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Infineon Technologies CY8C624ABZI-S2D04
- Part No.:
- CY8C624ABZI-S2D04
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C624ABZI-S2D04.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,039
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Product details
Overview
CY8C624ABZI-S2D04 from Infineon is a dual-core PSOC™ 62 microcontroller featuring a 150-MHz Arm® Cortex®-M4F and 100-MHz Cortex®-M0+ CPU, 2048-KB flash, 1024-KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography accelerator - designed for secure, ultra-low-power IoT edge nodes with LCD display and capacitive touch interfaces.
For engineers reviewing the CY8C624ABZI-S2D04 datasheet, CY8C624ABZI-S2D04 pinout, CY8C624ABZI-S2D04 application, or CY8C624ABZI-S2D04 equivalent, this device supports fine-grained power management (7 µA Deep Sleep), real-time sensor fusion, secure boot with ROM-based root of trust, and configurable serial communication blocks for industrial sensing, wearable HMI, and connected gateway firmware development.
Technical Context
The CY8C624ABZI-S2D04 implements a tightly coupled dual-CPU subsystem with interprocessor communication (IPC) and shared memory arbitration, enabling asymmetric multiprocessing where the M4 handles compute-intensive tasks (e.g., audio processing, encryption) while the M0+ manages low-power peripheral control and real-time responsiveness in Deep Sleep mode.
Its clock system integrates two PLLs, an FLL, and multiple on-chip oscillators (IMO, ILO, crystal support), allowing dynamic frequency scaling across six power modes; the integrated DC-DC buck converter operates at <1 µA quiescent current and enables stable 1.1 V or 0.9 V core voltage selection per CPU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent DMA controllers |
| Memory | 2048-KB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 1024-KB SRAM (3 retention-controlled blocks) |
| Power Efficiency | 7 µA Deep Sleep current with 64-KB SRAM retention; 27 µA/MHz M4 active current at 0.9 V core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators (active in Deep Sleep), built-in temperature sensor |
| Digital Interfaces | 13 configurable SCBs (SPI/I²C/UART), USB Full-Speed device, QSPI/SMIF with XIP + 4-KB cache + on-the-fly encryption |
| Security | ROM-based Secured Boot, hardware crypto accelerator (AES/RSA/ECC/SHA), TRNG, 8 protection contexts, debug disable |
| Capacitive Sensing | CAPSENSE™ CSD with SmartSense™ auto-tuning, >100 dB SNR, liquid-tolerant mutual/self-sensing up to 101 segments |
Pinout & Package
This device is housed in a 100-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4-mm pitch, optimized for space-constrained IoT endpoints requiring high I/O density and thermal efficiency.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Banks | Independent 1.7–3.6 V supply domains per bank enable mixed-voltage interface operation (e.g., 1.8 V SPI + 3.3 V GPIO) |
| P0.0–P15.7 | Programmable GPIOs | Up to 102 pins with Smart I/O Boolean logic, OVT capability on 6 pins, and Deep Sleep Boolean operations on two 16-pin Smart I/O ports |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; supports reset source identification via system registers |
| USB_DP / USB_DM | USB Full-Speed Differential Pair | Integrated transceiver compliant with USB 2.0 FS; no external PHY required; supports suspend/resume in Deep Sleep |
| QSPI_IO0–QSPI_IO3 / QSPI_SCLK / QSPI_SS | Quad-SPI Interface | Supports XIP from external flash at up to 640 Mbps; includes hardware decryption engine and 4-KB instruction cache |
Key Features
| Feature | Design Value |
|---|---|
| Secure Dual-Core Architecture | Hardware-isolated execution environments with 8 protection contexts and execute-only memory regions for trusted firmware modules |
| Ultra-Low-Power Operation | Deep Sleep mode draws only 7 µA while retaining 64 KB SRAM and maintaining RTC + LP comparator wake sources |
| Configurable Serial Subsystem | 13 SCBs support runtime reconfiguration (SPI/I²C/UART); one Deep Sleep SCB remains active for wake-on-I²C/SPI without CPU wake |
| Integrated Capacitive Sensing | CAPSENSE™ CSD delivers >100 dB SNR and automatic SmartSense™ tuning - eliminating manual calibration for production touch panels |
| Audio & Timing Flexibility | 2 PDM + 2 I²S channels with TDM mode; 32 TCPWMs supporting center-aligned PWM, kill signal triggering, and hardware synchronization |
Applications
| Smart Wearable HMI | Industrial Sensor Node |
|---|---|
|
Use Scenario: Compact fitness tracker with OLED display, capacitive touch controls, and motion/sensor fusion. IC Role / Device Role / Timing Role: Main application MCU managing BLE connectivity, CAPSENSE™ touch UI, segment LCD drive, and real-time sensor data aggregation. Use Value: Dual-core split allows M0+ to handle touch polling and sensor interrupts in Deep Sleep while M4 processes accelerometer/gyro fusion and encrypts telemetry before BLE transmission. |
Use Scenario: Battery-powered environmental monitor deployed in remote locations with temperature, humidity, and gas sensors. IC Role / Device Role / Timing Role: Low-power system controller performing periodic analog acquisition, local analytics, and secure OTA update handling via USB or QSPI-connected flash. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention enables multi-year battery life; hardware crypto ensures signed firmware updates resist tampering. |
| Connected Home Gateway | Medical Edge Device |
|
Use Scenario: Wi-Fi/BLE hub aggregating data from smart lighting, thermostats, and door sensors in residential settings. IC Role / Device Role / Timing Role: Central protocol translator and security enforcer, bridging legacy Zigbee/Z-Wave peripherals to cloud APIs via TLS-secured Ethernet/Wi-Fi. Use Value: Integrated USB FS and QSPI XIP allow local firmware recovery and secure key provisioning; CAPSENSE™ enables physical buttonless UI for setup mode. |
Use Scenario: Portable patient monitor with ECG front-end, SpO₂ sensor, and LCD display requiring clinical-grade reliability and data integrity. IC Role / Device Role / Timing Role: Safety-critical controller executing FDA-aligned boot validation, real-time analog acquisition, and encrypted health data logging to external flash. Use Value: ROM-based Secured Boot and hardware-accelerated AES-256 ensure chain-of-trust from power-on; SAR ADC achieves 2-Msps sampling with 16-channel sequencing for multi-sensor sync. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core, secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Same package and core architecture, but with 1 MB flash / 512 KB SRAM and no USB FS interface | Suitable for cost-sensitive, non-USB edge nodes requiring lower memory footprint and no host-facing connectivity | Select when USB device functionality is unnecessary and BOM cost reduction is prioritized over memory headroom |
| STM32WB55RGV | Single Cortex-M4 @ 64 MHz, integrated BLE radio, 1 MB flash, no dual-core asymmetry or CAPSENSE™ | Better suited for BLE-centric applications with minimal analog sensing and no need for dedicated touch/HMI processing | Choose when wireless SoC integration outweighs requirements for dual-core deterministic latency, LCD drive, or advanced capacitive sensing |
Compared with CY8C6247BZI-D54 and STM32WB55RGV, the CY8C624ABZI-S2D04 uniquely combines dual-core deterministic partitioning, hardware-enforced security contexts, CAPSENSE™-optimized analog front-end, and QSPI XIP with encryption - making it optimal for resource-rich, UI-driven, and security-critical IoT endpoints.
Availability
CY8C624ABZI-S2D04 is available at Aetrix Electronics and suitable for smart wearables, industrial sensor gateways, and medical edge devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for CY8C624ABZI-S2D04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certifications including ISO 26262 and IEC 61508.
This device belongs to the PSoC™ 62 product line - engineered specifically for secure, ultra-low-power IoT endpoints demanding integrated analog/digital programmability, robust HMI capabilities, and hardware-rooted trust for cloud-connected edge intelligence.
FAQ
What power modes does CY8C624ABZI-S2D04 support, and how do they impact current draw?
The CY8C624ABZI-S2D04 offers six power modes: Active, Sleep, Deep Sleep, Hibernate, Flash Programming, and Off. Deep Sleep draws just 7 µA with 64-KB SRAM retention and maintains RTC, LP comparators, and selected GPIO wake sources. Active-mode current slopes are 27 µA/MHz (M4 at 0.9 V) and 20 µA/MHz (M0+ at 0.9 V), verified per Infineon's 002-23185 Rev. *S datasheet Section 6.2.2.
Does CY8C624ABZI-S2D04 include hardware cryptographic acceleration, and which algorithms are supported?
Yes - it integrates a dedicated cryptography accelerator supporting AES-128/256 (ECB/CBC/CTR/GCM), RSA-2048/4096, ECC (NIST P-256/P-384), SHA-1/224/256/384/512, and a True Random Number Generator (TRNG). These functions operate independently of CPU cores, enabling secure boot, encrypted firmware updates, and TLS offload without compromising real-time performance.
Can CY8C624ABZI-S2D04 drive segment LCDs, and what is the maximum configuration?
Yes - it features a dedicated Segment LCD driver supporting up to 101 segments and 8 commons, with software-configurable bias and frame frequency. This enables direct driving of alphanumeric or custom segment displays without external bias generators, validated in the "LCD" section (page 25) of the official datasheet and confirmed by Infineon's PSoC™ 62 reference designs.
Is CAPSENSE™ on CY8C624ABZI-S2D04 compatible with wet or gloved touch, and how is noise immunity achieved?
Yes - CAPSENSE™ uses sigma-delta (CSD) modulation with >100 dB SNR and supports both self- and mutual-capacitance sensing. Its liquid tolerance and gloved-touch capability stem from adaptive SmartSense™ hardware tuning, shield electrode support, and differential measurement architecture - all documented in Section 3.7.2 and electrical specs (Section 6.3.5) of the datasheet.
CY8C624ABZI-S2D04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C624ABZI-S2D04 FAQ
1.How can I place an order for CY8C624ABZI-S2D04 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C624ABZI-S2D04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C624ABZI-S2D04 reliable?
The price and inventory of CY8C624ABZI-S2D04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C624ABZI-S2D04 is usually 5 days.
3.What payment methods are accepted for CY8C624ABZI-S2D04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C624ABZI-S2D04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C624ABZI-S2D04?
CY8C624ABZI-S2D04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C624ABZI-S2D04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C624ABZI-S2D04?
For technical support, including CY8C624ABZI-S2D04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C624ABZI-S2D04 requirements.
6.How does Aetrix verify that CY8C624ABZI-S2D04 is sourced from the original manufacturer or authorized distributors?
All CY8C624ABZI-S2D04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C624ABZI-S2D04 meets industry standards.
7.What is the process for return or replacement of CY8C624ABZI-S2D04?
All CY8C624ABZI-S2D04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C624ABZI-S2D04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C624ABZI-S2D04 part is unused and in its original packaging.
Return procedure for CY8C624ABZI-S2D04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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