Infineon Technologies CY8C6337BZI-BLF13

Overview

CY8C6337BZI-BLF13 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports QSPI XIP with hardware encryption-used in battery-powered BLE edge nodes requiring secure OTA updates and sensor fusion.

For engineers reviewing the CY8C6337BZI-BLF13 datasheet, CY8C6337BZI-BLF13 pinout, CY8C6337BZI-BLF13 application, or CY8C6337BZI-BLF13 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), SAR ADC performance (12-bit, 1-Msps, 16-channel sequencer), and SIMO buck converter quiescent current (<1 µA).

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power background operations via IPC and shared memory. Clocking combines FLL (IMO-based) and PLL (crystal-based) for precise timing across RF, ADC, and USB domains.

Its Bluetooth LE subsystem integrates a 2.4-GHz transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and hardware-accelerated Link Layer supporting master/slave roles and 2 Mbps PHY-enabling robust wireless coexistence with on-chip analog sensing and digital logic.

Key Specifications

Pinout & Package

CY8C6337BZI-BLF13 is housed in a 124-ball BGA package (9 mm × 9 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per the Infineon PSoC™ 63 pinout specification for BGA-124 variant (document 002-18787 Rev. *R, Section 4).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Compared with nRF52840-QIAA and DA1469x, CY8C6337BZI-BLF13 uniquely combines dual-CPU power partitioning, hardware-programmable analog/digital fabric, and production-grade CAPSENSE™-making it optimal for integrated sensor-edge devices needing both BLE and embedded signal conditioning without external components.

Availability

CY8C6337BZI-BLF13 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and wireless audio remotes requiring stable component supply across design-in, prototyping, and volume production phases.

Supply support for CY8C6337BZI-BLF13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.

CY8C6337BZI-BLF13 belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power IoT endpoints combining BLE 5.0 connectivity with reconfigurable analog and digital logic for rapid differentiation in edge sensing applications.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6337BZI-BLF13?

The Cortex-M4F core operates at up to 150 MHz, verified under 1.1-V core supply with specified timing margins. Frequency scaling is dynamically adjustable between 0.9 V and 1.1 V, enabling trade-offs between performance (150 MHz @ 1.1 V) and ultra-low-power operation (100 MHz @ 0.9 V) without changing external clock sources.

Does CY8C6337BZI-BLF13 support external QSPI flash with execute-in-place (XIP)?

Yes-it features a Serial Memory Interface (SMIF) that supports XIP from external quad SPI flash with hardware AES-128 decryption, 4-KB cache, and throughput up to 640 Mbps. The interface supports single/dual/quad/dual-quad/octal modes and maintains full CPU access during flash reads, enabling seamless code expansion beyond internal 1-MB flash.

How many simultaneous Bluetooth LE connections does the on-chip radio support?

The integrated Bluetooth LE 5.0 subsystem supports up to four concurrent connections in either master or slave role, managed by a dedicated hardware Link Layer engine. This enables use cases like a sensor hub connecting to multiple end-devices while maintaining a central link to a gateway-without CPU intervention or software stack overhead.

Is the CAPSENSE™ subsystem capable of liquid-tolerant touch detection?

Yes-CAPSENSE™ on CY8C6337BZI-BLF13 delivers industry-leading >100:1 signal-to-noise ratio and includes hardware-based liquid tolerance algorithms. It supports self- and mutual-capacitance configurations and automatic SmartSense tuning, enabling reliable touch operation on wet or contaminated surfaces without firmware recalibration.