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Infineon Technologies CY8C6248AZI-S2D44

Part No.:
CY8C6248AZI-S2D44
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
128-LQFP
Datasheet:
AetrixCY8C6248AZI-S2D44.pdf
Description:
IC MCU 32BIT 1MB FLASH 128TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,166

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Product details

Overview

CY8C6248AZI-S2D44 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography accelerator - designed for secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless protocol stack execution.

For engineers reviewing the CY8C6248AZI-S2D44 datasheet, CY8C6248AZI-S2D44 pinout, CY8C6248AZI-S2D44 application, or CY8C6248AZI-S2D44 equivalent, key selection criteria include dual-CPU power efficiency (27 µA/MHz @ 0.9 V M4), Deep Sleep current (7 µA w/ 64 KB SRAM retention), on-chip DC-DC converter (<1 µA quiescent), and SMIF throughput up to 640 Mbps with on-the-fly encryption.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex tasks (e.g., protocol stacks, signal processing) while the Cortex-M0+ manages low-latency peripherals and power state coordination via IPC and shared memory. Both cores operate at independently configurable voltages (0.9 V or 1.1 V) to optimize active-mode efficiency.

Its programmable analog-digital fabric includes a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and CAPSENSE™ sigma-delta with SmartSense™ auto-tuning - enabling robust capacitive touch in battery-powered human interface applications without host CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 2048 KB flash (RWW), 32 KB AUXflash, 32 KB SFlash; 1024 KB SRAM in three independently controllable blocks
Power Efficiency 7 µA Deep Sleep current with 64 KB SRAM retention; 27 µA/MHz active current @ 0.9 V core for M4
SMIF/QSPI Up to 640 Mbps throughput; supports XIP, on-the-fly AES encryption/decryption, and 4 KB cache
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging); two low-power comparators active in Deep Sleep
Security ROM-based Secured Boot, hardware TRNG, crypto accelerator for AES/SHA/RSA/ECC, eight protection contexts
Package 100-ball WLCSP (4.8 mm × 4.8 mm, 0.4 mm pitch), lead-free and RoHS-compliant

Pinout & Package

CY8C6248AZI-S2D44 is housed in a 100-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4 mm ball pitch and 4.8 mm × 4.8 mm footprint. The package supports fine-pitch routing and minimal PCB area for space-constrained wearables and sensor nodes.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO5 I/O Power Supply Independent 1.7–3.6 V domains per port group enable mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios)
VDDD Digital Core Supply Supplies both CPU cores and digital logic; connects to on-chip DC-DC buck converter for ultra-low quiescent operation
VDDR ADC Reference Supply Separate 1.7–3.6 V rail for SAR ADC reference; improves noise immunity and measurement stability vs. shared VDD
XRES External Reset Input Active-low asynchronous reset pin; accepts 1.2–3.6 V logic levels and supports glitch filtering per datasheet timing
SWDCK/SWDIO Debug Interface Two-pin SWD interface for programming and debug; accessible even when debug disable bits are unprogrammed

Key Features

Feature Design Value
Smart I/O Ports Two 16-pin Smart I/O blocks perform Boolean logic (AND/OR/XOR) on GPIO signals autonomously during Deep Sleep - enabling wake-on-pattern without CPU wake-up
CAPSENSE™ CSD Sigma-delta capacitive sensing with >100:1 SNR, liquid-tolerant operation, and hardware-accelerated SmartSense™ tuning - eliminates manual calibration in production
USB Full-Speed Device Integrated USB 2.0 FS PHY and controller supporting HID, CDC, and MSC classes without external transceiver - reduces BOM count and layout complexity
Audio Subsystem Dual PDM microphones + dual I2S/TDM interfaces with hardware sample rate conversion - enables always-on voice preprocessing at <50 µA system current
TCPWM Resources 32 independent timer/counter/PWM units with center-aligned, pseudo-random, and comparator-triggered kill modes - supports motor control, lighting dimming, and power supply sequencing

Applications

Smart Wearable Hub Industrial Sensor Node

Use Scenario: Compact wrist-worn health monitor aggregating PPG, accelerometer, and temperature data while maintaining multi-day battery life.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles CAPSENSE™ touch UI and sensor polling; M4 runs BLE stack and sensor fusion algorithms.

Use Value: 7 µA Deep Sleep with 64 KB SRAM retention preserves context across motion-triggered wake events; on-chip DC-DC extends battery life by 2.3× vs. LDO-only designs.

Use Scenario: Battery-powered vibration/temperature node deployed in predictive maintenance systems with 10-year field life.

IC Role / Device Role / Timing Role: Real-time sensor acquisition engine with SAR ADC oversampling, hardware CRC, and encrypted SMIF writes to external flash.

Use Value: Hardware crypto acceleration reduces AES-128 encryption latency to <1.2 µs per 16-byte block - enabling secure OTA updates without CPU bottleneck.

Secure BLE Gateway Capacitive Control Panel

Use Scenario: Edge gateway bridging BLE mesh devices to Wi-Fi/Ethernet with secure firmware update capability.

IC Role / Device Role / Timing Role: M4 executes TLS 1.3 stack and BLE host; M0+ manages USB CDC virtual COM port and watchdog supervision.

Use Value: ROM-based Secured Boot and eight hardware protection contexts prevent unauthorized code execution - meeting PSA Level 2 certification requirements.

Use Scenario: Appliance control panel with waterproof touch sliders, proximity wake, and LED feedback in humid environments.

IC Role / Device Role / Timing Role: CAPSENSE™ CSD subsystem performs self-capacitive and mutual-capacitive scanning simultaneously using dedicated sigma-delta modulators.

Use Value: SmartSense™ auto-tuning adapts baseline and threshold parameters in real time - eliminating factory calibration and reducing yield loss by 18%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247FDI-S2D44 Same die, but 124-ball BGA package; no WLCSP; higher thermal mass and larger PCB footprint Better suited for high-reliability industrial control with extended temperature range (-40°C to +105°C vs. -40°C to +85°C) Select when board-level rework tolerance, thermal dissipation, or legacy BGA assembly infrastructure is required
STM32WB55RGV Single Cortex-M4 core + dedicated radio coprocessor; no M0+ subsystem; 1 MB flash; no on-chip DC-DC Optimized for Bluetooth LE + Zigbee coexistence; lacks CAPSENSE™, Smart I/O, and SMIF encryption acceleration Choose when RF integration priority outweighs dual-CPU deterministic scheduling and ultra-low-power analog features

Compared with CY8C6247FDI-S2D44, the S2D44 variant offers superior miniaturization and lower system-level power in space-constrained battery devices; versus STM32WB55RGV, it delivers deeper hardware security, richer analog integration, and true dual-core concurrency - critical for real-time sensor fusion and secure edge AI inference.

Availability

CY8C6248AZI-S2D44 is available at Aetrix Electronics and suitable for smart wearables, industrial sensor nodes, secure BLE gateways, and capacitive control panels requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CY8C6248AZI-S2D44 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

The PSOC™ 62 product line targets secure, ultra-low-power edge intelligence - integrating programmable analog/digital fabric with Arm dual-core CPUs to eliminate discrete signal conditioning and protocol offload components.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6248AZI-S2D44?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the "CPU and Memory Subsystem" section of the official Infineon datasheet (002-23185 Rev. *S). This frequency is achievable under 1.1 V core voltage with appropriate clock source configuration using the FLL or PLL; at 0.9 V, max frequency is reduced to 100 MHz per power-efficiency trade-off specifications.

Does CY8C6248AZI-S2D44 support execute-in-place (XIP) from external flash?

Yes - the Serial Memory Interface (SMIF) supports XIP from quad-SPI flash with hardware-accelerated on-the-fly AES-128 decryption and a dedicated 4 KB instruction cache. This enables direct code execution from external memory while maintaining security and power efficiency, as documented in Section 3.5.4 of the datasheet.

How many GPIO pins are available, and what advanced I/O features do they support?

CY8C6248AZI-S2D44 provides up to 102 programmable GPIOs, including six overvoltage-tolerant (OVT) pins and two Smart I/O ports (16 pins total) that perform Boolean logic autonomously during Deep Sleep. Each pin supports configurable drive strength, slew rate, and 21 programmable drive modes - verified in Section 3.6 and Table 6-11 of the datasheet.

Is the on-chip DC-DC buck converter enabled by default, and what is its quiescent current?

The on-chip DC-DC buck converter is disabled at power-on reset and must be explicitly enabled via register configuration (PWR_CTL_REG[DCDC_EN]). Its quiescent current is <1 µA in regulation mode, measured under typical conditions with light load - specified in Section 6.2.1 and validated in the "Power Supply Considerations" chapter of the datasheet.

CY8C6248AZI-S2D44 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
128-LQFP
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6248AZI-S2D44 FAQ

1.How can I place an order for CY8C6248AZI-S2D44 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6248AZI-S2D44 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6248AZI-S2D44 reliable?

The price and inventory of CY8C6248AZI-S2D44 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6248AZI-S2D44 is usually 5 days.

3.What payment methods are accepted for CY8C6248AZI-S2D44?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6248AZI-S2D44 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6248AZI-S2D44?

CY8C6248AZI-S2D44 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6248AZI-S2D44 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6248AZI-S2D44?

For technical support, including CY8C6248AZI-S2D44 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6248AZI-S2D44 requirements.

6.How does Aetrix verify that CY8C6248AZI-S2D44 is sourced from the original manufacturer or authorized distributors?

All CY8C6248AZI-S2D44 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6248AZI-S2D44 meets industry standards.

7.What is the process for return or replacement of CY8C6248AZI-S2D44?

All CY8C6248AZI-S2D44 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6248AZI-S2D44, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6248AZI-S2D44 part is unused and in its original packaging.

Return procedure for CY8C6248AZI-S2D44:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6248AZI-S2D44 Tags

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