Infineon Technologies CY8C6247FTI-D52T
- Part No.:
- CY8C6247FTI-D52T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-XFBGA, WLCSP
- Datasheet:
-
CY8C6247FTI-D52T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 80WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,128
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6247FTI-D52T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 62 microcontroller with 1-MB flash, 288-KB SRAM, integrated SIMO DC-DC converter, CAPSENSE™, and hardware crypto accelerator-designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless protocol stack execution.
For engineers reviewing the CY8C6247FTI-D52T datasheet, CY8C6247FTI-D52T pinout, CY8C6247FTI-D52T application, or CY8C6247FTI-D52T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), QSPI XIP with on-the-fly encryption, Deep Sleep current (7 µA w/64-KB SRAM retention), and programmable analog/digital subsystems for sensor fusion and human interface.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, TLS) while the Cortex-M0+ manages low-latency peripherals and real-time scheduling. Memory coherency is maintained via IPC and shared SRAM with protection contexts.
Its clock system integrates FLL (for IMO multiplication), PLL (for high-frequency peripheral clocks), and fractional dividers enabling precise timing across TCPWM, SCB, and USB modules-critical for synchronized sensor sampling and audio I2S/TDM streaming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| Memory | 1-MB application flash (RWW), 288-KB SRAM (with retention control), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 22 µA/MHz M4 active current @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two opamps, two low-power comparators, 12-bit DAC |
| Digital Peripherals | Nine SCBs (configurable as SPI/I2C/UART), one Deep Sleep SCB, 32 TCPWMs, 12 UDBs, CAPSENSE™ engine |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES-256, ECC, SHA-256), TRNG, eight protection contexts |
| QSPI/SMIF | Execute-in-Place from external flash with on-the-fly AES decryption, 4-KB cache, up to 640 Mbps throughput |
Pinout & Package
This device is packaged in a 124-ball BGA (7 mm × 7 mm × 0.8 mm, 0.4-mm pitch) with 100 user-programmable GPIOs, including six overvoltage-tolerant (OVT) pins and two Smart I/O ports supporting Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6-V domains per port group; enables mixed-voltage interfacing |
| VDDD/VDDA | Digital/Analog Core Supply | Separate regulated supplies for noise isolation between digital logic and precision analog blocks |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; supports brown-out detection and watchdog recovery |
| SWDCLK/SWDIO | Debug Interface | Two-pin Serial Wire Debug interface; supports full-speed programming and real-time trace with SWO |
| USB_DP/USB_DM | USB Full-Speed PHY | Differential pair compliant with USB 2.0 FS; integrated transceiver eliminates external PHY requirement |
| QSPI_IO0–QSPI_IO3 | Quad SPI Data Lines | Bi-directional data lanes supporting single/dual/quad/octal modes; essential for XIP and encrypted firmware loading |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 1.1 V or 0.9 V core operation per CPU-enables dynamic trade-off between performance and sub-µA/MHz efficiency |
| Smart I/O in Deep Sleep | Two 16-pin Smart I/O ports execute Boolean logic (AND/OR/XOR) on GPIO states without waking CPUs-ideal for wake-on-pattern event detection |
| CAPSENSE™ with SmartSense | Hardware-accelerated self/mutual capacitive sensing with automatic calibration-delivers >100:1 SNR and liquid-tolerant touch in battery-powered wearables |
| Programmable Analog Subsystem | Configurable CTBm opamp blocks, SAR ADC with result averaging, and temperature sensor routed to ADC-supports closed-loop sensor conditioning without CPU intervention |
| Secure Boot & Protection Contexts | ROM-resident boot loader validates signed images before execution; eight hardware-enforced memory protection contexts isolate RTOS tasks and secure services |
Applications
| Smart Home Sensor Hub | Wearable Health Monitor |
|---|---|
Use Scenario: Aggregates data from environmental (temp/humidity/pressure), motion (IMU), and biometric (ECG/PPG) sensors for local AI inference and BLE/Wi-Fi upload. IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles sensor polling and CAPSENSE™ button gestures; M4 runs neural network inference and encrypted cloud communication. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across multi-hour sensor sleep cycles; on-chip crypto enables TLS 1.3 handshake without external security IC. | Use Scenario: Continuous ECG and SpO₂ monitoring with on-device arrhythmia detection and haptic feedback. IC Role / Device Role / Timing Role: SAR ADC samples ECG at 1 kSPS with 16-channel sequencer; opamps condition analog front-end; M4 executes real-time QRS detection algorithm. Use Value: Integrated 12-bit DAC drives haptic motor with <2-µs settling time; low-power comparators monitor battery voltage in Hibernate mode to extend runtime. |
| Industrial Wireless Node | Secure Edge Gateway |
Use Scenario: Battery-powered vibration and temperature monitoring node in predictive maintenance systems using LoRaWAN or NB-IoT. IC Role / Device Role / Timing Role: TCPWMs generate precise PWM for piezoelectric actuator excitation; QSPI XIP loads firmware updates from encrypted external flash. Use Value: SIMO DC-DC converter achieves <1 µA quiescent current-extending 10-year battery life; CAPSENSE™ detects enclosure tampering via conductive coating. | Use Scenario: Local aggregation point for BLE mesh devices, performing protocol translation (BLE-to-Matter), OTA update signing, and secure credential storage. IC Role / Device Role / Timing Role: M4 executes Matter SDK and TLS stack; M0+ manages BLE radio timing and packet filtering; crypto accelerator offloads AES-256 and ECDSA operations. Use Value: Eight protection contexts isolate Matter stack, BLE controller, and secure element functions; OTP eFuse stores root-of-trust keys permanently. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2040 | No hardware crypto accelerator, no CAPSENSE™, no analog subsystem; relies on external components for secure boot and sensing | Suitable for cost-sensitive consumer devices without security or analog requirements | Choose RP2040 only if cryptographic acceleration, certified secure boot, and integrated analog are not required |
| STM32WB55 | Single Cortex-M4 core with Bluetooth LE radio; lacks second M0+ core, UDBs, and Smart I/O; lower SRAM (256 KB) | Better for Bluetooth-centric designs needing RF integration but less flexible for heterogeneous workloads | Select STM32WB55 when Bluetooth SoC functionality outweighs need for dual-CPU task partitioning and programmable logic |
Compared with RP2040 and STM32WB55, CY8C6247FTI-D52T uniquely combines dual-core deterministic scheduling, hardware-enforced security contexts, and reconfigurable analog/digital fabric-making it optimal for applications demanding concurrent real-time control, sensor fusion, and end-to-end encrypted connectivity.
Availability
CY8C6247FTI-D52T is available at Aetrix Electronics and suitable for smart home sensor hubs, wearable health monitors, industrial wireless nodes, and secure edge gateways requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CY8C6247FTI-D52T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
The PSoC™ 62 product line targets secure, ultra-low-power IoT endpoints-integrating Arm dual-core processing, programmable analog/digital fabric, and hardware-rooted security to eliminate discrete security ICs and reduce BOM count.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6247FTI-D52T?
The Cortex-M4F core operates at up to 150 MHz, verified by Infineon's datasheet Rev. *Q (2023-12-13). This frequency is achievable under 1.1-V core supply with appropriate thermal management and clock source configuration-e.g., using the PLL driven by an external 16–35 MHz crystal or the FLL locked to the 8-MHz IMO.
Does CY8C6247FTI-D52T support external memory execution with encryption?
Yes. The QSPI/SMIF interface supports Execute-in-Place (XIP) from external quad SPI flash with on-the-fly AES-128 or AES-256 decryption enabled via the hardware crypto accelerator. The 4-KB SMIF cache reduces power consumption during XIP access, and decryption keys are stored in protected memory regions enforced by the eight protection contexts.
How many GPIOs support overvoltage tolerance, and what is the rating?
Six GPIO pins (P0[0]–P0[3], P12[0]–P12[1]) are overvoltage tolerant up to 5.5 V, as specified in Section 6.2.4 of the datasheet. These pins retain functionality across 1.7–3.6-V I/O supply ranges and tolerate transient overvoltages beyond VDDIO-enabling direct connection to legacy 5-V buses or industrial sensors without level-shifting circuitry.
Can CAPSENSE™ operate during Deep Sleep mode, and what is its current draw?
Yes. CAPSENSE™ can scan capacitive buttons/sliders in Deep Sleep mode using the low-power scanning engine, drawing ≤1.5 µA typical (per Infineon AN229347). It leverages the 32-kHz ILO clock and dedicated hardware sequencer to perform autonomous scans without waking either CPU-enabling wake-on-touch in battery-powered devices with multi-year runtime.
CY8C6247FTI-D52T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-XFBGA, WLCSP
- Series:
- PSOC™ 6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6247FTI-D52T FAQ
1.How can I place an order for CY8C6247FTI-D52T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6247FTI-D52T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6247FTI-D52T reliable?
The price and inventory of CY8C6247FTI-D52T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6247FTI-D52T is usually 5 days.
3.What payment methods are accepted for CY8C6247FTI-D52T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6247FTI-D52T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6247FTI-D52T?
CY8C6247FTI-D52T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6247FTI-D52T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6247FTI-D52T?
For technical support, including CY8C6247FTI-D52T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6247FTI-D52T requirements.
6.How does Aetrix verify that CY8C6247FTI-D52T is sourced from the original manufacturer or authorized distributors?
All CY8C6247FTI-D52T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6247FTI-D52T meets industry standards.
7.What is the process for return or replacement of CY8C6247FTI-D52T?
All CY8C6247FTI-D52T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6247FTI-D52T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6247FTI-D52T part is unused and in its original packaging.
Return procedure for CY8C6247FTI-D52T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6247FTI-D52T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

