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Infineon Technologies CY8C6347BZI-BLD34
- Part No.:
- CY8C6347BZI-BLD34
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 124-VFBGA
- Datasheet:
-
CY8C6347BZI-BLD34.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 124VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,971
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Product details
Overview
CY8C6347BZI-BLD34 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces - deployed in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.
For engineers reviewing the CY8C6347BZI-BLD34 datasheet, CY8C6347BZI-BLD34 pinout, CY8C6347BZI-BLD34 application, or CY8C6347BZI-BLD34 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.
Technical Context
The device integrates two tightly coupled Arm cores: a 150-MHz Cortex-M4F with FPU and MPU for real-time processing, and a 100-MHz Cortex-M0+ for low-power background tasks and BLE protocol stack execution. Inter-processor communication (IPC) and shared memory enable deterministic task partitioning between domains.
Its Bluetooth subsystem includes a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated link-layer engine supporting master/slave roles and 2 Mbps PHY - all operating independently of the application CPUs to minimize latency and power overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent cache |
| Flash / SRAM | 1-MB application flash with RWW support; 288-KB SRAM with configurable retention per 64-KB bank |
| Bluetooth LE | Compliant with Bluetooth 5.0; supports 4 concurrent connections, 2 Mbps data rate, –95 dBm RX sensitivity |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core voltage |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 32 TCPWM blocks |
| Security Features | ROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware TRNG & crypto accelerator |
Pinout & Package
This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch), designated as "BZI" in Infineon's ordering nomenclature. The package supports USB functionality and thermal dissipation suitable for compact, sealed IoT enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | Programmable GPIO / Smart I/O™ input | Configurable drive strength/slew; supports Boolean logic during Deep Sleep for wake-on-event |
| P12.0–P12.7 | Capacitive sensing inputs | Direct connection to CAPSENSE™ CSD block; enables self/mutual sensing with SmartSense auto-tuning |
| SWDCLK / SWDIO | JTAG/SWD debug interface | Two-pin debug access; supports secure disable via protection context lock |
| VBAT / VBACKUP | Backup domain supply | Provides power to 64-byte backup RAM and RTC during main power loss |
| ANT / RF_IN / RF_OUT | Bluetooth RF interface | 50-Ω matched RF path; requires external matching network and antenna feed per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 1.1 V or 0.9 V core operation per CPU, enabling dynamic trade-off between performance and sub-20 µA/MHz active current |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption, eliminating code copy overhead and reducing SRAM footprint |
| Smart I/O™ in Deep Sleep | 16 GPIOs grouped into two Smart I/O ports that perform AND/OR/XOR logic on input signals without waking CPUs - ideal for sensor-fusion wake triggers |
| CAPSENSE™ Liquid Tolerance | Hardware-accelerated proximity and wet-finger rejection using mutual capacitance scanning, validated per IEC 61000-4-6 immunity requirements |
| BLE Link Layer Offload | Dedicated hardware engine handles advertising, scanning, connection management, and packet encryption - freeing both CPUs for application tasks |
Applications
| Smart Home Sensor Hub | Wearable Health Monitor |
|---|---|
Use Scenario: Central node aggregating temperature, humidity, motion, and touch inputs while broadcasting BLE telemetry to smartphones and gateways. IC Role / Device Role / Timing Role: Dual-core runtime coordinator: M4 processes sensor fusion algorithms; M0+ hosts BLE stack and manages low-latency wake events via Smart I/O™. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 1 year; CAPSENSE™ enables waterproof touch controls without mechanical buttons. | Use Scenario: Continuous PPG/ECG acquisition, local HRV analysis, and encrypted BLE transmission to mobile apps under strict power budgets. IC Role / Device Role / Timing Role: Real-time signal processor (M4) runs adaptive filtering and peak detection; BLE subsystem maintains persistent 2 Mbps connection with minimal CPU intervention. Use Value: On-chip 12-bit SAR ADC (1-Msps, 16-channel sequencer) captures multi-lead biosignals synchronously; hardware crypto ensures HIPAA-compliant data handoff. |
| Industrial Wireless Node | Asset Tracking Tag |
Use Scenario: Battery-powered vibration/temperature monitor in rotating machinery, transmitting predictive maintenance data over BLE mesh. IC Role / Device Role / Timing Role: M0+ executes time-triggered BLE advertising bursts; M4 wakes periodically to run FFT on accelerometer data buffered in retained SRAM. Use Value: Dual-clock domain isolation prevents BLE timing jitter from affecting ADC sampling integrity; SIMO buck converter sustains regulation down to 1.7 V input. | Use Scenario: GPS-denied indoor location tag using BLE RSSI triangulation, motion-triggered logging, and tamper-detection alerts. IC Role / Device Role / Timing Role: Smart I/O™ detects enclosure breach or orientation change; M0+ initiates encrypted BLE beaconing; on-chip RTC timestamps events with 64-byte backup memory. Use Value: 4-dB RSSI resolution enables sub-meter proximity estimation; 64-byte backup domain preserves last-known position across full power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core Arm Cortex-M33/M33; no integrated SMIF/QSPI XIP; higher TX power (+8 dBm) but no SIMO buck converter | Lacks hardware CAPSENSE™ and Smart I/O™; requires external touch controller and DC-DC for ultra-low-power operation | Preferred when higher RF range or PSA-certified security is required, but adds BOM cost and layout complexity |
| Dialog DA1469x | Single Cortex-M33 core with BLE 5.2; 512-KB flash; no dual-CPU IPC or programmable analog blocks | No SAR ADC or opamps; relies on external analog front-end for sensor conditioning | Suitable for pure BLE data relay where sensor processing is offloaded, but not for integrated mixed-signal edge AI |
Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD34 uniquely combines dual-CPU deterministic partitioning, on-die analog signal chain, and Smart I/O™ Boolean wake logic - enabling single-chip sensor-to-cloud solutions without companion ICs.
Availability
CY8C6347BZI-BLD34 is available at Aetrix Electronics and suitable for smart home hubs, wearable health monitors, industrial wireless sensors, and asset tracking tags requiring stable component supply, long-lifecycle support, and qualified automotive-grade variants.
Supply support for CY8C6347BZI-BLD34 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for industrial, automotive, and IoT markets.
CY8C6347BZI-BLD34 belongs to the PSoC™ 63 product line - designed specifically for secure, ultra-low-power, wireless edge devices that integrate sensing, processing, and BLE connectivity in a single chip.
FAQ
What is the maximum supported external QSPI flash density for XIP operation?
CY8C6347BZI-BLD34 supports up to 128-MB external QSPI flash for Execute-In-Place operation, verified with Micron MT25QU01GB and Winbond W25Q128JVS. Address space mapping is fixed at 0x18000000–0x1FFFFFFF, and on-the-fly AES-128 decryption applies only to code regions marked as secure in the protection context configuration.
Does the device support USB device enumeration without external crystal?
Yes - the internal 48-MHz IMO (±2% accuracy) is sufficient for full-speed USB device enumeration and bulk transfers. No external crystal is required unless ±0.25% frequency tolerance is mandated by host-side compliance testing, in which case a 24-MHz crystal must be connected to the XRES pins.
How many CAPSENSE™ electrodes can be scanned simultaneously in mutual-capacitance mode?
The device supports up to 64 mutual-capacitance electrodes (8 commons × 8 segments) using the dedicated CSD block. Scanning is hardware-accelerated with automatic baseline compensation and SmartSense tuning; full matrix scan completes in under 15 ms at default resolution settings.
Can the SIMO buck converter power both VCCD and VCCIO rails simultaneously?
No - the on-chip SIMO buck converter supplies only the VCCD (digital core) rail. VCCIO must be powered externally at 1.7–3.6 V and is regulated independently; it powers GPIOs, analog peripherals, and BLE RF circuitry. This separation ensures analog noise immunity and flexible I/O voltage selection per bank.
CY8C6347BZI-BLD34 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 124-VFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 84
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347BZI-BLD34 FAQ
1.How can I place an order for CY8C6347BZI-BLD34 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD34 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347BZI-BLD34 reliable?
The price and inventory of CY8C6347BZI-BLD34 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD34 is usually 5 days.
3.What payment methods are accepted for CY8C6347BZI-BLD34?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD34 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347BZI-BLD34?
CY8C6347BZI-BLD34 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347BZI-BLD34 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347BZI-BLD34?
For technical support, including CY8C6347BZI-BLD34 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD34 requirements.
6.How does Aetrix verify that CY8C6347BZI-BLD34 is sourced from the original manufacturer or authorized distributors?
All CY8C6347BZI-BLD34 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD34 meets industry standards.
7.What is the process for return or replacement of CY8C6347BZI-BLD34?
All CY8C6347BZI-BLD34 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD34, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347BZI-BLD34 part is unused and in its original packaging.
Return procedure for CY8C6347BZI-BLD34:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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