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Infineon Technologies CY8C6347BZI-BLD33T

Part No.:
CY8C6347BZI-BLD33T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
116-WFBGA
Datasheet:
AetrixCY8C6347BZI-BLD33T.pdf
Description:
IC MCU 32BIT 1MB FLASH 116BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,964

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Product details

Overview

CY8C6347BZI-BLD33T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces. Used in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.

For engineers reviewing the CY8C6347BZI-BLD33T datasheet, CY8C6347BZI-BLD33T pinout, CY8C6347BZI-BLD33T application, or CY8C6347BZI-BLD33T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages Bluetooth LE Link Layer and system housekeeping-enabling concurrent application and radio execution without resource contention. Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory protected by eight Protection Contexts.

Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated Link Layer engine supporting master/slave roles and 2 Mbps data rate-operating independently of CPU cores via DMA and event-driven triggers.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches
Memory1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention control
Bluetooth LECompliant with BLE 5.0; supports 4 concurrent connections, 2 Mbps PHY, –95 dBm RX sensitivity, +4 dBm TX
Power Efficiency7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core voltage
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling), two opamps
Digital Flexibility12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (8 configurable as SPI/I²C/UART)

Pinout & Package

This device is housed in a 124-ball BGA package (10 mm × 10 mm, 0.8 mm pitch) with USB support. Pin functions are defined per the CY8C6347BZI-BLD33T-specific pinout diagram in Infineon's datasheet section 4 (page 32).

Pin/TerminalCircuit RoleDesign Meaning
P0.0–P0.7GPIO / Smart I/O™ input/outputConfigurable drive modes; Boolean logic execution during Deep Sleep; overvoltage-tolerant on P0.0–P0.5
P12.0–P12.7Capacitive sensing (CAPSENSE™)Supports self- and mutual-capacitance sensing with automatic SmartSense tuning and liquid tolerance
SWDCLK / SWDIOJTAG/SWD debug interfaceTwo-pin serial wire debug; supports secure debug disable via Protection Context configuration
VBAT / VBACKUPBackup domain supplyProvides power to 64-byte backup RAM and RTC during main power loss; accepts 1.1–3.6 V
RF_IN / RF_OUTBluetooth RF transceiver I/O50-Ω differential RF interface; requires external matching network and antenna connection per layout guidelines

Key Features

FeatureDesign Value
Secure Boot & ExecutionROM-based root of trust enforces authenticated image loading and execute-only memory protection for firmware routines
Hardware Crypto AccelerationDedicated engine for AES-128/256, SHA-256, ECC, RSA, and TRNG-offloading CPU and enabling TLS handshake in <100 ms
QSPI XIP with EncryptionExecute-in-place from external flash with real-time AES-128 decryption and 4-KB cache-reducing SRAM footprint and power
Smart I/O™ Logic16 GPIOs support combinational logic (AND/OR/XOR) and state-holding in Deep Sleep-enabling wake-on-pattern without CPU wake
CAPSENSE™ Proximity SensingHardware-accelerated proximity detection with >100:1 SNR and immunity to water droplets-eliminates need for mechanical buttons

Applications

Wearable Health MonitorSmart Home Sensor Hub

Use Scenario: Continuous ECG/PPG acquisition, local feature extraction, and BLE transmission to smartphone.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles BLE stack and sensor polling; M4 runs DSP algorithms and manages flash logging.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention enables multi-day battery life; on-chip temperature sensor calibrates ADC gain drift in real time.

Use Scenario: Multi-sensor aggregation (temp/humidity/motion) with local decision logic and cloud-uplink via BLE-to-gateway bridge.

IC Role / Device Role / Timing Role: Acts as sensor fusion hub with CAPSENSE™ for touch controls, TCPWM for fan PWM control, and SCBs for I²C sensor buses.

Use Value: Smart I/O™ detects button press patterns in Deep Sleep and wakes only M0+-cutting average system current by 40% vs full-CPU wake.

Industrial Wireless NodeBLE Audio Remote

Use Scenario: Vibration monitoring on rotating equipment using PDM microphone array and FFT analysis before BLE alert transmission.

IC Role / Device Role / Timing Role: M4 performs real-time FFT on PDM data; M0+ manages BLE advertising interval and connection supervision timeout.

Use Value: Hardware-accelerated crypto signs sensor data payloads; 2 Mbps BLE PHY reduces airtime by 50% vs 1 Mbps, extending node battery life.

Use Scenario: Low-latency voice command remote with push-to-talk, audio preprocessing, and BLE HID profile reporting.

IC Role / Device Role / Timing Role: PDM input → M4 audio preprocessing → I²S output to codec; M0+ maintains HID connection and handles button events.

Use Value: On-chip 12-bit DAC drives analog mic bias; dual-oscillator clocking (IMO + FLL) ensures <50 ppm audio sample rate accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52840Single-core ARM Cortex-M4F (64 MHz), no M0+ companion; 1-MB flash, 256-KB RAM; no programmable analog/digital logicLacks CAPSENSE™, Smart I/O™, and UDB-based peripheral customization; relies on software-defined peripheralsSelect when BLE stack simplicity and Nordic SDK maturity outweigh need for hardware-flexible analog/digital subsystems
Dialog DA1469xDual-core (Cortex-M33 + Cortex-M0), 2.4 GHz BLE 5.2, 1-MB flash, but no integrated SIMO buck converter or hardware crypto acceleratorNo on-chip DC-DC conversion; higher active current (10 µA/MHz M33); limited analog capability (no SAR ADC with sequencer)Select for ultra-low-power always-on sensor nodes where RF performance and sleep current are primary, not mixed-signal flexibility

Compared with nRF52840 and DA1469x, CY8C6347BZI-BLD33T uniquely combines dual-CPU power scaling, hardware-programmable analog/digital blocks, and integrated SIMO buck-enabling single-chip sensor fusion, secure BLE edge AI, and sub-µA system-level standby without external PMIC.

Availability

CY8C6347BZI-BLD33T is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial wireless nodes, and BLE audio remotes requiring stable component supply across design-in, prototyping, and volume production phases.

Supply support for CY8C6347BZI-BLD33T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and industrial sensors-with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.

CY8C6347BZI-BLD33T belongs to the PSoC™ 63 product line, designed specifically for secure, ultra-low-power IoT endpoints that integrate wireless connectivity, capacitive sensing, and heterogeneous compute-targeting certified medical, industrial, and consumer edge devices.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6347BZI-BLD33T?

The Cortex-M4F core operates at up to 150 MHz, verified under 1.1-V core supply with ±2% accuracy from the internal main oscillator (IMO) and PLL multiplication. Frequency stability is maintained across temperature (–40°C to +85°C) and voltage (1.7–3.6 V) ranges per datasheet Section 6.2.2.

Does CY8C6347BZI-BLD33T support external crystal oscillators for Bluetooth timing accuracy?

Yes-it integrates on-chip 32-kHz and 16–35 MHz crystal oscillators. For Bluetooth LE timing compliance, a 32-kHz crystal (±20 ppm) is required for the BLE radio's sleep clock, and a 24-MHz or 32-MHz crystal (±10 ppm) is recommended for the system clock to meet BLE 5.0 frequency tolerance requirements.

Can the Smart I/O™ logic operate independently during Deep Sleep mode?

Yes-Smart I/O™ ports retain full Boolean logic functionality (AND/OR/XOR/latch) while the system is in Deep Sleep mode, drawing <1 µA total. Input events trigger wake signals directly to the M0+ CPU without waking the M4 core, enabling ultra-low-power pattern detection such as multi-tap gestures or serial bitstream recognition.

Is the on-chip SIMO buck converter mandatory for operation, or can external regulators be used?

The SIMO buck converter is optional: CY8C6347BZI-BLD33T supports both internal SIMO (for 1.1-V or 0.9-V core rails) and external regulated supplies. When bypassed, VCCD and VCCM must be supplied externally at 1.1 V or 0.9 V respectively, with tight tolerance (±30 mV) and low-noise filtering per datasheet Section 5.1.

CY8C6347BZI-BLD33T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
116-WFBGA
Series:
PSOC™ 6 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347BZI-BLD33T FAQ

1.How can I place an order for CY8C6347BZI-BLD33T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD33T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347BZI-BLD33T reliable?

The price and inventory of CY8C6347BZI-BLD33T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD33T is usually 5 days.

3.What payment methods are accepted for CY8C6347BZI-BLD33T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD33T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347BZI-BLD33T?

CY8C6347BZI-BLD33T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347BZI-BLD33T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347BZI-BLD33T?

For technical support, including CY8C6347BZI-BLD33T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD33T requirements.

6.How does Aetrix verify that CY8C6347BZI-BLD33T is sourced from the original manufacturer or authorized distributors?

All CY8C6347BZI-BLD33T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD33T meets industry standards.

7.What is the process for return or replacement of CY8C6347BZI-BLD33T?

All CY8C6347BZI-BLD33T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD33T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347BZI-BLD33T part is unused and in its original packaging.

Return procedure for CY8C6347BZI-BLD33T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347BZI-BLD33T Tags

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