My Inquiry
My Account
Infineon Technologies CY8C6248LQI-S2D02
- Part No.:
- CY8C6248LQI-S2D02
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6248LQI-S2D02.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,223
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6248LQI-S2D02 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 MCU with 2048 KB flash, 1024 KB SRAM, and integrated CAPSENSE™, QSPI/XIP, USB FS, and hardware cryptography. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64 KB SRAM retention, and targets secure, ultra-low-power IoT edge nodes requiring concurrent real-time control and wireless connectivity.
For engineers reviewing the CY8C6248LQI-S2D02 datasheet, CY8C6248LQI-S2D02 pinout, CY8C6248LQI-S2D02 application, or CY8C6248LQI-S2D02 equivalent, key selection criteria include dual-CPU power efficiency (27 µA/MHz @ 0.9 V M4), on-chip DC-DC quiescent current (<1 µA), SMIF throughput up to 640 Mbps, and ROM-based Secured Boot with eight protection contexts.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles complex signal processing and security-critical tasks while the Cortex-M0+ manages low-power peripheral orchestration and real-time I/O response. Inter-processor communication uses hardware IPC channels with mailbox and interrupt support.
Its clock architecture integrates two PLLs, an FLL, and fractional dividers to independently scale CPU, peripheral, and interface clocks-enabling simultaneous high-speed QSPI (640 Mbps) and low-jitter audio timing (PDM/I2S/TDM) without contention. The SMIF subsystem supports encrypted Execute-In-Place with 4 KB cache and octal interface mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3-retention blocks), 1 KB OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64 KB SRAM retained); 27 µA/MHz @ 0.9 V core for M4 |
| SMIF/QSPI | Up to 640 Mbps octal mode; hardware AES encryption/decryption; 4 KB XIP cache |
| Security | ROM-based Secured Boot, hardware TRNG, crypto accelerator (AES/SHA/RSA/ECC), 8 protection contexts |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators (Deep Sleep active), built-in temp sensor |
| Capacitive Sensing | CAPSENSE™ CSD with SmartSense™ auto-tuning, >100 dB SNR, liquid-tolerant mutual/self sensing |
Pinout & Package
This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4 mm pitch, optimized for space-constrained IoT endpoints. Pin functions are validated per Infineon's official pinout diagram for CY8C6248LQI-S2D02 (Rev. *S, p.32).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / Smart I/O / CapSense | Programmable drive modes; Boolean logic in Deep Sleep; OVT-capable on select pins |
| P12[0]–P12[7] | USB D+/D− / SCB / TCPWM | Dedicated full-speed USB PHY pins; configurable as UART/SPI/I2C or PWM outputs |
| SMIF_DQ[0]–[7] | Serial Memory Interface Data | Octal-capable data lines supporting encrypted XIP from external flash at up to 640 Mbps |
| VDDIO0/VDDIO1 | I/O Power Supply | Independent 1.7–3.6 V domains enabling mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios) |
| XRES | External Reset Input | Active-low reset with internal pull-up; supports glitch-free reset assertion per electrical spec §6.2.3 |
Key Features
| Feature | Design Value |
|---|---|
| Secure Dual-Core Execution | Hardware-enforced isolation between M4F (trusted app layer) and M0+ (peripheral scheduler), with IPC mailboxes and shared memory protection |
| Ultra-Low-Power System Control | On-chip DC-DC converter with <1 µA quiescent current enables battery-powered operation >10 years in Deep Sleep with wake-on-capacitive-touch |
| Intelligent Capacitive Sensing | CAPSENSE™ CSD with hardware-accelerated SmartSense™ tuning eliminates manual calibration and maintains >95% touch accuracy under water or condensation |
| Encrypted External Code Execution | SMIF performs real-time AES-128 decryption during XIP, enabling secure firmware updates without exposing decrypted code in external flash |
| Audio-Ready Peripheral Set | Two PDM microphones + two I2S/TDM interfaces allow simultaneous voice capture and speaker playback with <50 µs inter-channel skew |
Applications
| Smart Home Sensor Hub | Wearable Health Monitor |
|---|---|
|
Use Scenario: Central node aggregating BLE/Wi-Fi sensor data (temp, humidity, motion, air quality) while running local anomaly detection. IC Role / Device Role / Timing Role: Dual-core runtime coordinator: M4 processes ML inference; M0+ manages concurrent SCBs, CAPSENSE™ buttons, and RTC-triggered wake cycles. Use Value: 7 µA Deep Sleep with 64 KB retained SRAM enables >2-year coin-cell operation; SMIF encryption secures OTA firmware payloads. |
Use Scenario: Clinical-grade wearable measuring ECG, SpO₂, and motion via analog front-end and PDM mics. IC Role / Device Role / Timing Role: Analog-digital fusion controller: SAR ADC digitizes biopotentials; PDM/I2S routes acoustic biosignals; crypto engine signs sensor logs. Use Value: 12-bit 2-Msps ADC with 16-channel sequencer captures multi-lead ECG at 1 kSPS per channel; LP comparators detect arrhythmia events in Hibernate mode. |
| Industrial Wireless Node | Secure Access Terminal |
|
Use Scenario: Battery-powered predictive maintenance node monitoring vibration, temperature, and current on rotating equipment. IC Role / Device Role / Timing Role: Edge analytics processor: M4 runs FFT-based spectral analysis; TCPWMs time-stamp sensor triggers; SMIF loads firmware patches from encrypted flash. Use Value: Dual PLLs provide jitter-free sampling clocks for synchronized multi-sensor acquisition; on-chip TRNG seeds TLS handshakes for MQTT over TLS. |
Use Scenario: Tamper-resistant access panel using fingerprint + PIN + NFC for physical entry control. IC Role / Device Role / Timing Role: Root-of-trust anchor: ROM boot validates signed firmware; crypto accelerator performs AES-256 encryption of biometric templates; CAPSENSE™ detects cover tampering. Use Value: Eight hardware protection contexts isolate fingerprint processing, NFC stack, and UI rendering; eFuse stores unique device keys irreversibly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247LQI-S2D42 | Same die revision but 1024 KB flash / 512 KB SRAM; no AUXflash or supervisory flash | Limited firmware partitioning and secure boot flexibility due to reduced flash segmentation | Select when BOM cost sensitivity outweighs need for field-upgradable secure boot images |
| STM32WB55RGV | Single Cortex-M4 core + dedicated 2.4 GHz radio coprocessor; no integrated CAPSENSE™ or SMIF | Requires external touch controller and flash; lacks hardware-accelerated encrypted XIP | Choose when Bluetooth LE radio integration is primary requirement and external peripherals acceptable |
Compared with CY8C6248LQI-S2D02, CY8C6247LQI-S2D42 reduces memory headroom for secure firmware staging, while STM32WB55RGV trades integrated analog/digital programmability for embedded RF-but neither matches its combination of dual-core ultra-low-power efficiency, on-die encryption acceleration, and CAPSENSE™ hardware tuning.
Availability
CY8C6248LQI-S2D02 is available at Aetrix Electronics and suitable for smart home hubs, wearable health monitors, industrial wireless nodes, and secure access terminals requiring stable component supply across multi-year production cycles.
Supply support for CY8C6248LQI-S2D02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, security, and embedded control solutions for automotive, industrial, and IoT markets.
CY8C6248LQI-S2D02 belongs to the PSoC™ 62 MCU product line, engineered specifically for secure, battery-operated IoT endpoints demanding concurrent real-time processing, low-power sensing, and robust firmware integrity.
FAQ
What power modes does CY8C6248LQI-S2D02 support, and what is the lowest active current?
CY8C6248LQI-S2D02 supports six fine-grained power modes: Active, Sleep, Deep Sleep, Hibernate, and two variants of System Deep Sleep. Its lowest active current is 27 µA/MHz for the Cortex-M4F core operating at 0.9 V, measured per Infineon's electrical specifications (Rev. *S, §6.2.2). This enables sustained sensor fusion at sub-100 µA total system current.
Does CY8C6248LQI-S2D02 include hardware cryptographic acceleration, and which algorithms are supported?
Yes, it integrates a dedicated cryptography accelerator supporting AES-128/256 (ECB/CBC/CTR/GCM), SHA-1/224/256, RSA up to 4096 bits, ECC (NIST P-256/P-384), and a true random number generator (TRNG). These are accessible via PDL drivers and ModusToolbox™ libraries, with all operations executed in hardware without CPU intervention per Section 3.1.5 of the datasheet.
Can CY8C6248LQI-S2D02 execute code directly from external flash, and what security features apply?
Yes, its Serial Memory Interface (SMIF) supports Execute-In-Place (XIP) from external quad/octal SPI flash. Hardware AES-128 decryption occurs transparently during fetch, and a 4 KB instruction cache minimizes power consumption. Encrypted XIP requires pre-programmed keys stored in eFuse or SFlash, enforced by the ROM boot loader before execution begins.
How many capacitive sensing channels does CY8C6248LQI-S2D02 support, and what is its noise immunity specification?
CY8C6248LQI-S2D02 supports up to 101 capacitive sensing segments via its CAPSENSE™ CSD subsystem. It achieves >100 dB signal-to-noise ratio (SNR) under standard conditions and maintains >95% touch detection reliability with 2 mm water overlay, verified per Infineon's CAPSENSE™ characterization reports and application note AN95455.
CY8C6248LQI-S2D02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6248LQI-S2D02 FAQ
1.How can I place an order for CY8C6248LQI-S2D02 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6248LQI-S2D02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6248LQI-S2D02 reliable?
The price and inventory of CY8C6248LQI-S2D02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6248LQI-S2D02 is usually 5 days.
3.What payment methods are accepted for CY8C6248LQI-S2D02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6248LQI-S2D02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6248LQI-S2D02?
CY8C6248LQI-S2D02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6248LQI-S2D02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6248LQI-S2D02?
For technical support, including CY8C6248LQI-S2D02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6248LQI-S2D02 requirements.
6.How does Aetrix verify that CY8C6248LQI-S2D02 is sourced from the original manufacturer or authorized distributors?
All CY8C6248LQI-S2D02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6248LQI-S2D02 meets industry standards.
7.What is the process for return or replacement of CY8C6248LQI-S2D02?
All CY8C6248LQI-S2D02 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6248LQI-S2D02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6248LQI-S2D02 part is unused and in its original packaging.
Return procedure for CY8C6248LQI-S2D02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6248LQI-S2D02 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
