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Infineon Technologies CY8C624ALQI-S2D02

Part No.:
CY8C624ALQI-S2D02
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C624ALQI-S2D02.pdf
Description:
IC MCU 32BIT 2MB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,872

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Product details

Overview

CY8C624ALQI-S2D02 from Infineon is a dual-core PSOC™ 62 microcontroller featuring a 150-MHz Arm® Cortex®-M4F and 100-MHz Cortex®-M0+ CPU, 2048-KB flash, 1024-KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography. It operates from 1.7 V to 3.6 V with deep-sleep current as low as 7 µA (64-KB SRAM retention), targeting secure, ultra-low-power IoT edge nodes.

For engineers reviewing the CY8C624ALQI-S2D02 datasheet, CY8C624ALQI-S2D02 pinout, CY8C624ALQI-S2D02 application, or CY8C624ALQI-S2D02 equivalent, key selection criteria include dual-CPU power efficiency at 0.9 V/1.1 V core voltage, on-chip DC-DC buck converter (<1 µA quiescent), 32 TCPWMs, 13 configurable SCBs, and ROM-based secured boot with eFuse protection.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the M4F handles complex real-time tasks (e.g., sensor fusion, audio processing) while the M0+ manages low-power background operations (e.g., CAPSENSE™ scanning in Deep Sleep). Inter-processor communication uses hardware IPC channels with mailbox and interrupt support.

Clocking is managed via three independent sources: 8-MHz IMO (±2%), 32-kHz ILO, and external crystal oscillators (16–35 MHz + 32 kHz), with two PLLs and an FLL enabling precise frequency synthesis for USB, audio, and ADC sampling - all routed through integer/fractional dividers to 32 programmable peripheral clocks.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory 2048-KB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 1024-KB SRAM (3-retention blocks)
Power Efficiency Deep Sleep: 7 µA @ 64-KB SRAM retention; Active slope: 27 µA/MHz (M4 @ 0.9 V)
Analog Peripherals 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators (active in Deep Sleep), built-in temp sensor
Digital Interfaces 13 SCBs (SPI/I²C/UART), USB Full-Speed device, 2 SD/eMMC controllers, QSPI/SMIF with XIP + 4-KB cache
Security ROM-based Secured Boot, hardware crypto accelerator (AES/RSA/ECC/SHA/TRNG), 1-Kb OTP eFuse array
Capacitive Sensing CAPSENSE™ CSD with SmartSense™ auto-tuning, >100 dB SNR, liquid-tolerant self/mutual sensing

Pinout & Package

This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4-mm pitch, optimized for space-constrained IoT endpoints. Pin functions are validated per Infineon's official pinout diagram (Document 002-23185 Rev. *S, Page 32).

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O Power Supply Banks Independent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing and selective power gating
VDDD / VDDA Digital & Analog Core Supplies VDDD powers CPUs/peripherals; VDDA supplies ADC/comparators - decoupling critical for <12-bit accuracy
XRES External Reset Input Active-low asynchronous reset; internal pull-up; supports reset source identification via firmware registers
SWDCK / SWDIO JTAG/SWD Debug Interface 2-pin Serial Wire Debug; supports full debug, programming, and secure lock/unlock via protected ROM bootloader
USB_DP / USB_DM USB Full-Speed Differential Pair On-die termination and PHY; requires no external transceiver; supports suspend/resume and battery charging detection
QSPI_IO0–QSPI_IO3 Quad-SPI Data Lines Support XIP from external flash; configurable for single/dual/quad/octal modes up to 640 Mbps throughput

Key Features

Feature Design Value
Dual-Voltage Core Operation User-selectable 0.9 V or 1.1 V core supply enables dynamic trade-off between performance (150 MHz) and ultra-low active current (27 µA/MHz)
Hardware Crypto Accelerator Offloads AES-128/256, SHA-256, ECC-256, RSA-2048, and TRNG - reduces firmware latency by >90% vs. software-only implementation
Smart I/O in Deep Sleep Two 16-pin Smart I/O ports execute Boolean logic (AND/OR/XOR) on GPIO states without waking CPUs - enables wake-on-pattern detection
Segment LCD Driver Drives up to 101 segments × 8 commons directly; eliminates external display controller in wearables and smart sensors
On-Chip DC-DC Buck Converter Integrated regulator with <1 µA quiescent current extends battery life in coin-cell-powered devices; supports dynamic voltage scaling

Applications

Wearable Health Monitor Smart Home Sensor Hub

Use Scenario: Continuous ECG/PPG signal acquisition, motion sensing, and BLE gateway operation in wrist-worn form factor.

IC Role / Device Role / Timing Role: Dual-CPU orchestrates real-time analog front-end sampling (ADC + comparators) on M0+, while M4F runs filtering, feature extraction, and BLE stack.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across multi-hour sleep cycles; CAPSENSE™ enables touchless gesture control.

Use Scenario: Multi-sensor aggregation (temp/humidity/CO₂/motion) with local decision logic and Wi-Fi/BLE uplink.

IC Role / Device Role / Timing Role: Acts as central sensor fusion MCU: SCBs interface diverse sensors; TCPWMs drive fan/PWM actuators; USB supports firmware updates via dongle.

Use Value: On-chip DC-DC buck enables direct 3.7-V Li-ion input; QSPI XIP allows secure OTA updates from encrypted external flash without SRAM copy overhead.

Industrial Wireless Node Secure Access Control Terminal

Use Scenario: Battery-powered vibration/temperature node in predictive maintenance system with LoRaWAN backhaul.

IC Role / Device Role / Timing Role: M0+ handles periodic sensor reads and LoRa modulation timing; M4F executes FFT-based anomaly detection before transmission.

Use Value: Hardware crypto accelerator signs sensor data payloads with ECDSA before radio transmission; eFuse stores unique device identity.

Use Scenario: Tamper-resistant door controller with fingerprint CAPSENSE™, NFC reader interface, and secure credential storage.

IC Role / Device Role / Timing Role: Secured Boot validates firmware integrity; OTP eFuse stores root keys; CAPSENSE™ provides spoof-resistant biometric capture.

Use Value: ROM-based root of trust prevents unauthorized firmware execution; Smart I/O detects physical tamper (e.g., case open) during Deep Sleep without CPU wake.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core, secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247LQI-D52 Same die revision (1/2), but 124-ball BGA package; higher pin count (102 GPIO vs. 80); no WLCSP footprint compatibility Preferred for prototyping or higher I/O density; unsuitable for ultra-compact PCBs requiring WLCSP Select when board layout permits larger package and additional GPIOs are needed for expansion interfaces.
STM32WB55RGV Single-core Cortex-M4 @ 64 MHz; integrated BLE 5.0 radio; no M0+ companion core or CAPSENSE™; 1-MB flash, 256-KB SRAM Optimized for BLE-centric applications; lacks dual-CPU power partitioning and advanced capacitive sensing Choose when wireless connectivity is primary requirement and ultra-low-power analog sensing is secondary.

Compared with CY8C6247LQI-D52, this WLCSP variant trades pin count and thermal dissipation for minimal footprint - ideal for size-constrained designs; versus STM32WB55RGV, it delivers superior analog integration and true hardware-enforced security partitioning at the cost of integrated RF.

Availability

CY8C624ALQI-S2D02 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial wireless nodes, and secure access terminals requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C624ALQI-S2D02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and R&D infrastructure.

The PSoC™ 62 product line targets secure, battery-operated IoT endpoints - integrating dual-core processing, hardware security, and programmable analog/digital peripherals into a single ultra-low-power SoC architecture.

FAQ

What is the maximum operating frequency of each CPU core in CY8C624ALQI-S2D02?

The Cortex-M4F core runs at up to 150 MHz, and the Cortex-M0+ core operates at up to 100 MHz. Both frequencies are achievable under 1.1-V core supply; at 0.9-V operation, maximum frequencies are reduced per datasheet derating curves (Section 6.2.2), but full 150/100 MHz is supported at 1.1 V with appropriate thermal design.

Does CY8C624ALQI-S2D02 support Execute-In-Place (XIP) from external flash memory?

Yes - the Quad-SPI/SMIF interface supports XIP from external quad-SPI flash with on-the-fly decryption and a dedicated 4-KB cache. This enables direct code execution without loading into internal RAM, reducing SRAM usage and improving power efficiency during firmware updates or large application loads.

How is secure boot implemented on CY8C624ALQI-S2D02?

Secure boot is enforced by ROM-resident code that verifies digital signatures of the boot image using hardware-accelerated SHA-256 and ECDSA. The root public key is fused in OTP eFuse; only images signed with the corresponding private key will execute. Debug interfaces are permanently disabled after secure lock.

Can CAPSENSE™ operate while the main CPUs are in Deep Sleep mode?

Yes - CAPSENSE™ CSD can scan capacitive buttons/sliders autonomously using the low-power M0+ CPU or dedicated hardware sequencer, with results stored in retained SRAM. Smart I/O ports also enable wake-on-touch detection without CPU intervention, achieving sub-10 µA average current in touch-responsive standby.

CY8C624ALQI-S2D02 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
53
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C624ALQI-S2D02 FAQ

1.How can I place an order for CY8C624ALQI-S2D02 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C624ALQI-S2D02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C624ALQI-S2D02 reliable?

The price and inventory of CY8C624ALQI-S2D02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C624ALQI-S2D02 is usually 5 days.

3.What payment methods are accepted for CY8C624ALQI-S2D02?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C624ALQI-S2D02 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C624ALQI-S2D02?

CY8C624ALQI-S2D02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C624ALQI-S2D02 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C624ALQI-S2D02?

For technical support, including CY8C624ALQI-S2D02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C624ALQI-S2D02 requirements.

6.How does Aetrix verify that CY8C624ALQI-S2D02 is sourced from the original manufacturer or authorized distributors?

All CY8C624ALQI-S2D02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C624ALQI-S2D02 meets industry standards.

7.What is the process for return or replacement of CY8C624ALQI-S2D02?

All CY8C624ALQI-S2D02 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C624ALQI-S2D02, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C624ALQI-S2D02 part is unused and in its original packaging.

Return procedure for CY8C624ALQI-S2D02:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C624ALQI-S2D02 Tags

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