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Infineon Technologies CY8C624ABZI-S2D14
- Part No.:
- CY8C624ABZI-S2D14
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C624ABZI-S2D14.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,796
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Product details
Overview
CY8C624ABZI-S2D14 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSOC™ 62 microcontroller with 2048 KB flash, 1024 KB SRAM, integrated CAPSENSE™, hardware crypto accelerator, and ultra-low-power Deep Sleep mode (7 µA with 64 KB SRAM retention). It targets secure, battery-powered IoT edge nodes requiring concurrent real-time control and wireless protocol stack execution.
For engineers reviewing the CY8C624ABZI-S2D14 datasheet, CY8C624ABZI-S2D14 pinout, CY8C624ABZI-S2D14 application, or CY8C624ABZI-S2D14 equivalent, key selection criteria include dual-CPU power efficiency at 0.9 V core voltage (20 µA/MHz M0+), on-chip DC-DC converter (<1 µA quiescent), QSPI XIP with hardware encryption, and 13 configurable serial communication blocks supporting USB FS, SD/eMMC, and I2S/PDM audio.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., sensor fusion, TLS stack) while the Cortex-M0+ manages low-latency peripherals and power state transitions. Both cores share memory-mapped peripherals via a high-bandwidth interconnect with hardware IPC and three independent DMA controllers.
Its programmable analog-digital architecture integrates a 12-bit 2-Msps SAR ADC with 16-channel sequencer and averaging, two Deep Sleep-capable comparators, and CAPSENSE™ CSD with SmartSense™ auto-tuning - enabling capacitive touch interfaces that remain responsive during system-level power gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 2048 KB flash (RWW), 1024 KB SRAM (3 retention-controlled blocks), 1 KB OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current with 64 KB SRAM retention; 20 µA/MHz M0+ active current at 0.9 V core |
| Analog Peripherals | 12-bit 2-Msps SAR ADC (16-channel sequencer, result averaging), 2 Deep Sleep comparators, built-in temp sensor |
| Digital Interfaces | 13 SCBs (configurable as SPI/I2C/UART/USB FS), 2 SD Host/eMMC controllers, QSPI/SMIF with 4 KB cache & hardware encryption |
| Security | ROM-based Secured Boot, hardware crypto accelerator (AES/SHA/RSA/ECC), TRNG, 8 protection contexts |
| Capacitive Sensing | CAPSENSE™ sigma-delta (CSD) with liquid tolerance, proximity support, and SmartSense™ automatic tuning |
Pinout & Package
CY8C624ABZI-S2D14 is housed in a 100-ball WLCSP package (4.8 mm × 4.8 mm, 0.4 mm pitch), optimized for space-constrained wearable and sensor node designs. The package supports full GPIO flexibility including six overvoltage-tolerant (OVT) pins and two Smart I/O ports (16 I/Os) enabling Boolean logic during Deep Sleep.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interface with external sensors/peripherals |
| VDDD/VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies allow analog precision isolation and dynamic core voltage scaling (0.9 V / 1.1 V) |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up; compatible with open-drain reset supervisors |
| SWDCK/SWDIO | Debug Interface | 2-pin SWD interface supporting programming, debug, and boundary scan; accessible even after debug disable fuse |
| USB_DP/USB_DM | USB Full-Speed PHY | Differential pair compliant with USB 2.0 FS signaling; internal termination and transceiver eliminate external components |
| QSPI_IO0–QSPI_IO3 | Quad-SPI Data Lines | Supports XIP from external flash with on-the-fly AES-128 decryption; enables secure firmware updates without RAM load |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | User-selectable 0.9 V or 1.1 V core voltage per CPU, enabling precise trade-off between performance (150 MHz M4F) and sub-µA/MHz efficiency |
| Hardware Crypto Accelerator | Dedicated engine for AES-128/256, SHA-256, ECC-256, RSA-2048, and TRNG - offloads TLS handshake latency by >90% vs. software-only implementation |
| Smart I/O Logic | Two 16-pin Smart I/O ports execute Boolean functions (AND/OR/XOR) in Deep Sleep without waking CPUs - ideal for wake-on-gesture or interrupt pre-processing |
| Segment LCD Driver | Drives up to 101 segments × 8 commons; eliminates external display controller in medical wearables and smart home displays |
| Programmable Analog Subsystem | Configurable SAR ADC with hardware averaging and sequencer reduces firmware overhead for multi-sensor polling in environmental monitoring |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous ECG/PPG signal acquisition with motion artifact rejection and BLE beacon transmission. IC Role / Device Role / Timing Role: Dual-CPU real-time sensor processing (M4F) + low-power BLE stack management (M0+); CAPSENSE™ for touchless gesture UI. Use Value: 7 µA Deep Sleep extends coin-cell life beyond 12 months; on-chip crypto secures health data before BLE transmission. |
Use Scenario: Multi-sensor aggregation (temp/humidity/CO₂/motion) with local AI inference and Matter-over-Thread gateway functionality. IC Role / Device Role / Timing Role: M4F runs neural network inference on sensor fusion data; M0+ handles Thread radio timing and sleep scheduling. Use Value: QSPI XIP with hardware decryption enables secure OTA updates of Matter firmware without exposing decrypted image in RAM. |
| Industrial Predictive Maintenance Node | Secure Access Control Terminal |
Use Scenario: Vibration analysis via MEMS accelerometer, temperature logging, and encrypted LoRaWAN telemetry to cloud platform. IC Role / Device Role / Timing Role: SAR ADC oversamples at 2 Msps for FFT-based bearing fault detection; crypto engine signs telemetry payloads. Use Value: 12-bit ADC with hardware averaging achieves >85 dB SNR; Deep Sleep + Smart I/O allows wake-on-vibration threshold crossing. |
Use Scenario: Fingerprint + NFC card authentication with tamper-evident enclosure monitoring and secure credential storage. IC Role / Device Role / Timing Role: CAPSENSE™ drives fingerprint sensor array; OTP eFuse stores root keys; crypto engine performs PKI certificate validation. Use Value: ROM-based Secured Boot prevents bootkit injection; 8 protection contexts isolate biometric processing from network stack. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247BZI-D54 | Same die revision but 124-ball BGA package; higher pin count (102 GPIO vs. 84), no WLCSP footprint compatibility | Preferred for prototyping with debug headers and thermal management; unsuitable for ultra-thin wearables | Select when board space permits larger package and full GPIO access is required for complex peripheral expansion |
| STM32WB55RGV | Single Cortex-M4 core (64 MHz), integrated Bluetooth LE 5.0 radio, no hardware crypto for asymmetric algorithms or TRNG | Targeted at cost-sensitive BLE endpoints without cloud TLS or multi-sensor fusion requirements | Choose only if application omits dual-CPU concurrency, secure boot enforcement, or hardware-accelerated ECC/SHA |
Compared with CY8C624ABZI-S2D14, the CY8C6247BZI-D54 offers identical security and analog features but trades WLCSP miniaturization for expandability, while the STM32WB55RGV sacrifices cryptographic depth and dual-core determinism for integrated wireless and lower BOM cost.
Availability
CY8C624ABZI-S2D14 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and secure access control terminals requiring stable component supply across multi-year production cycles.
Supply support for CY8C624ABZI-S2D14 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure embedded solutions, with global manufacturing and quality certifications including ISO/TS 16949 and ISO 9001.
The PSOC™ 62 product line delivers ultra-low-power, dual-core MCUs with integrated analog, programmable logic, and hardware security - engineered specifically for resource-constrained, battery-operated IoT endpoints demanding both real-time responsiveness and end-to-end data integrity.
FAQ
What is the maximum operating frequency of each CPU core in CY8C624ABZI-S2D14?
The Cortex-M4F core operates at up to 150 MHz with single-cycle multiply and floating-point unit enabled, while the Cortex-M0+ core runs at up to 100 MHz. Both cores support dynamic voltage scaling between 0.9 V and 1.1 V, directly affecting achievable clock rates and active current consumption per MHz as specified in the electrical characteristics table.
Does CY8C624ABZI-S2D14 support execute-in-place (XIP) from external flash memory?
Yes - the integrated Quad-SPI/SMIF interface supports XIP from external quad SPI flash with hardware AES-128 decryption and a dedicated 4 KB cache. This enables secure firmware execution without loading into internal RAM, reducing attack surface and preserving SRAM for application data buffers.
How many GPIO pins are available, and what special capabilities do they offer?
CY8C624ABZI-S2D14 provides up to 84 GPIOs in its 100-ball WLCSP package. Six pins are overvoltage-tolerant (up to 5.5 V), two Smart I/O ports (16 pins total) perform Boolean logic during Deep Sleep, and all GPIOs support programmable drive strength, slew rate, and multiple pull configurations - critical for noise-immune sensor interfacing.
Is CAPSENSE™ functionality available in low-power modes?
Yes - CAPSENSE™ sigma-delta (CSD) operation is fully functional in Deep Sleep mode, allowing capacitive touch or proximity sensing while consuming less than 10 µA total system current. Automatic SmartSense™ tuning adapts baseline and thresholds without CPU intervention, maintaining reliability across temperature and humidity shifts.
CY8C624ABZI-S2D14 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C624ABZI-S2D14 FAQ
1.How can I place an order for CY8C624ABZI-S2D14 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C624ABZI-S2D14 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C624ABZI-S2D14 reliable?
The price and inventory of CY8C624ABZI-S2D14 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C624ABZI-S2D14 is usually 5 days.
3.What payment methods are accepted for CY8C624ABZI-S2D14?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C624ABZI-S2D14 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C624ABZI-S2D14?
CY8C624ABZI-S2D14 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C624ABZI-S2D14 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C624ABZI-S2D14?
For technical support, including CY8C624ABZI-S2D14 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C624ABZI-S2D14 requirements.
6.How does Aetrix verify that CY8C624ABZI-S2D14 is sourced from the original manufacturer or authorized distributors?
All CY8C624ABZI-S2D14 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C624ABZI-S2D14 meets industry standards.
7.What is the process for return or replacement of CY8C624ABZI-S2D14?
All CY8C624ABZI-S2D14 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C624ABZI-S2D14, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C624ABZI-S2D14 part is unused and in its original packaging.
Return procedure for CY8C624ABZI-S2D14:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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