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Infineon Technologies CY8C624ALQI-S2D42

Part No.:
CY8C624ALQI-S2D42
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C624ALQI-S2D42.pdf
Description:
IC MCU 32BIT 2MB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:520

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Product details

Overview

CY8C624ALQI-S2D42 from Infineon is a dual-core PSOC™ 62 microcontroller featuring a 150-MHz Arm® Cortex®-M4F and 100-MHz Cortex®-M0+ CPU, 2048-KB flash, 1024-KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography. It operates from 1.7 V to 3.6 V with deep-sleep current as low as 7 µA (64-KB SRAM retention), targeting secure, ultra-low-power IoT edge nodes with local sensing and connectivity.

For engineers reviewing the CY8C624ALQI-S2D42 datasheet, CY8C624ALQI-S2D42 pinout, CY8C624ALQI-S2D42 application, or CY8C624ALQI-S2D42 equivalent, this page delivers verified specifications, package mapping, real-world use cases, and validated alternative options - all grounded in Infineon's official PSOC™ 62 documentation and production-grade parametric data.

Technical Context

The CY8C624ALQI-S2D42 implements a tightly coupled dual-CPU architecture where the M4 handles complex application tasks and signal processing while the M0+ manages real-time peripherals, security boot, and low-power state coordination. Its memory subsystem includes RWW flash with two 8-KB CPU-specific caches and three independent SRAM blocks enabling selective retention during Deep Sleep.

Hardware security is embedded at silicon level: ROM-based Secured Boot, execute-only memory regions, eight protection contexts, and a dedicated crypto accelerator supporting AES-128/256, SHA-256, ECC, and TRNG. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), dual PLLs, FLL, and programmable dividers to support dynamic voltage/frequency scaling across six power modes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent cache
Memory 2048-KB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 1024-KB SRAM (3-retention blocks)
Power Modes Six modes including Deep Sleep (7 µA @ 64-KB SRAM retention) and Hibernate (200 nA)
Security ROM-based Secured Boot, hardware crypto engine (AES/SHA/ECC/TRNG), 8 protection contexts
Peripherals 13 SCBs (SPI/I²C/UART), USB FS device, QSPI/XIP w/ 4-KB cache & on-the-fly encryption, 32 TCPWMs
Analog 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators (active in Deep Sleep), CAPSENSE™ CSD
GPIO Up to 102 pins; 2 Smart I/O ports (16 pins) with Boolean logic in Deep Sleep; 6 OVT pins

Pinout & Package

This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4-mm pitch, optimized for space-constrained IoT sensor hubs and wearable endpoints. Pin functions are defined per Infineon's CY8C62x8/A datasheet Rev. *S, Table 4-1 (Pin Descriptions).

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO5 I/O Power Supply Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing and selective power gating
VDDD Digital Core Supply Supplies both CPUs, digital subsystems; supports 0.9 V / 1.1 V core voltage selection for ultra-low-power operation
VDDR Regulator Input Input to on-chip DC-DC buck converter (<1 µA quiescent); enables high-efficiency conversion from battery sources
XRES External Reset Input Active-low asynchronous reset; internal pull-up; compatible with open-drain or push-pull reset sources
SWDCK/SWDIO JTAG/SWD Debug Interface 2-pin Serial Wire Debug interface; supports firmware update, secure debug disable, and boundary scan
USB_DP/USB_DM USB Full-Speed Interface Differential pair compliant with USB 2.0 FS (12 Mbps); integrated transceivers eliminate external PHY

Key Features

Feature Design Value
Execute-in-Place (XIP) from QSPI Enables direct code execution from external flash using 4-KB on-chip cache, reducing SRAM footprint and wake latency
Smart I/O Boolean Logic Two 16-pin Smart I/O ports perform AND/OR/XOR/NOT operations in Deep Sleep without waking CPUs - ideal for wake-on-gesture or wake-on-event
Hardware CAPSENSE™ CSD Sigma-delta capacitive sensing with >100 dB SNR, liquid-tolerant tracking, and SmartSense™ auto-tuning - eliminates calibration effort in consumer HMI
Secure Boot & Protection Contexts ROM-resident boot loader validates signed images; eight hardware-enforced protection contexts isolate firmware modules (e.g., BLE stack vs. app code)
Dynamic Voltage Scaling User-selectable 0.9 V / 1.1 V core voltage per CPU; reduces active current by up to 32% (M4) and 29% (M0+) versus fixed 1.1 V mode

Applications

Smart Wearable Sensor Hub Industrial Wireless Node

Use Scenario: Compact wrist-worn health monitor collecting PPG, accelerometer, and temperature data with local anomaly detection.

IC Role / Device Role / Timing Role: Dual-core coordinator: M0+ manages CAPSENSE™ touch UI and sensor polling; M4 runs real-time filtering and BLE advertisement packet assembly.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 12 months; on-chip TRNG enables secure BLE pairing key generation.

Use Scenario: Battery-powered vibration sensor node in predictive maintenance system, transmitting FFT-processed data via LoRaWAN gateway.

IC Role / Device Role / Timing Role: Edge AI preprocessor: M4 executes lightweight ML inference (TinyML); M0+ handles SPI-to-LoRa radio control and watchdog supervision.

Use Value: Hardware crypto engine accelerates AES-128 encryption of sensor payloads; QSPI XIP allows firmware updates without SRAM copy overhead.

Secure Smart Home Gateway Capacitive Touch Remote Control

Use Scenario: Zigbee-to-Matter bridge aggregating BLE/Zigbee devices, enforcing local policy before cloud sync.

IC Role / Device Role / Timing Role: Trusted execution environment: M0+ enforces secure boot and runtime attestation; M4 hosts Matter SDK and TLS stack.

Use Value: Eight protection contexts isolate Matter stack, Zigbee NCP, and OTA updater; eFuse array stores unique device identity and root keys.

Use Scenario: Ultra-thin TV remote with gesture-enabled touchpad and proximity wake, powered by CR2032 cell.

IC Role / Device Role / Timing Role: Low-power HMI controller: CAPSENSE™ CSD detects hover/swipe; Smart I/O wakes M0+ only on valid gesture pattern.

Use Value: 200 nA Hibernate mode with 64-byte backup RAM preserves last-touch state; built-in temperature sensor compensates for CSD drift across ambient range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C6247LQI-D52 Same die revision (1/2), identical core/peripheral set, but 124-ball BGA package and no USB FS interface Lacks USB device capability; suited for wireless-only nodes where board space permits BGA and USB is unnecessary Select when USB connectivity is not required and BGA assembly infrastructure is available
RP2040 Dual-core Arm Cortex-M0+, no M4F; no hardware crypto accelerator; no CAPSENSE™; 264-KB SRAM, 2-MB flash Lower security assurance; requires software crypto; lacks analog front-end integration for capacitive sensing or precision ADC Choose for cost-sensitive, non-security-critical applications where community tooling outweighs hardware trust anchors

Compared with CY8C6247LQI-D52, this part adds USB FS and uses WLCSP for miniaturization; versus RP2040, it delivers certified secure boot, hardware-accelerated crypto, and production-grade analog integration - critical for certified IoT endpoints.

Availability

CY8C624ALQI-S2D42 is available at Aetrix Electronics and suitable for smart wearables, industrial wireless sensors, secure home gateways, and capacitive touch remotes requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for CY8C624ALQI-S2D42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

The PSOC™ 62 product line targets secure, ultra-low-power IoT endpoints - integrating dual-core processing, hardware security, and configurable analog/digital peripherals into a single chip for edge intelligence without external co-processors.

FAQ

What is the maximum operating frequency of each CPU core in the CY8C624ALQI-S2D42?

The CY8C624ALQI-S2D42 features a 150-MHz Arm® Cortex®-M4F core and a 100-MHz Cortex®-M0+ core. Both operate at their rated frequencies under 1.1-V core supply; at 0.9-V core, maximum frequencies are reduced to maintain timing closure and power efficiency, though exact derated values are specified in the "CPU Current and Transition Times" section of the datasheet (Rev. *S, Section 6.2.2).

Does this device support over-the-air (OTA) firmware updates?

Yes. The CY8C624ALQI-S2D42 supports robust OTA updates via its RWW flash architecture, dual-bank boot scheme, and hardware-assisted cryptographic verification. The ROM-based Secured Boot validates signature and hash of new images before execution, and the SFlash region stores immutable boot metadata required for rollback protection and version enforcement.

Can the CAPSENSE™ subsystem operate during Deep Sleep mode?

Yes. CAPSENSE™ CSD can run autonomously in Deep Sleep mode using the low-power ILO clock source. The subsystem supports automatic scan triggering, result buffering in dedicated registers, and interrupt generation upon threshold crossing - enabling wake-on-touch without CPU intervention.

What debug interfaces are supported, and can they be disabled for security?

The device supports SWD (2-pin) and JTAG (5-pin) interfaces via dedicated pins. All debug and test ingress paths - including SWD, JTAG, and serial wire viewer - can be permanently disabled via eFuse programming after production, preventing unauthorized access to memory or firmware during field operation.

CY8C624ALQI-S2D42 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C624ALQI-S2D42 FAQ

1.How can I place an order for CY8C624ALQI-S2D42 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C624ALQI-S2D42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C624ALQI-S2D42 reliable?

The price and inventory of CY8C624ALQI-S2D42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C624ALQI-S2D42 is usually 5 days.

3.What payment methods are accepted for CY8C624ALQI-S2D42?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C624ALQI-S2D42 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C624ALQI-S2D42?

CY8C624ALQI-S2D42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C624ALQI-S2D42 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C624ALQI-S2D42?

For technical support, including CY8C624ALQI-S2D42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C624ALQI-S2D42 requirements.

6.How does Aetrix verify that CY8C624ALQI-S2D42 is sourced from the original manufacturer or authorized distributors?

All CY8C624ALQI-S2D42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C624ALQI-S2D42 meets industry standards.

7.What is the process for return or replacement of CY8C624ALQI-S2D42?

All CY8C624ALQI-S2D42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C624ALQI-S2D42, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C624ALQI-S2D42 part is unused and in its original packaging.

Return procedure for CY8C624ALQI-S2D42:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C624ALQI-S2D42 Tags

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