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Infineon Technologies CY8C6316BZI-BLF04
- Part No.:
- CY8C6316BZI-BLF04
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6316BZI-BLF04.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,074
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Product details
Overview
CY8C6316BZI-BLF04 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, supports Deep Sleep mode at 7 µA (64-KB SRAM retention), and delivers up to 4 dBm TX power for secure IoT edge nodes requiring BLE connectivity and local processing.
For engineers reviewing the CY8C6316BZI-BLF04 datasheet, CY8C6316BZI-BLF04 pinout, CY8C6316BZI-BLF04 application, or CY8C6316BZI-BLF04 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE link-layer support for four simultaneous connections, QSPI XIP with hardware encryption, and CAPSENSE™ for robust touch interfaces in battery-constrained designs.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power background operations via IPC and shared memory. Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and Link Layer engine-enabling master/slave operation, 2 Mbps data rate, and –95 dBm RX sensitivity.
Power management is orchestrated across six modes using an on-chip SIMO buck converter (<1 µA quiescent current) and backup domain with RTC. Clocking combines IMO (8 MHz ±2%), ILO (32 kHz), crystal oscillators (16–35 MHz), FLL, and PLL to feed CPU cores, peripherals, and BLE timing with fractional dividers for precise peripheral clock tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| BLE Compliance | Bluetooth® 5.0 certified radio with 2 Mbps PHY, –95 dBm RX sensitivity, and 4 dBm programmable TX output |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), 9 SCBs (SPI/I²C/UART configurable), Smart I/O for Boolean logic in Deep Sleep |
| Package | 104-pin WLCSP (BZI), 0.4-mm pitch, 5.2 × 5.2 mm body, exposed thermal pad |
Pinout & Package
CY8C6316BZI-BLF04 is housed in a 104-ball Wafer-Level Chip-Scale Package (WLCSP, BZI suffix), optimized for space-constrained IoT endpoints. The package features an exposed thermal pad and 0.4-mm ball pitch, supporting high-density PCB layouts and efficient thermal dissipation in compact wearable and sensor modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Programmable GPIO / Smart I/O | Support Boolean logic in Deep Sleep; configurable drive strength, slew rate, and OVT capability on select pins |
| SWDCLK / SWDIO | JTAG/SWD Debug Interface | Two-pin debug access; SWDIO supports bidirectional programming and real-time trace during development |
| VDDIO0 / VDDIO1 | I/O Power Rails | Independent 1.7–3.6 V supplies per port group; enable mixed-voltage interfacing with external sensors or displays |
| VDDD / VDDA | Digital & Analog Core Supplies | Separate 1.7–3.6 V domains decoupled for noise isolation between CPU, BLE RF, and precision analog blocks |
| ANT / RF_IN / RF_OUT | BLE RF Interface | Differential 50-Ω antenna interface; internal matching eliminates external balun in most 2.4-GHz PCB antenna designs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enables dynamic trade-off between performance and sub-µA sleep leakage |
| Hardware Crypto Accelerator | Offloads AES-128/256, SHA-256, ECC, and TRNG generation-reducing M4 firmware overhead by >70% in secure boot and OTA update flows |
| QSPI SMIF with XIP + Encryption | Enables direct code execution from external flash while applying AES-128 decryption on-the-fly-eliminating need for RAM-based image decompression |
| CAPSENSE™ SmartSense | Auto-tunes sensor parameters (IDAC, scan speed, averaging) in real time to maintain SNR >100:1 under moisture, ESD, or temperature drift |
| BLE Link Layer Engine | Dedicated hardware handles advertising, connection management, and packet scheduling-freeing M0+ for application logic without RTOS jitter |
Applications
| Smart Wearable Sensor Hub | BLE Mesh Node Controller |
|---|---|
Use Scenario: Compact wrist-worn health monitor aggregating PPG, accelerometer, and temperature data with local preprocessing and encrypted BLE broadcast. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion on M4 while M0+ runs BLE stack; RTC and Deep Sleep mode coordinate 15-s wake-up intervals. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across hours of motionless periods, extending coin-cell life beyond 6 months. | Use Scenario: Battery-powered industrial mesh node relaying environmental readings (temp/humidity/CO₂) across multi-hop BLE networks with self-healing routing. IC Role / Device Role / Timing Role: M0+ manages BLE mesh provisioning and relay forwarding; M4 validates packet integrity using hardware crypto before retransmission. Use Value: Hardware-accelerated AES-128 and ECC signing cuts per-packet latency to <120 µs-critical for deterministic mesh timing budgets. |
| Capacitive Touch Remote Control | Secure OTA Update Endpoint |
Use Scenario: Ultra-thin TV remote with gesture-capable touchpad, button array, and proximity wake-up-no mechanical switches. IC Role / Device Role / Timing Role: CAPSENSE™ subsystem detects multi-finger swipes and hover; Smart I/O processes gestures in Deep Sleep without waking CPUs. Use Value: Smart I/O Boolean logic reduces average current to 1.8 µA during idle-enabling 2-year CR2032 battery life with daily 5-min usage. | Use Scenario: Medical sensor patch receiving signed firmware updates over BLE while maintaining HIPAA-compliant data isolation. IC Role / Device Role / Timing Role: ROM-based Secure Boot verifies signature chain; execute-only memory protects decryption keys during OTA payload decryption. Use Value: Eight Protection Contexts enforce strict memory partitioning-preventing compromised BLE stack from accessing patient data buffers or crypto keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core Arm Cortex-M33/M33 (no M4F FP unit); 512-KB flash; no integrated SIMO buck; requires external DC-DC for ultra-low-power operation | Lacks hardware CAPSENSE™ and programmable analog; relies on external ADC/DAC for sensor front-end integration | Preferred when Arm TrustZone security and Thread/Matter coexistence are prioritized over analog flexibility and lowest Deep Sleep current |
| Dialog DA1469x | Single Cortex-M33 core with dedicated BLE processor; 2-MB flash; proprietary PMU with 1.5-µA shutdown but no Deep Sleep SRAM retention option below 16 KB | No UDBs or Smart I/O; limited GPIO configurability and no hardware-accelerated crypto beyond AES | Better suited for pure BLE beaconing or simple sensor-to-cloud use cases where dual-CPU task partitioning isn't required |
Compared with nRF5340 and DA1469x, CY8C6316BZI-BLF04 uniquely combines M4F floating-point performance, 64-KB Deep Sleep SRAM retention, integrated SIMO buck, and CAPSENSE™-making it optimal for resource-constrained edge devices needing local sensor fusion, touch UI, and secure BLE connectivity without external analog or power components.
Availability
CY8C6316BZI-BLF04 is available at Aetrix Electronics and suitable for smart wearables, BLE mesh nodes, capacitive touch remotes, and secure OTA update endpoints requiring stable component supply across long-lifecycle industrial and medical programs.
Supply support for CY8C6316BZI-BLF04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
The PSoC™ 63 product line targets secure, ultra-low-power wireless edge devices-integrating dual-core processing, BLE 5.0, programmable analog/digital fabric, and hardware crypto to eliminate discrete component count in compact IoT endpoints.
FAQ
Does CY8C6316BZI-BLF04 support USB Full-Speed device interface?
No. This specific variant (BZI-BLF04) belongs to the non-USB PSoC™ 63 family. It uses a 104-ball WLCSP package without USB PHY pins. USB Full-Speed capability is only available on 116-BGA and 124-BGA packages within the CY8C63x6/63x7 series, as confirmed in the official Infineon datasheet revision *R section "Packages".
What is the maximum allowed operating temperature for CY8C6316BZI-BLF04?
The CY8C6316BZI-BLF04 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is specified in Section 6.2.2 ("Device-level specifications") of the Infineon datasheet 002-18787 Rev. *R, where junction temperature limits and thermal derating curves are defined for all power modes including Deep Sleep and active BLE transmission.
Can the on-chip SIMO buck converter power both VDDD and VDDA rails simultaneously?
Yes. The SIMO buck supports independent output regulation for VDDD (digital core) and VDDA (analog core) from a single input supply (VCC), with separate feedback paths and programmable voltage setpoints. This is documented in Section 3.2.1 ("Power system") and Figure 3-1 of the datasheet, enabling noise-isolated analog operation without external LDOs.
Is CAPSENSE™ supported in Deep Sleep mode on CY8C6316BZI-BLF04?
No. CAPSENSE™ requires active CPU clocks and analog reference voltage; it cannot operate in Deep Sleep. However, Smart I/O ports can preprocess touch events (e.g., threshold detection on GPIO) while CPUs are asleep, then wake the M0+ only upon valid gesture-reducing average power versus full CAPSENSE™ polling.
CY8C6316BZI-BLF04 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 84
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6316BZI-BLF04 FAQ
1.How can I place an order for CY8C6316BZI-BLF04 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6316BZI-BLF04 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6316BZI-BLF04 reliable?
The price and inventory of CY8C6316BZI-BLF04 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6316BZI-BLF04 is usually 5 days.
3.What payment methods are accepted for CY8C6316BZI-BLF04?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6316BZI-BLF04 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6316BZI-BLF04?
CY8C6316BZI-BLF04 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6316BZI-BLF04 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6316BZI-BLF04?
For technical support, including CY8C6316BZI-BLF04 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6316BZI-BLF04 requirements.
6.How does Aetrix verify that CY8C6316BZI-BLF04 is sourced from the original manufacturer or authorized distributors?
All CY8C6316BZI-BLF04 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6316BZI-BLF04 meets industry standards.
7.What is the process for return or replacement of CY8C6316BZI-BLF04?
All CY8C6316BZI-BLF04 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6316BZI-BLF04, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6316BZI-BLF04 part is unused and in its original packaging.
Return procedure for CY8C6316BZI-BLF04:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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