Infineon Technologies CY8C6347BZI-BLD33T
- Part No.:
- CY8C6347BZI-BLD33T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6347BZI-BLD33T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 116BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C6347BZI-BLD33T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces. Used in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.
For engineers reviewing the CY8C6347BZI-BLD33T datasheet, CY8C6347BZI-BLD33T pinout, CY8C6347BZI-BLD33T application, or CY8C6347BZI-BLD33T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages Bluetooth LE Link Layer and system housekeeping-enabling concurrent application and radio execution without resource contention. Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory protected by eight Protection Contexts.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated Link Layer engine supporting master/slave roles and 2 Mbps data rate-operating independently of CPU cores via DMA and event-driven triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| Memory | 1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention control |
| Bluetooth LE | Compliant with BLE 5.0; supports 4 concurrent connections, 2 Mbps PHY, –95 dBm RX sensitivity, +4 dBm TX |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core voltage |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling), two opamps |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (8 configurable as SPI/I²C/UART) |
Pinout & Package
This device is housed in a 124-ball BGA package (10 mm × 10 mm, 0.8 mm pitch) with USB support. Pin functions are defined per the CY8C6347BZI-BLD33T-specific pinout diagram in Infineon's datasheet section 4 (page 32).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | GPIO / Smart I/O™ input/output | Configurable drive modes; Boolean logic execution during Deep Sleep; overvoltage-tolerant on P0.0–P0.5 |
| P12.0–P12.7 | Capacitive sensing (CAPSENSE™) | Supports self- and mutual-capacitance sensing with automatic SmartSense tuning and liquid tolerance |
| SWDCLK / SWDIO | JTAG/SWD debug interface | Two-pin serial wire debug; supports secure debug disable via Protection Context configuration |
| VBAT / VBACKUP | Backup domain supply | Provides power to 64-byte backup RAM and RTC during main power loss; accepts 1.1–3.6 V |
| RF_IN / RF_OUT | Bluetooth RF transceiver I/O | 50-Ω differential RF interface; requires external matching network and antenna connection per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot & Execution | ROM-based root of trust enforces authenticated image loading and execute-only memory protection for firmware routines |
| Hardware Crypto Acceleration | Dedicated engine for AES-128/256, SHA-256, ECC, RSA, and TRNG-offloading CPU and enabling TLS handshake in <100 ms |
| QSPI XIP with Encryption | Execute-in-place from external flash with real-time AES-128 decryption and 4-KB cache-reducing SRAM footprint and power |
| Smart I/O™ Logic | 16 GPIOs support combinational logic (AND/OR/XOR) and state-holding in Deep Sleep-enabling wake-on-pattern without CPU wake |
| CAPSENSE™ Proximity Sensing | Hardware-accelerated proximity detection with >100:1 SNR and immunity to water droplets-eliminates need for mechanical buttons |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
Use Scenario: Continuous ECG/PPG acquisition, local feature extraction, and BLE transmission to smartphone. IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles BLE stack and sensor polling; M4 runs DSP algorithms and manages flash logging. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention enables multi-day battery life; on-chip temperature sensor calibrates ADC gain drift in real time. | Use Scenario: Multi-sensor aggregation (temp/humidity/motion) with local decision logic and cloud-uplink via BLE-to-gateway bridge. IC Role / Device Role / Timing Role: Acts as sensor fusion hub with CAPSENSE™ for touch controls, TCPWM for fan PWM control, and SCBs for I²C sensor buses. Use Value: Smart I/O™ detects button press patterns in Deep Sleep and wakes only M0+-cutting average system current by 40% vs full-CPU wake. |
| Industrial Wireless Node | BLE Audio Remote |
Use Scenario: Vibration monitoring on rotating equipment using PDM microphone array and FFT analysis before BLE alert transmission. IC Role / Device Role / Timing Role: M4 performs real-time FFT on PDM data; M0+ manages BLE advertising interval and connection supervision timeout. Use Value: Hardware-accelerated crypto signs sensor data payloads; 2 Mbps BLE PHY reduces airtime by 50% vs 1 Mbps, extending node battery life. | Use Scenario: Low-latency voice command remote with push-to-talk, audio preprocessing, and BLE HID profile reporting. IC Role / Device Role / Timing Role: PDM input → M4 audio preprocessing → I²S output to codec; M0+ maintains HID connection and handles button events. Use Value: On-chip 12-bit DAC drives analog mic bias; dual-oscillator clocking (IMO + FLL) ensures <50 ppm audio sample rate accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core ARM Cortex-M4F (64 MHz), no M0+ companion; 1-MB flash, 256-KB RAM; no programmable analog/digital logic | Lacks CAPSENSE™, Smart I/O™, and UDB-based peripheral customization; relies on software-defined peripherals | Select when BLE stack simplicity and Nordic SDK maturity outweigh need for hardware-flexible analog/digital subsystems |
| Dialog DA1469x | Dual-core (Cortex-M33 + Cortex-M0), 2.4 GHz BLE 5.2, 1-MB flash, but no integrated SIMO buck converter or hardware crypto accelerator | No on-chip DC-DC conversion; higher active current (10 µA/MHz M33); limited analog capability (no SAR ADC with sequencer) | Select for ultra-low-power always-on sensor nodes where RF performance and sleep current are primary, not mixed-signal flexibility |
Compared with nRF52840 and DA1469x, CY8C6347BZI-BLD33T uniquely combines dual-CPU power scaling, hardware-programmable analog/digital blocks, and integrated SIMO buck-enabling single-chip sensor fusion, secure BLE edge AI, and sub-µA system-level standby without external PMIC.
Availability
CY8C6347BZI-BLD33T is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial wireless nodes, and BLE audio remotes requiring stable component supply across design-in, prototyping, and volume production phases.
Supply support for CY8C6347BZI-BLD33T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and industrial sensors-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
CY8C6347BZI-BLD33T belongs to the PSoC™ 63 product line, designed specifically for secure, ultra-low-power IoT endpoints that integrate wireless connectivity, capacitive sensing, and heterogeneous compute-targeting certified medical, industrial, and consumer edge devices.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6347BZI-BLD33T?
The Cortex-M4F core operates at up to 150 MHz, verified under 1.1-V core supply with ±2% accuracy from the internal main oscillator (IMO) and PLL multiplication. Frequency stability is maintained across temperature (–40°C to +85°C) and voltage (1.7–3.6 V) ranges per datasheet Section 6.2.2.
Does CY8C6347BZI-BLD33T support external crystal oscillators for Bluetooth timing accuracy?
Yes-it integrates on-chip 32-kHz and 16–35 MHz crystal oscillators. For Bluetooth LE timing compliance, a 32-kHz crystal (±20 ppm) is required for the BLE radio's sleep clock, and a 24-MHz or 32-MHz crystal (±10 ppm) is recommended for the system clock to meet BLE 5.0 frequency tolerance requirements.
Can the Smart I/O™ logic operate independently during Deep Sleep mode?
Yes-Smart I/O™ ports retain full Boolean logic functionality (AND/OR/XOR/latch) while the system is in Deep Sleep mode, drawing <1 µA total. Input events trigger wake signals directly to the M0+ CPU without waking the M4 core, enabling ultra-low-power pattern detection such as multi-tap gestures or serial bitstream recognition.
Is the on-chip SIMO buck converter mandatory for operation, or can external regulators be used?
The SIMO buck converter is optional: CY8C6347BZI-BLD33T supports both internal SIMO (for 1.1-V or 0.9-V core rails) and external regulated supplies. When bypassed, VCCD and VCCM must be supplied externally at 1.1 V or 0.9 V respectively, with tight tolerance (±30 mV) and low-noise filtering per datasheet Section 5.1.
CY8C6347BZI-BLD33T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347BZI-BLD33T FAQ
1.How can I place an order for CY8C6347BZI-BLD33T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD33T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347BZI-BLD33T reliable?
The price and inventory of CY8C6347BZI-BLD33T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD33T is usually 5 days.
3.What payment methods are accepted for CY8C6347BZI-BLD33T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD33T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347BZI-BLD33T?
CY8C6347BZI-BLD33T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347BZI-BLD33T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347BZI-BLD33T?
For technical support, including CY8C6347BZI-BLD33T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD33T requirements.
6.How does Aetrix verify that CY8C6347BZI-BLD33T is sourced from the original manufacturer or authorized distributors?
All CY8C6347BZI-BLD33T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD33T meets industry standards.
7.What is the process for return or replacement of CY8C6347BZI-BLD33T?
All CY8C6347BZI-BLD33T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD33T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347BZI-BLD33T part is unused and in its original packaging.
Return procedure for CY8C6347BZI-BLD33T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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