Infineon Technologies CY8C6316BZI-BLF03

Overview

CY8C6316BZI-BLF03 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces. Used in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.

For engineers reviewing the CY8C6316BZI-BLF03 datasheet, CY8C6316BZI-BLF03 pinout, CY8C6316BZI-BLF03 application, or CY8C6316BZI-BLF03 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE 5.0 RF performance (–95 dBm RX sensitivity, 4 dBm TX), QSPI XIP support, and PSoC™ 63 platform security features including ROM-based secure boot and eight protection contexts.

Technical Context

The CY8C6316BZI-BLF03 implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages Bluetooth LE Link Layer operations and low-power state coordination. Its Bluetooth subsystem includes a 2.4-GHz RF transceiver with digital PHY, hardware-accelerated AES/SHA/TRNG, and simultaneous four-connection support.

Power management is enabled by six discrete power modes, an on-chip SIMO buck converter (<1 µA quiescent current), and independent voltage scaling (0.9 V / 1.1 V) per CPU core. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), crystal oscillators (16–35 MHz & 32 kHz), FLL, and PLL for flexible peripheral timing.

Key Specifications

Pinout & Package

This device is packaged in a 104-ball WLCSP (Wafer-Level Chip Scale Package) with 0.4-mm pitch, footprint code BZI, and thermal pad exposed on bottom. Pin assignment follows Infineon's PSoC™ 63 104-WLCSP mechanical drawing and electrical pinout table (Document 002-18787 Rev. *R, Section 4).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Bluetooth LE MCU applications.

Compared with Nordic nRF5340 and Dialog DA1469x, CY8C6316BZI-BLF03 uniquely delivers simultaneous dual-core voltage scaling, integrated SIMO buck, hardware CAPSENSE™, and programmable analog/digital blocks-enabling consolidated system-on-chip designs without external signal conditioning or power management ICs.

Availability

CY8C6316BZI-BLF03 is available at Aetrix Electronics and suitable for smart wearables, industrial BLE gateways, home automation controllers, and medical patch monitors requiring stable component supply, long-term lifecycle assurance, and qualified automotive/industrial grade sourcing.

Supply support for CY8C6316BZI-BLF03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensors, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

CY8C6316BZI-BLF03 belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power IoT endpoints combining Bluetooth LE 5.0 connectivity with reconfigurable analog and digital hardware resources.

FAQ

What is the maximum operating frequency of each CPU core in CY8C6316BZI-BLF03?

The Cortex-M4F core operates up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection unit. The Cortex-M0+ core runs at up to 100 MHz with single-cycle multiply and MPU. Both cores support dynamic voltage scaling between 0.9 V and 1.1 V, adjusting frequency limits accordingly per supply voltage.

Does CY8C6316BZI-BLF03 support external QSPI flash execution (XIP)?

Yes-it includes a Serial Memory Interface (SMIF) that supports Execute-In-Place from external quad SPI flash with on-the-fly AES-128 decryption, 4-KB cache, and support for single/dual/quad/octal modes up to 640 Mbps. XIP eliminates boot latency and reduces SRAM footprint for large firmware images.

How does the integrated SIMO buck converter improve power efficiency?

The on-chip Single-In Multiple-Out DC-DC buck converter delivers multiple regulated voltages (e.g., VDDD, VDDA, VDDIO) from a single input rail with <1 µA quiescent current. It enables efficient conversion across wide load ranges and eliminates need for external PMICs-reducing BOM count and improving Deep Sleep current to 7 µA with 64-KB SRAM retention.

Can CAPSENSE™ operate during Deep Sleep mode?

Yes-CAPSENSE™ can run autonomously in Deep Sleep mode using the low-power comparators and dedicated hardware sequencer. It supports self- and mutual-capacitance sensing, automatic SmartSense tuning, and wake-on-touch events without waking the CPU, maintaining system current below 10 µA during active sensing intervals.