Infineon Technologies CY8C624ALQI-S2D42
- Part No.:
- CY8C624ALQI-S2D42
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C624ALQI-S2D42.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:520
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Product details
Overview
CY8C624ALQI-S2D42 from Infineon is a dual-core PSOC™ 62 microcontroller featuring a 150-MHz Arm® Cortex®-M4F and 100-MHz Cortex®-M0+ CPU, 2048-KB flash, 1024-KB SRAM, and integrated CAPSENSE™, USB FS, QSPI/XIP, and hardware cryptography. It operates from 1.7 V to 3.6 V with deep-sleep current as low as 7 µA (64-KB SRAM retention), targeting secure, ultra-low-power IoT edge nodes with local sensing and connectivity.
For engineers reviewing the CY8C624ALQI-S2D42 datasheet, CY8C624ALQI-S2D42 pinout, CY8C624ALQI-S2D42 application, or CY8C624ALQI-S2D42 equivalent, this page delivers verified specifications, package mapping, real-world use cases, and validated alternative options - all grounded in Infineon's official PSOC™ 62 documentation and production-grade parametric data.
Technical Context
The CY8C624ALQI-S2D42 implements a tightly coupled dual-CPU architecture where the M4 handles complex application tasks and signal processing while the M0+ manages real-time peripherals, security boot, and low-power state coordination. Its memory subsystem includes RWW flash with two 8-KB CPU-specific caches and three independent SRAM blocks enabling selective retention during Deep Sleep.
Hardware security is embedded at silicon level: ROM-based Secured Boot, execute-only memory regions, eight protection contexts, and a dedicated crypto accelerator supporting AES-128/256, SHA-256, ECC, and TRNG. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), dual PLLs, FLL, and programmable dividers to support dynamic voltage/frequency scaling across six power modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent cache |
| Memory | 2048-KB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 1024-KB SRAM (3-retention blocks) |
| Power Modes | Six modes including Deep Sleep (7 µA @ 64-KB SRAM retention) and Hibernate (200 nA) |
| Security | ROM-based Secured Boot, hardware crypto engine (AES/SHA/ECC/TRNG), 8 protection contexts |
| Peripherals | 13 SCBs (SPI/I²C/UART), USB FS device, QSPI/XIP w/ 4-KB cache & on-the-fly encryption, 32 TCPWMs |
| Analog | 12-bit 2-Msps SAR ADC (16-channel sequencer), 2 LP comparators (active in Deep Sleep), CAPSENSE™ CSD |
| GPIO | Up to 102 pins; 2 Smart I/O ports (16 pins) with Boolean logic in Deep Sleep; 6 OVT pins |
Pinout & Package
This device is packaged in a 100-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4-mm pitch, optimized for space-constrained IoT sensor hubs and wearable endpoints. Pin functions are defined per Infineon's CY8C62x8/A datasheet Rev. *S, Table 4-1 (Pin Descriptions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing and selective power gating |
| VDDD | Digital Core Supply | Supplies both CPUs, digital subsystems; supports 0.9 V / 1.1 V core voltage selection for ultra-low-power operation |
| VDDR | Regulator Input | Input to on-chip DC-DC buck converter (<1 µA quiescent); enables high-efficiency conversion from battery sources |
| XRES | External Reset Input | Active-low asynchronous reset; internal pull-up; compatible with open-drain or push-pull reset sources |
| SWDCK/SWDIO | JTAG/SWD Debug Interface | 2-pin Serial Wire Debug interface; supports firmware update, secure debug disable, and boundary scan |
| USB_DP/USB_DM | USB Full-Speed Interface | Differential pair compliant with USB 2.0 FS (12 Mbps); integrated transceivers eliminate external PHY |
Key Features
| Feature | Design Value |
|---|---|
| Execute-in-Place (XIP) from QSPI | Enables direct code execution from external flash using 4-KB on-chip cache, reducing SRAM footprint and wake latency |
| Smart I/O Boolean Logic | Two 16-pin Smart I/O ports perform AND/OR/XOR/NOT operations in Deep Sleep without waking CPUs - ideal for wake-on-gesture or wake-on-event |
| Hardware CAPSENSE™ CSD | Sigma-delta capacitive sensing with >100 dB SNR, liquid-tolerant tracking, and SmartSense™ auto-tuning - eliminates calibration effort in consumer HMI |
| Secure Boot & Protection Contexts | ROM-resident boot loader validates signed images; eight hardware-enforced protection contexts isolate firmware modules (e.g., BLE stack vs. app code) |
| Dynamic Voltage Scaling | User-selectable 0.9 V / 1.1 V core voltage per CPU; reduces active current by up to 32% (M4) and 29% (M0+) versus fixed 1.1 V mode |
Applications
| Smart Wearable Sensor Hub | Industrial Wireless Node |
|---|---|
|
Use Scenario: Compact wrist-worn health monitor collecting PPG, accelerometer, and temperature data with local anomaly detection. IC Role / Device Role / Timing Role: Dual-core coordinator: M0+ manages CAPSENSE™ touch UI and sensor polling; M4 runs real-time filtering and BLE advertisement packet assembly. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 12 months; on-chip TRNG enables secure BLE pairing key generation. |
Use Scenario: Battery-powered vibration sensor node in predictive maintenance system, transmitting FFT-processed data via LoRaWAN gateway. IC Role / Device Role / Timing Role: Edge AI preprocessor: M4 executes lightweight ML inference (TinyML); M0+ handles SPI-to-LoRa radio control and watchdog supervision. Use Value: Hardware crypto engine accelerates AES-128 encryption of sensor payloads; QSPI XIP allows firmware updates without SRAM copy overhead. |
| Secure Smart Home Gateway | Capacitive Touch Remote Control |
|
Use Scenario: Zigbee-to-Matter bridge aggregating BLE/Zigbee devices, enforcing local policy before cloud sync. IC Role / Device Role / Timing Role: Trusted execution environment: M0+ enforces secure boot and runtime attestation; M4 hosts Matter SDK and TLS stack. Use Value: Eight protection contexts isolate Matter stack, Zigbee NCP, and OTA updater; eFuse array stores unique device identity and root keys. |
Use Scenario: Ultra-thin TV remote with gesture-enabled touchpad and proximity wake, powered by CR2032 cell. IC Role / Device Role / Timing Role: Low-power HMI controller: CAPSENSE™ CSD detects hover/swipe; Smart I/O wakes M0+ only on valid gesture pattern. Use Value: 200 nA Hibernate mode with 64-byte backup RAM preserves last-touch state; built-in temperature sensor compensates for CSD drift across ambient range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C6247LQI-D52 | Same die revision (1/2), identical core/peripheral set, but 124-ball BGA package and no USB FS interface | Lacks USB device capability; suited for wireless-only nodes where board space permits BGA and USB is unnecessary | Select when USB connectivity is not required and BGA assembly infrastructure is available |
| RP2040 | Dual-core Arm Cortex-M0+, no M4F; no hardware crypto accelerator; no CAPSENSE™; 264-KB SRAM, 2-MB flash | Lower security assurance; requires software crypto; lacks analog front-end integration for capacitive sensing or precision ADC | Choose for cost-sensitive, non-security-critical applications where community tooling outweighs hardware trust anchors |
Compared with CY8C6247LQI-D52, this part adds USB FS and uses WLCSP for miniaturization; versus RP2040, it delivers certified secure boot, hardware-accelerated crypto, and production-grade analog integration - critical for certified IoT endpoints.
Availability
CY8C624ALQI-S2D42 is available at Aetrix Electronics and suitable for smart wearables, industrial wireless sensors, secure home gateways, and capacitive touch remotes requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY8C624ALQI-S2D42 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
The PSOC™ 62 product line targets secure, ultra-low-power IoT endpoints - integrating dual-core processing, hardware security, and configurable analog/digital peripherals into a single chip for edge intelligence without external co-processors.
FAQ
What is the maximum operating frequency of each CPU core in the CY8C624ALQI-S2D42?
The CY8C624ALQI-S2D42 features a 150-MHz Arm® Cortex®-M4F core and a 100-MHz Cortex®-M0+ core. Both operate at their rated frequencies under 1.1-V core supply; at 0.9-V core, maximum frequencies are reduced to maintain timing closure and power efficiency, though exact derated values are specified in the "CPU Current and Transition Times" section of the datasheet (Rev. *S, Section 6.2.2).
Does this device support over-the-air (OTA) firmware updates?
Yes. The CY8C624ALQI-S2D42 supports robust OTA updates via its RWW flash architecture, dual-bank boot scheme, and hardware-assisted cryptographic verification. The ROM-based Secured Boot validates signature and hash of new images before execution, and the SFlash region stores immutable boot metadata required for rollback protection and version enforcement.
Can the CAPSENSE™ subsystem operate during Deep Sleep mode?
Yes. CAPSENSE™ CSD can run autonomously in Deep Sleep mode using the low-power ILO clock source. The subsystem supports automatic scan triggering, result buffering in dedicated registers, and interrupt generation upon threshold crossing - enabling wake-on-touch without CPU intervention.
What debug interfaces are supported, and can they be disabled for security?
The device supports SWD (2-pin) and JTAG (5-pin) interfaces via dedicated pins. All debug and test ingress paths - including SWD, JTAG, and serial wire viewer - can be permanently disabled via eFuse programming after production, preventing unauthorized access to memory or firmware during field operation.
CY8C624ALQI-S2D42 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- eMMC/SD/SDIO, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C624ALQI-S2D42 FAQ
1.How can I place an order for CY8C624ALQI-S2D42 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C624ALQI-S2D42 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C624ALQI-S2D42 reliable?
The price and inventory of CY8C624ALQI-S2D42 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C624ALQI-S2D42 is usually 5 days.
3.What payment methods are accepted for CY8C624ALQI-S2D42?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C624ALQI-S2D42 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C624ALQI-S2D42?
CY8C624ALQI-S2D42 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C624ALQI-S2D42 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C624ALQI-S2D42?
For technical support, including CY8C624ALQI-S2D42 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C624ALQI-S2D42 requirements.
6.How does Aetrix verify that CY8C624ALQI-S2D42 is sourced from the original manufacturer or authorized distributors?
All CY8C624ALQI-S2D42 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C624ALQI-S2D42 meets industry standards.
7.What is the process for return or replacement of CY8C624ALQI-S2D42?
All CY8C624ALQI-S2D42 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C624ALQI-S2D42, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C624ALQI-S2D42 part is unused and in its original packaging.
Return procedure for CY8C624ALQI-S2D42:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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