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Infineon Technologies CY8C6337BZI-BLF13T
- Part No.:
- CY8C6337BZI-BLF13T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6337BZI-BLF13T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 116BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,496
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Product details
Overview
CY8C6337BZI-BLF13T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ PSoC™ 63 microcontroller with integrated Bluetooth® LE 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports 2 Mbps BLE data rate with –95 dBm RX sensitivity - deployed in battery-powered IoT edge nodes requiring secure wireless sensor aggregation.
For engineers reviewing the CY8C6337BZI-BLF13T datasheet, CY8C6337BZI-BLF13T pinout, CY8C6337BZI-BLF13T application, or CY8C6337BZI-BLF13T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), BLE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and CAPSENSE™ liquid-tolerant proximity sensing capability.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack execution and low-power state coordination. Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and hardware-accelerated Link Layer engine supporting master/slave roles and four concurrent connections.
Clocking is managed via multiple sources: an 8-MHz IMO (±2%), 32-kHz ILO, external crystal oscillators (16–35 MHz + 32 kHz), FLL, and PLL - enabling precise timing for TCPWM, ADC sampling, and BLE packet timing. The SIMO buck converter delivers <1 µA quiescent current and powers core logic at 0.9 V or 1.1 V under software control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| BLE Compliance | Bluetooth® LE 5.0; supports 2 Mbps PHY, –95 dBm RX sensitivity, 4 dBm max TX power |
| Memory | 1-MB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention |
| Power Modes | Six modes; Deep Sleep draws 7 µA with 64-KB SRAM retention and RTC active |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two opamps, two low-power comparators, 12-bit DAC |
| Digital Peripherals | 32 TCPWM blocks, 9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), QSPI/XIP with 4-KB cache & encryption |
| GPIO & Sensing | Up to 84 GPIOs including 2 Smart I/O™ ports (16 pins), CAPSENSE™ with SmartSense auto-tuning |
Pinout & Package
This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch) with USB support. Pin functions are defined per the CY8C6337BZI-BLF13T-specific pinout diagram in Infineon's datasheet section 4 (page 32).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Independent 1.7–3.6 V domains per port group; enables mixed-voltage interfacing |
| VDDD/VDDA | Digital/Analog Core Supply | Core logic powered by internal SIMO buck; VDDA supplies precision analog blocks |
| SWDCK/SWDIO | Debug Interface | 2-pin SWD interface for programming and real-time debugging; accessible in most power modes |
| P0.0–P15.7 | Programmable GPIO | Configurable drive strength/slew rate; six pins overvoltage-tolerant up to 5.5 V |
| XTAL_IN/XTAL_OUT | Crystal Oscillator | Supports 16–35 MHz external crystal for high-accuracy clock source or BLE timing reference |
| RF_ANT | RF Output | 50-Ω matched RF output terminal for direct connection to PCB antenna or matching network |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Software-selectable 0.9 V or 1.1 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz) |
| Hardware BLE Link Layer | Dedicated engine handles BLE connection management, advertising, scanning, and four concurrent links without CPU intervention |
| QSPI XIP with Encryption | Execute-in-place from external flash with AES-128 on-the-fly decryption; 4-KB cache reduces fetch latency and active power |
| CAPSENSE™ SmartSense | Firmware-free auto-tuning of capacitive buttons/sliders/proximity sensors - maintains SNR >100:1 under moisture or contamination |
| Secure Boot & Protection Contexts | ROM-based root of trust validates signed firmware images; eight hardware-enforced protection contexts isolate privileged code and data |
Applications
| Smart Home Sensor Hub | Wearable Health Monitor |
|---|---|
Use Scenario: Central node aggregating temperature, humidity, motion, and air quality data from multiple sensors, transmitting encrypted payloads via BLE to gateway. IC Role / Device Role / Timing Role: Dual-core orchestrator: M0+ runs BLE stack and sensor polling; M4 processes sensor fusion and local anomaly detection. Use Value: 7 µA Deep Sleep with retained SRAM allows multi-week battery life; CAPSENSE™ enables touchless wake-on-approach UX. | Use Scenario: Compact wrist-worn device measuring heart rate (PPG), skin temperature, and motion (via integrated accelerometer interface). IC Role / Device Role / Timing Role: Real-time sensor hub: ADC samples PPG at 1 Msps; TCPWM generates LED drive pulses; BLE transmits compressed time-series data. Use Value: On-chip 12-bit DAC drives LED current with <2 µs settling; low-power comparators monitor battery voltage during sleep. |
| Industrial Predictive Maintenance Node | Asset Tracking Tag |
Use Scenario: Vibration and thermal monitoring on rotating machinery, performing FFT-based fault signature analysis before BLE transmission. IC Role / Device Role / Timing Role: Edge AI accelerator: M4 executes lightweight ML inference; UDBs implement custom filtering logic; QSPI XIP loads model weights. Use Value: 1-MB flash stores firmware + models; dual-core IPC enables deterministic response to interrupt-driven sensor events. | Use Scenario: Battery-powered logistics tag reporting GPS-derived location, ambient temperature, and shock events to cloud via BLE-connected smartphone or gateway. IC Role / Device Role / Timing Role: Low-power tracker: M0+ manages BLE advertising intervals and GPS UART handshake; M4 wakes only for GPS fix acquisition. Use Value: SIMO buck converter extends CR2032 life to >2 years; 32-kHz ILO maintains accurate RTC across power modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | Single-core ARM Cortex-M4F (64 MHz), no M0+ co-processor; 1-MB flash, 256-KB RAM; BLE 5.0, but no integrated USB or QSPI XIP | Lacks dual-CPU task partitioning and hardware-accelerated BLE link layer; requires external flash for XIP | Select when USB interface and deterministic BLE+application concurrency are not required |
| Dialog DA1469x | ARM Cortex-M33 (150 MHz), 352-KB RAM, BLE 5.2; includes PMU and audio codec; no programmable analog/digital logic (UDBs) | No CAPSENSE™, no SAR ADC with sequencer, no Smart I/O; higher active current (35 µA/MHz) | Select for audio-centric BLE endpoints needing integrated codec, not programmable analog or logic |
Compared with nRF52840-QIAA and DA1469x, CY8C6337BZI-BLF13T uniquely combines dual-core deterministic partitioning, hardware BLE link-layer offload, CAPSENSE™, and field-programmable analog/digital logic - enabling single-chip sensor fusion, secure wireless edge nodes without external peripherals.
Availability
CY8C6337BZI-BLF13T is available at Aetrix Electronics and suitable for smart home sensor hubs, wearable health monitors, industrial predictive maintenance nodes, and asset tracking tags requiring stable component supply, long-term lifecycle assurance, and qualified BLE 5.0 silicon.
Supply support for CY8C6337BZI-BLF13T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, security ICs, and industrial control solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 63 product line targets secure, ultra-low-power IoT endpoints - integrating BLE 5.0, dual-core processing, programmable analog/digital fabric, and hardware security to eliminate discrete component count in edge sensor nodes.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6337BZI-BLF13T?
The Cortex-M4F core operates at up to 150 MHz when powered at 1.1 V, and at reduced frequency scaling when running at 0.9 V for ultra-low-power operation. Frequency is dynamically controlled via the clock tree and voltage regulator settings, and verified in the device's electrical specifications table (Section 6.2.2 of datasheet 002-18787 Rev. *R).
Does CY8C6337BZI-BLF13T support USB device functionality?
Yes - this specific variant (BZI-BLF13T) is packaged in a 124-ball BGA with USB Full-Speed device interface enabled. It supports USB 2.0 FS (12 Mbps), including device enumeration, CDC ACM, HID, and MSC class implementations using ModusToolbox™ middleware.
How many simultaneous BLE connections does the onboard radio support?
The integrated BLE subsystem supports up to four simultaneous connections - two as master and two as slave - managed entirely by the dedicated Link Layer engine without CPU involvement. This is confirmed in the "Bluetooth® Low Energy subsystem" feature list and Section 3.3 of the datasheet.
Is CAPSENSE™ tuning fully automatic, or does it require host firmware intervention?
CAPSENSE™ includes SmartSense™ - a ROM-based auto-tuning algorithm that dynamically adjusts sensor parameters (IDAC, scan resolution, averaging) without host firmware involvement. It maintains stable operation under varying environmental conditions, including water overlay, and is activated by calling Cy_CapSense_RunSelfTest() in the CapSense middleware.
CY8C6337BZI-BLF13T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6337BZI-BLF13T FAQ
1.How can I place an order for CY8C6337BZI-BLF13T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6337BZI-BLF13T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6337BZI-BLF13T reliable?
The price and inventory of CY8C6337BZI-BLF13T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6337BZI-BLF13T is usually 5 days.
3.What payment methods are accepted for CY8C6337BZI-BLF13T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6337BZI-BLF13T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6337BZI-BLF13T?
CY8C6337BZI-BLF13T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6337BZI-BLF13T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6337BZI-BLF13T?
For technical support, including CY8C6337BZI-BLF13T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6337BZI-BLF13T requirements.
6.How does Aetrix verify that CY8C6337BZI-BLF13T is sourced from the original manufacturer or authorized distributors?
All CY8C6337BZI-BLF13T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6337BZI-BLF13T meets industry standards.
7.What is the process for return or replacement of CY8C6337BZI-BLF13T?
All CY8C6337BZI-BLF13T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6337BZI-BLF13T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6337BZI-BLF13T part is unused and in its original packaging.
Return procedure for CY8C6337BZI-BLF13T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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