSENSE™ supports liquid-tolerant and gloved-finger operation through hardware-based shield electrode drive and automatic SmartSense tuning. The subsystem achieves >100:1 signal-to-noise ratio and dynamically adjusts scan parameters (frequency, resolution, averaging) to maintain reliability in presence of water films or thick gloves-validated per IEC 61000-4-6 and IP67 test conditions.

CY8C6247FDI-D02T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-XFBGA, WLCSP
Series:
PSOC™ 6
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b SAR; D/A 2x7b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6247FDI-D02T FAQ

1.How can I place an order for CY8C6247FDI-D02T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6247FDI-D02T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6247FDI-D02T reliable?

The price and inventory of CY8C6247FDI-D02T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6247FDI-D02T is usually 5 days.

3.What payment methods are accepted for CY8C6247FDI-D02T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6247FDI-D02T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6247FDI-D02T?

CY8C6247FDI-D02T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6247FDI-D02T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6247FDI-D02T?

For technical support, including CY8C6247FDI-D02T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6247FDI-D02T requirements.

6.How does Aetrix verify that CY8C6247FDI-D02T is sourced from the original manufacturer or authorized distributors?

All CY8C6247FDI-D02T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6247FDI-D02T meets industry standards.

7.What is the process for return or replacement of CY8C6247FDI-D02T?

All CY8C6247FDI-D02T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6247FDI-D02T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6247FDI-D02T part is unused and in its original packaging.

Return procedure for CY8C6247FDI-D02T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6247FDI-D02T Tags

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