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Infineon Technologies CY8C6316BZI-BLF53
- Part No.:
- CY8C6316BZI-BLF53
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6316BZI-BLF53.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 116BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,368
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Product details
Overview
CY8C6316BZI-BLF53 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 63 microcontroller with integrated Bluetooth® LE 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports 2 Mbps BLE data rate with –95 dBm RX sensitivity - deployed in battery-powered IoT edge nodes requiring secure wireless sensor aggregation.
For engineers reviewing the CY8C6316BZI-BLF53 datasheet, CY8C6316BZI-BLF53 pinout, CY8C6316BZI-BLF53 application, or CY8C6316BZI-BLF53 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE link-layer concurrency (4 simultaneous connections), QSPI XIP with hardware encryption, CAPSENSE™ liquid-tolerant touch, and ROM-based Secure Boot for firmware integrity.
Technical Context
The device integrates two tightly coupled Arm cores: a 150-MHz Cortex-M4F with FPU and MPU for real-time signal processing, and a 100-MHz Cortex-M0+ for low-power BLE protocol stack execution and system management. Inter-processor communication (IPC) and shared memory enable deterministic task partitioning between domains.
Its Bluetooth subsystem includes a 2.4-GHz RF transceiver with programmable TX output up to +4 dBm, digital PHY, and hardware-accelerated Link Layer supporting master/slave roles and four concurrent connections - all operating independently of the application CPUs to minimize latency and power overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| BLE Compliance | Bluetooth® LE 5.0; supports 2 Mbps PHY, four simultaneous connections, –95 dBm RX sensitivity |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (8 configurable + 1 Deep Sleep) |
| Security | ROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES/SHA/RSA/TRNG) |
Pinout & Package
This device is packaged in a 104-ball Wafer-Level Chip-Scale Package (WLCSP), 3.2 mm × 3.2 mm, 0.4 mm pitch, with 84 user-programmable GPIOs including six overvoltage-tolerant (OVT) pins and two Smart I/O™ ports.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / SWDIO / SWCLK | Primary debug interface pins; configurable as general-purpose I/O with programmable drive strength and slew rate |
| P12[0]–P12[3] | BLE Antenna Interface | Differential RF output (RF_P/RF_N); requires 50-Ω matching network to antenna or balun |
| VDDIO0–VDDIO3 | I/O Power Rails | Independent 1.7–3.6 V supplies per port group; enable mixed-voltage interfacing and isolation |
| VDDD / VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V inputs; decoupling required per datasheet layout guidelines to ensure ADC accuracy and RF noise immunity |
| XRES | Active-Low Reset Input | Asynchronous reset pin; internal pull-up; asserts system-wide reset when driven low for ≥100 ns |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enables dynamic power optimization across BLE and application workloads |
| Hardware BLE Link Layer | Dedicated silicon block handles connection management, packet encryption, and timing-critical radio scheduling - offloads M0+ and preserves M4 bandwidth |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache - eliminates boot copy latency and reduces SRAM footprint |
| CAPSENSE™ SmartSense | Self-calibrating capacitive sensing engine with automatic SNR optimization and liquid-tolerance tuning - no host CPU intervention required |
| Secure Boot Chain | Immutable ROM bootloader validates signed firmware images using ECDSA before loading; prevents unauthorized code execution at power-on |
Applications
| Smart Wearable Sensor Hub | Industrial Wireless Node |
|---|---|
Use Scenario: Compact wrist-worn device aggregating accelerometer, temperature, and heart-rate data with local preprocessing and BLE transmission. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion on M4 while M0+ manages BLE advertising, connection, and OTA updates; 32-kHz ILO maintains RTC during Deep Sleep. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to >12 months on coin cell; CAPSENSE™ enables waterproof touch controls. | Use Scenario: Battery-powered vibration monitor mounted on rotating machinery, transmitting predictive maintenance alerts via BLE mesh. IC Role / Device Role / Timing Role: TCPWM captures analog vibration waveforms; SAR ADC samples at 1 Msps; BLE subsystem reports FFT-derived features every 5 seconds. Use Value: Hardware-accelerated crypto ensures authenticated sensor data; SIMO buck converter sustains operation down to 1.7 V input during brownout events. |
| Connected Medical Patch | Asset Tracking Tag |
Use Scenario: Disposable ECG patch with dry electrodes, onboard signal conditioning, and encrypted BLE telemetry to smartphone gateway. IC Role / Device Role / Timing Role: CTBm opamps condition biopotential signals; 12-bit DAC generates reference voltages; Secure Boot enforces HIPAA-compliant firmware signing. Use Value: Integrated analog front-end eliminates discrete opamp/ADC/DAC BOM; ROM-based root-of-trust prevents tampering with patient data pipelines. | Use Scenario: GPS-denied indoor logistics tag reporting location via BLE RSSI triangulation and motion-triggered wake-up. IC Role / Device Role / Timing Role: Smart I/O™ detects motion via GPIO interrupt; M0+ wakes M4 only upon threshold crossing; BLE RSSI resolution (4 dB) enables coarse proximity mapping. Use Value: 16 Smart I/O™ pins perform Boolean logic in Deep Sleep - zero CPU wake-ups for basic event filtering, extending shelf life to 5+ years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core Cortex-M4F (64 MHz), no M0+ co-processor; 1-MB flash, 256-KB RAM; BLE 5.0, but no hardware link-layer offload | Lacks dual-CPU partitioning - BLE stack and application share same core; higher software complexity for real-time constraints | Prefer when cost-sensitive designs accept software-managed BLE timing and require USB support (nRF52840 has native USB) |
| Dialog DA1469x | Dual-core (Cortex-M33 + Cortex-M0), 2-MB flash, 348-KB RAM; BLE 5.2, integrated PMU; no programmable analog or UDBs | No CAPSENSE™, no SAR ADC, no Smart I/O™ - requires external components for analog sensing or logic acceleration | Prefer when ultra-low active power (<10 µA/MHz) and longest battery life are primary, and analog/digital flexibility is secondary |
Compared with nRF52840 and DA1469x, CY8C6316BZI-BLF53 uniquely combines dual-CPU deterministic partitioning, hardware BLE offload, programmable analog/digital fabric, and ROM-secured boot - making it optimal for resource-constrained, safety-aware, and feature-rich IoT endpoints where firmware integrity and peripheral integration reduce BOM count and validation effort.
Availability
CY8C6316BZI-BLF53 is available at Aetrix Electronics and suitable for smart wearables, industrial wireless sensors, connected medical patches, and asset tracking tags requiring stable component supply, long-term lifecycle assurance, and qualified BLE 5.0 silicon.
Supply support for CY8C6316BZI-BLF53 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 63 product line targets secure, ultra-low-power IoT endpoints - integrating BLE 5.0 radio, dual-application cores, and reconfigurable analog/digital fabric to eliminate discrete component dependencies in edge intelligence devices.
FAQ
What is the maximum supported external QSPI flash size and interface mode for XIP?
CY8C6316BZI-BLF53 supports external QSPI flash up to 128 MB via SMIF interface, with full XIP capability across single, dual, quad, dual-quad, and octal modes. Throughput reaches 640 Mbps in octal mode, and hardware AES-128 decryption is applied on-the-fly during instruction fetch - enabling secure code execution without SRAM load overhead.
Does the device support concurrent BLE central and peripheral roles?
Yes - the hardware Link Layer engine supports up to four simultaneous BLE connections, configurable as any combination of central and peripheral roles. This is enabled by dedicated DMA channels and dual-port memory access, allowing independent connection management without CPU intervention or software stack arbitration.
How is Secure Boot enforced, and can it be disabled for development?
Secure Boot is enforced by immutable ROM code that verifies ECDSA signatures of flash-boot images against public keys stored in OTP eFuse. During development, the "Secure Boot Disable" bit in the SFlash protection register can be programmed once to allow unsigned firmware - but this permanently disables ROM-level signature checking and removes the hardware root of trust.
What GPIO features are available in Deep Sleep mode, and how many pins retain functionality?
In Deep Sleep mode, 16 Smart I/O™ pins remain fully operational for Boolean logic, event detection, and pin-state latching - with no CPU wake-up required. Additionally, six overvoltage-tolerant (OVT) pins and both low-power comparators retain input monitoring capability, enabling wake-on-analog-threshold or wake-on-GPIO-edge with sub-µA quiescent current.
CY8C6316BZI-BLF53 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6316BZI-BLF53 FAQ
1.How can I place an order for CY8C6316BZI-BLF53 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6316BZI-BLF53 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6316BZI-BLF53 reliable?
The price and inventory of CY8C6316BZI-BLF53 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6316BZI-BLF53 is usually 5 days.
3.What payment methods are accepted for CY8C6316BZI-BLF53?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6316BZI-BLF53 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6316BZI-BLF53?
CY8C6316BZI-BLF53 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6316BZI-BLF53 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6316BZI-BLF53?
For technical support, including CY8C6316BZI-BLF53 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6316BZI-BLF53 requirements.
6.How does Aetrix verify that CY8C6316BZI-BLF53 is sourced from the original manufacturer or authorized distributors?
All CY8C6316BZI-BLF53 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6316BZI-BLF53 meets industry standards.
7.What is the process for return or replacement of CY8C6316BZI-BLF53?
All CY8C6316BZI-BLF53 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6316BZI-BLF53, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6316BZI-BLF53 part is unused and in its original packaging.
Return procedure for CY8C6316BZI-BLF53:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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