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Infineon Technologies CY8C6347BZI-BLD33
- Part No.:
- CY8C6347BZI-BLD33
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6347BZI-BLD33.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 116BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,722
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Product details
Overview
CY8C6347BZI-BLD33 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports QSPI XIP with on-the-fly encryption for secure IoT edge node execution.
For engineers reviewing the CY8C6347BZI-BLD33 datasheet, CY8C6347BZI-BLD33 pinout, CY8C6347BZI-BLD33 application, or CY8C6347BZI-BLD33 equivalent, key selection criteria include Bluetooth LE 5.0 link-layer concurrency (4 connections), dual-voltage core operation (0.9 V / 1.1 V), SIMO buck converter quiescent current (<1 µA), and CAPSENSE™ liquid-tolerant proximity sensing capability.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and low-power background operations. Inter-processor communication (IPC) and shared memory enable deterministic task partitioning without bus contention.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX power up to +4 dBm, and hardware-accelerated Link Layer supporting simultaneous master/slave roles. The on-chip SIMO DC-DC converter delivers regulated core voltages with sub-µA quiescent current in Deep Sleep mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Bluetooth LE | Compliant with Bluetooth 5.0; supports 2 Mbps PHY, 4 concurrent connections, –95 dBm RX sensitivity |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 @ 0.9 V; SIMO buck quiescent <1 µA |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Peripherals | 32 TCPWM blocks, 9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB), 12 UDBs, Smart I/O™ Boolean logic |
| Package | 124-ball BGA (9 × 9 mm, 0.5 mm pitch), RoHS-compliant, USB-capable variant |
Pinout & Package
CY8C6347BZI-BLD33 is housed in a 124-ball BGA package (9 mm × 9 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per the Infineon PSoC™ 63 pinout specification for BGA-124 configuration (Document No. 002-18787 Rev. *R, Section 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Rails | Independent 1.7–3.6 V domains enabling mixed-voltage interface operation (e.g., 1.8 V sensor + 3.3 V display) |
| VDDD/VDDA | Digital/Analog Core Supplies | Separate rails for noise isolation; VDDA powers ADC/DAC/comp, VDDD powers CPU and digital logic |
| SWDCK/SWDIO | Debug Interface | Two-pin SWD interface supporting full debug, programming, and secure boot verification via ROM-based root of trust |
| ANT | RF Antenna Terminal | 50-Ω matched RF output directly driving PCB trace antenna or external balun; requires no external matching network |
| XTAL_IN/XTAL_OUT | Crystal Oscillator Interface | Supports 16–35 MHz crystals for high-accuracy system clock; internal load capacitors eliminate need for external caps |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot Architecture | ROM-based immutable root of trust enforces authenticated, encrypted image loading before any user code executes |
| Programmable Analog Subsystem | Hardware-tunable CAPSENSE™ with SmartSense auto-calibration enables robust touch/proximity sensing under wet conditions |
| QSPI XIP with Encryption | Execute-in-place from external flash with AES-128 on-the-fly decryption eliminates external secure memory and reduces BOM cost |
| Smart I/O™ in Deep Sleep | 16 GPIOs retain Boolean logic capability during Deep Sleep, allowing wake-on-pattern detection without CPU intervention |
| Bluetooth LE Link Layer Engine | Dedicated hardware engine offloads protocol timing, packet assembly, and connection management from both CPUs |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous ECG/PPG acquisition with BLE streaming to smartphone and local anomaly detection. IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles BLE advertising/connection; M4F runs real-time DSP and CAPSENSE™ dry/wet finger detection. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life >2 weeks on coin cell; on-chip temperature sensor calibrates ADC gain drift across operating range. | Use Scenario: Multi-sensor aggregation (temp/humidity/motion) with encrypted local storage and scheduled BLE broadcast. IC Role / Device Role / Timing Role: QSPI XIP executes firmware from external flash; SIMO buck powers all domains at 0.9 V during sensing bursts to minimize energy per measurement. Use Value: Hardware AES encryption protects stored sensor logs; Smart I/O™ detects door/window open events in Deep Sleep using GPIO pattern match, waking only when needed. |
| Industrial Predictive Maintenance Node | Wireless Audio Remote Control |
Use Scenario: Vibration analysis via PDM microphone array, FFT processing, and BLE alert transmission on threshold breach. IC Role / Device Role / Timing Role: Two PDM channels feed M4F's DSP engine; TCPWM blocks generate precise PWM triggers for synchronized sampling clocks. Use Value: 12-bit SAR ADC with 16-channel sequencer captures multi-axis accelerometer data with hardware averaging; TRNG seeds secure OTA update keys. | Use Scenario: Low-latency voice command capture and BLE audio streaming to speaker or headset. IC Role / Device Role / Timing Role: I²S interface connects MEMS microphone; M0+ manages BLE audio profile (LE Audio CSA2); M4F performs voice activity detection (VAD). Use Value: 2 Mbps BLE PHY reduces audio packet latency; on-chip opamps condition microphone signal without external biasing components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core Arm Cortex-M33/M33; no integrated SMIF/QSPI XIP; separate flash required; higher TX power (+8 dBm) | Lacks on-chip analog peripherals (no SAR ADC, DAC, opamps); requires external signal conditioning for sensor nodes | Preferred for pure wireless throughput and security certification; less suitable for analog-rich, cost-sensitive edge nodes |
| Dialog DA1469x | Single Cortex-M33 core; integrated PMU but no dual-voltage core scaling; lower SRAM (384 KB vs 288 KB) | No CAPSENSE™ or Smart I/O™; limited programmable logic; weaker analog subsystem (no 12-bit DAC or dual comparators) | Better for ultra-low-power beaconing; insufficient for mixed-signal real-time control requiring concurrent analog/digital processing |
Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD33 uniquely combines Bluetooth 5.0 concurrency, hardware-accelerated CAPSENSE™, QSPI XIP with encryption, and dual-voltage core efficiency-making it optimal for secure, sensor-dense, battery-operated IoT endpoints requiring local decision-making.
Availability
CY8C6347BZI-BLD33 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and wireless audio remote controls requiring stable component supply across long-lifecycle deployments.
Supply support for CY8C6347BZI-BLD33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.
CY8C6347BZI-BLD33 belongs to the PSoC™ 63 product line, designed specifically for secure, ultra-low-power IoT edge devices requiring integrated wireless, programmable analog, and hardware-enforced trust anchors.
FAQ
Does CY8C6347BZI-BLD33 support over-the-air (OTA) firmware updates?
Yes. It supports secure OTA updates via its ROM-based Secure Boot and cryptography accelerator. Firmware images are authenticated using ECDSA signatures and decrypted with AES-128 before loading into flash. The bootloader validates hash and signature prior to execution, preventing unauthorized code injection.
What is the maximum supported external QSPI flash size and interface speed?
The QSPI interface supports up to 2 GB external flash with octal STR/DTR modes achieving 640 Mbps throughput. It includes 4-KB cache and hardware address remapping to enable Execute-In-Place (XIP) with deterministic timing and low active power consumption during code fetch.
Can the Bluetooth LE subsystem operate independently while the M4F core is in Deep Sleep?
Yes. The Bluetooth LE subsystem-including RF transceiver, Link Layer engine, and associated timers-remains fully operational in Deep Sleep mode. The M0+ core can handle BLE advertising, scanning, and connection management autonomously while the M4F remains powered down, consuming only 7 µA total system current.
Is CAPSENSE™ tuning required for production deployment?
No manual tuning is required. SmartSense auto-calibration runs at startup and dynamically adjusts sensor parameters (IDAC, scan resolution, baseline tracking) based on environmental capacitance and noise. Factory-trimmed reference sensors ensure consistent performance across units without host firmware intervention.
CY8C6347BZI-BLD33 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347BZI-BLD33 FAQ
1.How can I place an order for CY8C6347BZI-BLD33 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347BZI-BLD33 reliable?
The price and inventory of CY8C6347BZI-BLD33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD33 is usually 5 days.
3.What payment methods are accepted for CY8C6347BZI-BLD33?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD33 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347BZI-BLD33?
CY8C6347BZI-BLD33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347BZI-BLD33 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347BZI-BLD33?
For technical support, including CY8C6347BZI-BLD33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD33 requirements.
6.How does Aetrix verify that CY8C6347BZI-BLD33 is sourced from the original manufacturer or authorized distributors?
All CY8C6347BZI-BLD33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD33 meets industry standards.
7.What is the process for return or replacement of CY8C6347BZI-BLD33?
All CY8C6347BZI-BLD33 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD33, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347BZI-BLD33 part is unused and in its original packaging.
Return procedure for CY8C6347BZI-BLD33:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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