Infineon Technologies CY8C6336BZI-BLF03T

Overview

CY8C6336BZI-BLF03T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® LE 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports 2 Mbps BLE data rate with –95 dBm RX sensitivity. Used in battery-powered IoT edge nodes requiring secure wireless sensor aggregation and local decision-making.

For engineers reviewing the CY8C6336BZI-BLF03T datasheet, CY8C6336BZI-BLF03T pinout, CY8C6336BZI-BLF03T application, or CY8C6336BZI-BLF03T equivalent, key selection considerations include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE link-layer concurrency (4 simultaneous connections), QSPI XIP with hardware encryption, and CAPSENSE™ liquid-tolerant proximity sensing capability.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power state coordination. Both cores share memory-mapped peripherals via a crossbar switch and communicate via IPC with hardware mailbox and interrupt support.

Its Bluetooth® LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and dedicated Link Layer engine - enabling concurrent master/slave operation, programmable TX output up to +4 dBm, and RSSI measurement with 4-dB resolution - all operating independently of the application CPUs to minimize host load.

Key Specifications

Pinout & Package

CY8C6336BZI-BLF03T is housed in a 104-ball Wafer-Level Chip-Scale Package (WLCSP, BZI suffix) with 0.4-mm ball pitch and bottom-side thermal pad. Pin functions are defined per the Infineon PSoC™ 63 pinout specification for the BZI package variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Compared with NRF52840-QIAA and CC2642R1F, CY8C6336BZI-BLF03T delivers higher deterministic real-time performance via dual-core asymmetry, on-die programmable logic for custom protocol offload, and integrated analog front-end reducing external component count in sensor-rich designs.

Availability

CY8C6336BZI-BLF03T is available at Aetrix Electronics and suitable for smart wearable sensor hubs, industrial wireless nodes, secure BLE gateways, and capacitive control panels requiring stable component supply and long-term lifecycle support.

Supply support for CY8C6336BZI-BLF03T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The PSoC™ 63 product line targets secure, ultra-low-power IoT endpoints requiring integrated wireless connectivity, hardware-based security, and field-programmable analog/digital resources - not just general-purpose MCUs.

FAQ

What is the maximum supported QSPI clock frequency for XIP operation?

The CY8C6336BZI-BLF03T supports QSPI XIP at up to 80 MHz in quad mode, delivering 640 Mbps effective throughput. The SMIF controller includes a 4-KB instruction cache to reduce flash access latency and maintain CPU performance during burst reads. Clock phase alignment and timing margins must comply with the device's AC timing specifications in Section 6.2.3 of the datasheet.

Does this part support Over-The-Air (OTA) firmware updates via BLE?

Yes - the device supports secure OTA updates using the ModusToolbox™ bootloader with dual-bank flash layout. Firmware images are authenticated using ECDSA signatures verified against public keys stored in OTP eFuse, and decrypted using AES-128 keys derived from hardware TRNG. The bootloader enforces rollback prevention and atomic update switching.

Can the internal SIMO buck converter power both VCC and VDDIO rails simultaneously?

No - the SIMO buck converter outputs only VCC (core voltage). VDDIO rails must be supplied externally within 1.7–3.6 V and are not regulated by the SIMO. The converter supports three output phases (VCC, VREF, VREFB) but does not drive I/O banks. Separate LDOs or external regulators are required for VDDIO domains.

How many CAPSENSE™ sensors can be scanned concurrently in low-power mode?

The CAPSENSE™ subsystem supports scanning up to 32 sensors in low-power mode using hardware sequencer and automatic SmartSense tuning. Scan time depends on resolution and sensor size, but typical 16-sensor scans complete in <15 ms at 12-bit resolution with 16x averaging. Deep Sleep current remains below 10 µA during background scanning when paired with the ILO clock source.