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Infineon Technologies CY8C6248BZI-S2D44
- Part No.:
- CY8C6248BZI-S2D44
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6248BZI-S2D44.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,661
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Product details
Overview
CY8C6248BZI-S2D44 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 2048 KB flash, 1024 KB SRAM, integrated CAPSENSE™, hardware cryptography accelerator, and ultra-low-power Deep Sleep mode (7 µA with 64 KB SRAM retention), designed for secure, battery-operated IoT edge nodes requiring real-time sensor fusion and wireless coexistence.
For engineers reviewing the CY8C6248BZI-S2D44 datasheet, CY8C6248BZI-S2D44 pinout, CY8C6248BZI-S2D44 application, or CY8C6248BZI-S2D44 equivalent, key selection criteria include dual-CPU power efficiency at 0.9 V/1.1 V core voltage, QSPI XIP with on-the-fly encryption, 12-bit 2-Msps SAR ADC with 16-channel sequencer, and 13 configurable serial communication blocks supporting USB FS, SDIO, and multi-protocol SCBs.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, TLS stack) while the Cortex-M0+ manages low-power peripheral orchestration and real-time control loops-enabling concurrent operation without resource contention. Inter-processor communication uses hardware IPC channels with mailbox and interrupt support.
Its clock architecture integrates two PLLs, an FLL, and fractional dividers to independently scale CPU, peripheral, and interface clocks-critical for optimizing throughput in USB + QSPI + ADC simultaneous operation. The SMIF subsystem supports octal-mode external flash with 640 Mbps peak bandwidth and 4 KB dedicated cache for deterministic XIP latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 1 KB OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current with 64 KB SRAM retention; 20 µA/MHz M0+ at 0.9 V core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, averaging), 2 LP comparators active in Deep Sleep |
| Digital Interfaces | 13 SCBs (SPI/I²C/UART configurable), USB Full-Speed device, dual SDIO/eMMC controllers, QSPI/SMIF with octal mode |
| Security | ROM-based Secured Boot, hardware crypto accelerator (AES-256, ECC, SHA-256), TRNG, 8 protection contexts |
| CAPSENSE™ | Sigma-delta CSD with SmartSense™ auto-tuning, liquid-tolerant proximity and mutual/self-capacitive sensing |
Pinout & Package
Package: 124-ball BGA (9 × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O / CAPSENSE™ | Programmable drive modes; Boolean logic in Deep Sleep; supports self-capacitive sensing |
| P12[0]–P12[7] | GPIO / TCPWM / SCB | Configurable as PWM outputs or UART/I²C/SPI signals; supports kill-input triggering for motor control |
| QSPI0_[0]–QSPI0_[5] | Quad-SPI Interface | Dedicated high-speed pins for octal-mode external flash; support 640 Mbps throughput with hardware encryption |
| USB_DP / USB_DM | USB Full-Speed PHY | Differential pair routed internally to USB controller; requires 27-Ω series termination per line |
| VDDIO0 / VDDIO1 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios) |
Key Features
| Feature | Design Value |
|---|---|
| Execute-In-Place (XIP) from QSPI | Enables direct code execution from external flash without RAM loading-reducing boot time and memory footprint by >40% |
| Hardware Crypto Accelerator | Offloads AES-256 encryption/decryption and ECDSA signing from CPU-cutting TLS handshake latency by ~65% vs. software-only |
| Smart I/O Ports | 16 GPIOs with programmable Boolean logic (AND/OR/XOR) active during Deep Sleep-enabling wake-on-pattern detection without CPU wake |
| Dynamic Voltage Scaling | User-selectable 0.9 V or 1.1 V core voltage per CPU-optimizes energy per instruction across performance vs. battery life trade-offs |
| Integrated Temperature Sensor | On-die sensor connected directly to SAR ADC-provides ±2°C accuracy for thermal management without external components |
Applications
| Wearable Health Monitor | Smart Home Hub |
|---|---|
|
Use Scenario: Continuous ECG and SpO₂ acquisition with BLE telemetry and local anomaly detection. IC Role / Device Role / Timing Role: Dual-CPU real-time sensor fusion engine: M0+ handles CAPSENSE™ electrode scanning and ADC buffering; M4F runs digital filter banks and BLE stack. Use Value: 7 µA Deep Sleep extends coin-cell life to >12 months; on-chip TRNG and Secured Boot ensure HIPAA-compliant data integrity. |
Use Scenario: Multi-protocol gateway aggregating Zigbee, Matter-over-Thread, and Wi-Fi sensors with local decision logic. IC Role / Device Role / Timing Role: Central protocol translator: SCBs manage concurrent Zigbee UART and Thread SPI; USB serves as debug/OTA interface. Use Value: 13 SCBs eliminate external bridge ICs; hardware crypto enables Matter certification without external SE. |
| Industrial Predictive Maintenance Node | Capacitive Touch Remote Control |
|
Use Scenario: Vibration and temperature monitoring on rotating machinery with edge FFT analysis and alert transmission. IC Role / Device Role / Timing Role: Real-time DSP node: M4F executes 1024-point FFT on ADC samples; M0+ schedules sensor reads and manages SDIO logging. Use Value: 2-Msps SAR ADC captures 40 kHz vibration spectra; 1024 KB SRAM buffers 30 sec of raw data pre-analysis. |
Use Scenario: Waterproof remote with gesture recognition and backlight dimming via capacitive slider. IC Role / Device Role / Timing Role: CAPSENSE™ controller: CSD subsystem drives 12-segment slider and proximity wake; Smart I/O detects swipe direction in Deep Sleep. Use Value: Liquid-tolerant sigma-delta sensing maintains reliability under condensation; SmartSense™ eliminates factory calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RP2350A-QFN-80 | Single-core Arm Cortex-M33 (150 MHz); no integrated CAPSENSE™ or analog front-end; lacks QSPI XIP cache | Better suited for cost-sensitive, compute-light applications without capacitive touch or high-speed analog acquisition | Select when prioritizing Arm TrustZone over mixed-signal integration and lower BOM count is critical |
| STM32WB55RGV | Single-core Cortex-M4 (64 MHz) + dedicated Cortex-M0+ radio controller; BLE 5.3 only; no hardware crypto for asymmetric ops | Optimized for Bluetooth-centric designs; limited analog capability (12-bit ADC @ 2.4 Msps, no LP comparators in Deep Sleep) | Choose when BLE SoC functionality outweighs need for independent dual-CPU scheduling and advanced security features |
Compared with RP2350A-QFN-80 and STM32WB55RGV, CY8C6248BZI-S2D44 uniquely delivers concurrent high-fidelity analog acquisition, capacitive sensing, and dual-CPU security processing in a single die-reducing system-level complexity for IoT endpoints requiring sensor fusion, local AI inference, and regulatory-grade firmware attestation.
Availability
CY8C6248BZI-S2D44 is available at Aetrix Electronics and suitable for wearable health monitors, smart home hubs, industrial predictive maintenance nodes, and capacitive touch remotes requiring stable component supply across multi-year production cycles.
Supply support for CY8C6248BZI-S2D44 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
This device belongs to the PSoC™ 62 product line-designed specifically for ultra-low-power, secure, sensor-rich IoT endpoints that demand runtime reconfigurability, hardware-enforced trust, and integrated analog/digital flexibility.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6248BZI-S2D44?
The Cortex-M4F core operates at up to 150 MHz, verified under 1.1 V core supply with ambient temperature ≤85°C. Frequency scaling is dynamically managed via the FLL and PLL clock sources, and the core supports wait-state-free execution from flash at this speed due to dual 8-KB instruction caches-one per CPU.
Does CY8C6248BZI-S2D44 support hardware-accelerated TLS 1.2/1.3?
Yes-it integrates a dedicated cryptography accelerator supporting AES-256-GCM, SHA-256/384, ECDSA-P256/P384, and RSA-2048, enabling full TLS 1.2/1.3 handshake offload. The ROM-based Secured Boot and execute-only memory regions ensure private keys never reside in writable RAM during TLS session establishment.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes-CAPSENSE™ CSD can scan up to 16 electrodes autonomously in Deep Sleep mode using the dedicated low-power oscillator and hardware sequencer. The SmartSense™ auto-tuning algorithm runs without CPU intervention, and wake events trigger interrupt-only M0+ wake-up, preserving sub-10 µA system current.
What external memory interfaces does CY8C6248BZI-S2D44 support beyond QSPI?
It supports only QSPI/SMIF for external memory expansion-no parallel NOR/NAND, HyperBus, or Octal DDR interfaces. However, SMIF supports single/dual/quad/dual-quad/octal modes, and its 4 KB cache + on-the-fly AES-256 decryption enables secure, low-latency XIP from encrypted external flash-eliminating need for secondary memory controllers.
CY8C6248BZI-S2D44 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6248BZI-S2D44 FAQ
1.How can I place an order for CY8C6248BZI-S2D44 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6248BZI-S2D44 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6248BZI-S2D44 reliable?
The price and inventory of CY8C6248BZI-S2D44 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6248BZI-S2D44 is usually 5 days.
3.What payment methods are accepted for CY8C6248BZI-S2D44?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6248BZI-S2D44 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6248BZI-S2D44?
CY8C6248BZI-S2D44 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6248BZI-S2D44 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6248BZI-S2D44?
For technical support, including CY8C6248BZI-S2D44 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6248BZI-S2D44 requirements.
6.How does Aetrix verify that CY8C6248BZI-S2D44 is sourced from the original manufacturer or authorized distributors?
All CY8C6248BZI-S2D44 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6248BZI-S2D44 meets industry standards.
7.What is the process for return or replacement of CY8C6248BZI-S2D44?
All CY8C6248BZI-S2D44 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6248BZI-S2D44, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6248BZI-S2D44 part is unused and in its original packaging.
Return procedure for CY8C6248BZI-S2D44:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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