My Inquiry
My Account
Infineon Technologies CY8C6316BZI-BLF03T
- Part No.:
- CY8C6316BZI-BLF03T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6316BZI-BLF03T.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 116BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,718
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6316BZI-BLF03T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ capacitive sensing. Used in battery-powered IoT edge nodes requiring wireless connectivity and real-time sensor processing.
For engineers reviewing the CY8C6316BZI-BLF03T datasheet, CY8C6316BZI-BLF03T pinout, CY8C6316BZI-BLF03T application, or CY8C6316BZI-BLF03T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles compute-intensive tasks (e.g., signal processing, BLE stack execution) while the Cortex-M0+ manages low-power peripheral orchestration and real-time control. Both cores share memory-mapped peripherals via a high-bandwidth interconnect, with IPC and DMA enabling zero-copy data movement between domains.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and hardware-accelerated Link Layer engine supporting master/slave roles, 2 Mbps data rate, –95 dBm RX sensitivity, and programmable TX output up to +4 dBm - all operating independently of CPU intervention during active connection states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| BLE Radio | Bluetooth 5.0-compliant; –95 dBm RX sensitivity, +4 dBm max TX power, 4 concurrent connections |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 @ 0.9 V core voltage |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (SPI/I2C/UART configurable) |
| Package | 104-pin WLCSP (BZI), 0.4-mm pitch, 5.2 × 5.2 mm body, 0.35-mm height |
Pinout & Package
CY8C6316BZI-BLF03T is housed in a 104-ball Wafer-Level Chip-Scale Package (WLCSP, BZI suffix), optimized for space-constrained IoT endpoints. Ball pitch is 0.4 mm; thermal pad is exposed on underside for enhanced heat dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank; enable mixed-voltage interface (e.g., 1.8-V sensors + 3.3-V radios) |
| VDDD/VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V rails decoupled for noise isolation between digital logic and precision analog circuits |
| XTAL_IN/XTAL_OUT | External Crystal Oscillator Interface | Supports 32 kHz watch crystal or 16–35 MHz main crystal; enables precise timing for BLE advertising intervals and RTC |
| ANT | RF Antenna Output | 50-Ω matched differential RF output; requires external matching network and antenna tuning for optimal BLE range |
| SWDIO/SWCLK | ARM Serial Wire Debug Interface | Two-pin debug port supporting programming, real-time trace, and secure debug disable via eFuse lock |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIOs | Up to 84 pins configurable as digital I/O, analog input, CAPSENSE™ electrodes, or Smart I/O™ Boolean logic units |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with ROM Root of Trust | Immutable first-stage bootloader enforces cryptographic signature verification before loading application firmware |
| Hardware Crypto Accelerator | Offloads AES-128/256, SHA-256, ECC-256, and TRNG generation - reduces M4 CPU load by >90% vs. software-only implementation |
| Smart I/O™ in Deep Sleep | 16 GPIOs retain Boolean logic (AND/OR/XOR) and state retention during 7-µA Deep Sleep - enables wake-on-sensor-event without CPU wake |
| QSPI SMIF with XIP + Encryption | Execute code directly from external flash at up to 640 Mbps; on-the-fly AES-128 decryption prevents firmware extraction from off-chip storage |
| CAPSENSE™ with SmartSense | Self-tuning capacitive sensing engine delivers >100:1 SNR and liquid-tolerant touch detection - eliminates manual calibration across temperature/humidity |
Applications
| Smart Home Sensor Hub | Wireless Medical Wearable |
|---|---|
Use Scenario: Compact battery-powered hub aggregating temperature, humidity, motion, and ambient light data from multiple sensors, transmitting via BLE to gateway. IC Role / Device Role / Timing Role: Dual-core orchestrator: M0+ handles CAPSENSE™ scan, ADC sampling, and BLE advertising; M4 processes sensor fusion and encrypts payloads. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 2 years; Smart I/O™ wakes system only on valid motion event. | Use Scenario: Chest-worn ECG/PPG monitor streaming real-time biometrics to smartphone with medical-grade data integrity. IC Role / Device Role / Timing Role: Real-time signal processor: SAR ADC samples analog front-end at 1 Msps; M4 runs filtering algorithms; BLE subsystem maintains stable 2-Mbps connection. Use Value: –95 dBm RX sensitivity ensures robust link at 10 m through clothing; hardware crypto secures HIPAA-compliant data transmission. |
| Industrial Predictive Maintenance Node | Asset Tracking Beacon |
Use Scenario: Vibration and temperature monitoring node mounted on rotating machinery, logging FFT-based anomaly signatures locally and reporting via BLE. IC Role / Device Role / Timing Role: Edge analytics engine: M4 executes FFT and threshold detection; UDBs implement custom timer-triggered sampling windows; QSPI XIP loads firmware updates over air. Use Value: On-chip 1-MB flash stores weeks of compressed vibration logs; dual-core isolation prevents BLE stack latency from disrupting time-critical sampling. | Use Scenario: GPS-denied indoor asset tracker using BLE RSSI triangulation and motion-triggered location pings. IC Role / Device Role / Timing Role: Low-power locator: M0+ monitors accelerometer and BLE RSSI; M4 computes proximity zones; Smart I/O™ triggers wake on movement. Use Value: 22 µA/MHz M4 efficiency enables 10-second motion-triggered BLE broadcast every 5 minutes on CR2032; 4-dB RSSI resolution improves zone accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core (M33/M33), no integrated SMIF/QSPI XIP; 512-KB flash; lacks CAPSENSE™ and programmable analog | Better for pure BLE mesh or Thread/Zigbee coexistence; weaker analog integration limits sensor-hub use | Select when prioritizing Arm TrustZone security over analog flexibility and external flash execution |
| Dialog DA1469x | Single M33 core, 352-KB RAM, no dedicated M0+ companion core; BLE 5.2, higher TX power (+8 dBm) | Superior RF range in open environments; lacks dual-CPU power partitioning for deterministic low-power operation | Select for long-range beaconing where CPU offload and SRAM retention are secondary to RF link budget |
Compared with nRF5340 and DA1469x, CY8C6316BZI-BLF03T uniquely combines dual-core power partitioning, on-die programmable analog, and QSPI XIP with encryption - making it optimal for resource-constrained sensor hubs requiring local processing and secure firmware updates.
Availability
CY8C6316BZI-BLF03T is available at Aetrix Electronics and suitable for smart home sensor hubs, wireless medical wearables, industrial predictive maintenance nodes, and asset tracking beacons requiring stable component supply and long-term lifecycle support.
Supply support for CY8C6316BZI-BLF03T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
CY8C6316BZI-BLF03T belongs to the PSoC™ 63 product line - designed specifically for ultra-low-power, secure, and sensor-rich IoT endpoints requiring integrated BLE, flexible analog/digital reconfigurability, and robust firmware protection.
FAQ
What is the maximum supported external QSPI flash size and interface speed?
CY8C6316BZI-BLF03T supports QSPI flash up to 2 GB via its Serial Memory Interface (SMIF), with configurable bus widths (single/dual/quad/dual-quad/octal) and clock frequencies up to 160 MHz. At octal mode, peak throughput reaches 640 Mbps, enabling fast XIP execution and encrypted firmware updates without CPU overhead.
Does the device support USB device functionality, and what are the electrical requirements?
No - CY8C6316BZI-BLF03T does not include a USB Full-Speed interface. The BZI package variant (104-WLCSP) omits USB; only select 116-BGA and 124-BGA packages in the PSoC™ 63 family integrate USB. This part relies on BLE or SCB-based UART/SPI for host communication.
How is secure firmware update implemented without external secure element?
Secure firmware updates leverage on-chip hardware: ROM-based Secure Boot validates signed images using ECDSA-P256; the cryptography accelerator performs AES-128 decryption of encrypted OTA payloads; and the Protection Context unit isolates update routines in execute-only memory regions - eliminating need for external secure elements.
Can CAPSENSE™ operate during Deep Sleep, and what is the minimum current draw for that mode?
Yes - CAPSENSE™ can scan electrodes in Deep Sleep using the low-power comparators and dedicated sequencer, drawing as low as 1.8 µA total (including comparator bias and IDAC). This enables touch wake-up with full electrode coverage while maintaining overall system current at ≤7 µA with 64-KB SRAM retention.
CY8C6316BZI-BLF03T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6316BZI-BLF03T FAQ
1.How can I place an order for CY8C6316BZI-BLF03T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6316BZI-BLF03T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6316BZI-BLF03T reliable?
The price and inventory of CY8C6316BZI-BLF03T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6316BZI-BLF03T is usually 5 days.
3.What payment methods are accepted for CY8C6316BZI-BLF03T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6316BZI-BLF03T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6316BZI-BLF03T?
CY8C6316BZI-BLF03T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6316BZI-BLF03T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6316BZI-BLF03T?
For technical support, including CY8C6316BZI-BLF03T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6316BZI-BLF03T requirements.
6.How does Aetrix verify that CY8C6316BZI-BLF03T is sourced from the original manufacturer or authorized distributors?
All CY8C6316BZI-BLF03T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6316BZI-BLF03T meets industry standards.
7.What is the process for return or replacement of CY8C6316BZI-BLF03T?
All CY8C6316BZI-BLF03T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6316BZI-BLF03T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6316BZI-BLF03T part is unused and in its original packaging.
Return procedure for CY8C6316BZI-BLF03T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6316BZI-BLF03T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
