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Infineon Technologies CY8C6247FDI-D32T
- Part No.:
- CY8C6247FDI-D32T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-XFBGA, WLCSP
- Datasheet:
-
CY8C6247FDI-D32T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 80WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,000
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Product details
Overview
CY8C6247FDI-D32T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1 MB flash, 288 KB SRAM, integrated SMIF/QSPI, CAPSENSE™, and hardware crypto acceleration. It operates from 1.7–3.6 V, supports Deep Sleep at 7 µA with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and sensor processing.
For engineers reviewing the CY8C6247FDI-D32T datasheet, CY8C6247FDI-D32T pinout, CY8C6247FDI-D32T application, or CY8C6247FDI-D32T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), on-chip SIMO DC-DC converter (<1 µA quiescent), QSPI XIP with 4 KB cache, and ROM-based Secure Boot for firmware integrity validation.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., sensor fusion, crypto) while the Cortex-M0+ manages low-latency peripherals and power state coordination. Both cores share memory-mapped peripherals via a high-bandwidth AHB interconnect and synchronize via IPC with hardware semaphores.
Its programmable analog subsystem integrates a 12-bit 1-Msps SAR ADC with 16-channel sequencer and result averaging, two low-power comparators active in Deep Sleep, and a 12-bit DAC with <2 µs settling time-enabling mixed-signal signal conditioning without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with retention control |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 active current @ 0.9 V core |
| QSPI/SMIF | Up to 640 Mbps throughput; Execute-In-Place with 4-KB cache; on-the-fly AES encryption/decryption |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer, averaging), 12-bit DAC (<2 µs settling), 2 opamps, 2 Deep Sleep comparators |
| Security | ROM-based Secure Boot, 8 Protection Contexts, hardware crypto accelerator (AES, ECC, SHA, TRNG) |
| Clock System | 8-MHz IMO (±2%), 32-kHz ILO, crystal oscillators (16–35 MHz & 32 kHz), PLL/FLL, integer/fractional dividers |
Pinout & Package
This device is packaged in a 124-ball BGA (9 mm × 9 mm × 1 mm, 0.8 mm pitch). Pin functions are defined per the CY8C62x6/62x7 pinout specification (Rev. *Q, Table 4-1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interface operation |
| VDDD | Digital Core Supply | Supplies CPU, memory, and digital logic; supports dynamic voltage scaling (0.9 V / 1.1 V) |
| VCCD | Analog Core Supply | Provides clean 1.7–3.6 V for ADC, DAC, opamps, and comparators |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; compatible with open-drain reset supervisors |
| SWDCK/SWDIO | Debug Interface | 2-pin SWD interface for programming and real-time debugging; accessible in all non-Hibernate modes |
| QSPI[0:3]/SCLK/SS | Quad SPI Interface | Direct connection to external flash; supports XIP, octal mode, and encrypted read/write |
Key Features
| Feature | Design Value |
|---|---|
| Smart I/O Ports | Two 16-pin Smart I/O blocks perform Boolean logic (AND/OR/XOR) on GPIO signals during Deep Sleep-enabling wake-on-pattern without CPU wake-up |
| CAPSENSE™ Subsystem | Hardware-accelerated capacitive sensing with SmartSense auto-tuning, liquid tolerance, and mutual/self-capacitance support up to 99 segments |
| Programmable Digital (UDBs) | Twelve universal digital blocks (8 macrocells each) implement custom logic or pre-verified peripherals (LIN, UART, SPI, PRS) in Verilog or drag-and-drop mode |
| Audio Subsystem | Two PDM microphone inputs + one I2S/TDM channel enable local voice preprocessing and multi-mic beamforming without host CPU load |
| On-chip SIMO DC-DC | Single-inductor, multiple-output buck converter delivers VDDD, VCCD, and VREF from single input; <1 µA quiescent current extends battery life |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous ECG/PPG acquisition with motion artifact suppression and local anomaly detection. IC Role / Device Role / Timing Role: Dual-core real-time sensor fusion engine: M4 runs ML inference, M0+ manages CAPSENSE™ touch controls and BLE timing. Use Value: 7 µA Deep Sleep with 64 KB SRAM retention preserves context between periodic sensor bursts; on-chip ADC averaging reduces external filtering needs. | Use Scenario: Multi-sensor aggregation (temp/humidity/PIR/VOC) with local decision logic and encrypted cloud upload. IC Role / Device Role / Timing Role: Secure edge node controller: Crypto accelerator signs sensor data; SMIF executes firmware from encrypted external flash. Use Value: Hardware AES-256 encryption/decryption in SMIF path prevents firmware tampering; OTP eFuse stores unique device keys. |
| Industrial Predictive Maintenance Node | Wireless Keypad with Haptic Feedback |
Use Scenario: Vibration analysis using MEMS accelerometer + FFT processing before wireless transmission. IC Role / Device Role / Timing Role: Real-time signal processor: M4 performs 1024-point FFT; TCPWM generates precise PWM triggers for synchronized sampling. Use Value: 1-Msps SAR ADC with 16-channel sequencer captures multi-axis vibration waveforms; DMA offloads data to SRAM without CPU intervention. | Use Scenario: Capacitive keypad with waterproof overlay and localized haptic response on keypress. IC Role / Device Role / Timing Role: Integrated HMI controller: CAPSENSE™ detects touch through 3 mm glass; DAC drives piezo actuator with <2 µs settling. Use Value: Single-chip solution eliminates external touch controller and haptic driver; Smart I/O enables wake-on-gesture in Deep Sleep. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2040 | No hardware crypto accelerator; no Secure Boot ROM; no CAPSENSE™; 264 KB SRAM, no Deep Sleep retention below 15 µA | Suitable for cost-sensitive, non-secure consumer devices; lacks certified secure boot and analog integration | Select only if crypto and analog peripherals are implemented externally or omitted |
| STM32WB55 | Single Cortex-M4 core; Bluetooth LE radio integrated; 1 MB flash but only 256 KB SRAM; no programmable analog/digital blocks | Better for Bluetooth-centric applications; weaker analog subsystem and no dual-CPU task partitioning | Prefer when wireless connectivity is primary requirement and CAPSENSE™/UDBs are unnecessary |
Compared with RP2040 and STM32WB55, CY8C6247FDI-D32T uniquely combines dual-CPU deterministic partitioning, hardware-accelerated security, and programmable analog/digital fabric-enabling consolidated sensor processing, UI, and secure communication in one die without external ICs.
Availability
CY8C6247FDI-D32T is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and wireless keypads requiring stable component supply across long-lifecycle deployments.
Supply support for CY8C6247FDI-D32T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded systems, with global manufacturing and R&D infrastructure.
The PSoC™ 62 product line was designed specifically for resource-constrained, battery-powered IoT endpoints demanding simultaneous ultra-low-power operation, hardware-enforced security, and flexible mixed-signal programmability.
FAQ
What debug interfaces does CY8C6247FDI-D32T support?
CY8C6247FDI-D32T supports Serial Wire Debug (SWD) via dedicated SWDCK and SWDIO pins, enabling full JTAG-equivalent debugging, flash programming, and real-time trace. The debug interface remains accessible in all operational modes except Hibernate, and all debug paths can be permanently disabled via eFuse for production security.
Does this MCU support external memory execution with encryption?
Yes. The SMIF peripheral supports Execute-In-Place (XIP) from external quad SPI flash with on-the-fly AES-256 decryption using keys stored in protected memory. This allows secure firmware storage outside the device while maintaining code integrity and preventing reverse engineering of executable binaries.
How many GPIOs support overvoltage tolerance?
Six GPIO pins (P0[0]–P0[5]) are specified as overvoltage-tolerant (OVT) up to 5.5 V, independent of VDDIO supply. These pins may safely interface with 5 V logic or sensors without level shifters, simplifying system design in mixed-voltage environments.
Can CAPSENSE™ operate during Deep Sleep mode?
Yes. CAPSENSE™ can run autonomously in Deep Sleep mode using the low-power ILO clock and dedicated hardware scan engine. It supports wake-on-touch with configurable sensitivity and automatic baseline recalibration, consuming less than 10 µA total system current during continuous scanning.
CY8C6247FDI-D32T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-XFBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6247FDI-D32T FAQ
1.How can I place an order for CY8C6247FDI-D32T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6247FDI-D32T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6247FDI-D32T reliable?
The price and inventory of CY8C6247FDI-D32T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6247FDI-D32T is usually 5 days.
3.What payment methods are accepted for CY8C6247FDI-D32T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6247FDI-D32T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6247FDI-D32T?
CY8C6247FDI-D32T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6247FDI-D32T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6247FDI-D32T?
For technical support, including CY8C6247FDI-D32T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6247FDI-D32T requirements.
6.How does Aetrix verify that CY8C6247FDI-D32T is sourced from the original manufacturer or authorized distributors?
All CY8C6247FDI-D32T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6247FDI-D32T meets industry standards.
7.What is the process for return or replacement of CY8C6247FDI-D32T?
All CY8C6247FDI-D32T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6247FDI-D32T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6247FDI-D32T part is unused and in its original packaging.
Return procedure for CY8C6247FDI-D32T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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