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Infineon Technologies CY8C6347BZI-BLD43

Part No.:
CY8C6347BZI-BLD43
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
116-WFBGA
Datasheet:
AetrixCY8C6347BZI-BLD43.pdf
Description:
IC MCU 32BIT 1MB FLASH 116BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,062

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Product details

Overview

CY8C6347BZI-BLD43 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces. Used in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.

For engineers reviewing the CY8C6347BZI-BLD43 datasheet, CY8C6347BZI-BLD43 pinout, CY8C6347BZI-BLD43 application, or CY8C6347BZI-BLD43 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE 5.0 link-layer concurrency (4 connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and peripheral offload. Both cores share memory-mapped peripherals via a high-bandwidth interconnect and coordinate via IPC and dual DMA controllers (16 channels each).

Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated link-layer engine supporting simultaneous master/slave roles and 2 Mbps PHY. The on-chip SIMO buck converter enables sub-1 µA quiescent operation during voltage regulation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, both with MPU and single-cycle multiply
Bluetooth LECompliant with BLE 5.0; supports 4 concurrent connections, 2 Mbps data rate, –95 dBm RX sensitivity
Memory1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse
Power Efficiency7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling)
Digital Flexibility12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (8 configurable + 1 Deep Sleep)
Package124-ball BGA (9 × 9 mm, 0.5 mm pitch), RoHS-compliant, thermal pad exposed

Pinout & Package

CY8C6347BZI-BLD43 is housed in a 124-ball BGA package (9 mm × 9 mm, 0.5 mm pitch) with an exposed thermal pad. Pin functions are defined per the Infineon PSoC™ 63 pinout specification for the BLD43 variant, supporting USB, QSPI, multiple SCBs, and Bluetooth antenna interface.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO / Smart I/O™Programmable drive modes; Boolean logic execution during Deep Sleep
P12[0]–P12[7]GPIO / CAPSENSE™Capacitive sensing with automatic SmartSense tuning and liquid tolerance
ANTRF Antenna Interface50-Ω matched differential RF output for Bluetooth LE antenna connection
USB_DP / USB_DMUSB Full-Speed InterfaceIntegrated USB PHY supporting device-mode enumeration and HID/CDC class operation
VDDIO0–VDDIO3I/O Power DomainsIndependent 1.7–3.6 V supply rails per port group for mixed-voltage interfacing
VDDD / VDDADigital/Analog Core SupplyCore voltage domains supporting dynamic scaling between 0.9 V and 1.1 V for power optimization

Key Features

FeatureDesign Value
Secure Boot ArchitectureROM-based root of trust enabling authenticated, encrypted firmware loading and execute-only memory protection
Hardware Crypto AcceleratorAccelerates AES-128/256, SHA-256, ECC-256, and TRNG generation without CPU intervention
QSPI SMIF with XIPExecute-in-place from external flash with 4-KB cache and on-the-fly AES-128 decryption
Deep Sleep Smart I/O™16 GPIOs retain Boolean logic capability (AND/OR/XOR) while system draws only 7 µA
CAPSENSE™ SubsystemSelf- and mutual-capacitance sensing with >100:1 SNR, proximity detection, and water-tolerant operation

Applications

Wearable Health MonitorSmart Home Sensor Hub

Use Scenario: Compact wrist-worn device measuring heart rate, SpO₂, and motion using optical sensors and IMU.

IC Role / Device Role / Timing Role: Dual-core MCU hosts sensor fusion algorithms on M4, runs BLE advertising/connection on M0+, and manages CAPSENSE™ button interface.

Use Value: 7 µA Deep Sleep extends battery life beyond 14 days; on-chip ADC and DAC enable direct analog sensor conditioning without external components.

Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, occupancy, and door/window status.

IC Role / Device Role / Timing Role: Central controller executing local decision logic, buffering sensor data in retained SRAM, and transmitting via BLE 5.0 to gateway.

Use Value: Concurrent BLE connections allow simultaneous pairing with mobile app and cloud gateway; Smart I/O™ processes wake-on-motion events at ultra-low power.

Industrial Predictive Maintenance NodeBLE Audio Remote Control

Use Scenario: Vibration and temperature monitoring on rotating machinery with edge FFT analysis before BLE transmission.

IC Role / Device Role / Timing Role: M4 performs real-time spectral analysis; M0+ handles BLE packetization and timing-critical UART-to-BLE bridging.

Use Value: 150-MHz M4 with FPU completes 1024-point FFT in <12 ms; hardware crypto secures firmware OTA updates over BLE.

Use Scenario: Low-latency remote control for audio systems using PDM microphone input and BLE HID profile.

IC Role / Device Role / Timing Role: Audio subsystem digitizes voice via dual PDM channels; M0+ manages HID report generation and BLE connection intervals.

Use Value: Integrated PDM/I2S eliminates external codec; 2 Mbps BLE PHY reduces audio command latency to <3 ms round-trip.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52840Single-core ARM Cortex-M4F (64 MHz), no M0+ co-processor; 1-MB flash, 256-KB RAM; lacks programmable analog/digital logicNo CAPSENSE™, no Smart I/O™, no UDBs; relies on external components for analog sensing or logic offloadPreferred when BLE throughput and RF range are primary, and programmable peripherals are unnecessary
Dialog DA1469xDual-core (Cortex-M33 + Cortex-M0), BLE 5.2, 1-MB flash, 384-KB RAM; includes PMU but no integrated SIMO buckHigher RF performance (–103 dBm RX), but no hardware crypto accelerator or CAPSENSE™ IPChosen for ultra-low-power always-on voice wake-up, where PDM preprocessing dominates power budget

Compared with nRF52840 and DA1469x, CY8C6347BZI-BLD43 uniquely combines dual-CPU power efficiency, on-die programmable analog/digital logic, and hardware-enforced security - making it optimal for integrated, sensor-rich, field-upgradable IoT endpoints where component count and firmware integrity are critical.

Availability

CY8C6347BZI-BLD43 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and BLE audio remote controls requiring stable component supply across long-lifecycle deployments.

Supply support for CY8C6347BZI-BLD43 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

CY8C6347BZI-BLD43 belongs to the PSoC™ 63 product line, designed specifically for secure, ultra-low-power IoT endpoints requiring integrated wireless connectivity, programmable analog/digital logic, and hardware-rooted trust.

FAQ

Does CY8C6347BZI-BLD43 support USB device functionality?

Yes. It integrates a full-speed USB 2.0 device interface with on-chip PHY, supporting standard device classes including HID, CDC, and MSC. USB_DP and USB_DM pins are dedicated and require no external transceiver. Enumeration and descriptor handling are supported in ModusToolbox™ middleware.

What is the maximum operating frequency of the Cortex-M4F core?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the datasheet's "CPU and Memory Subsystem" section. Frequency is derived from the PLL or FLL clock sources, and sustained operation requires proper voltage scaling (1.1 V nominal or 0.9 V low-power mode) and thermal management within the BGA package's ratings.

Can the Bluetooth LE subsystem operate independently of the application CPUs?

Yes. The Bluetooth LE subsystem contains a dedicated link-layer engine and digital PHY that run autonomously. The M0+ core typically hosts the host stack, but the link layer can maintain connections, handle advertising, and manage packet scheduling without M4 or M0+ intervention-enabling true low-power background operation.

Is CAPSENSE™ supported in Deep Sleep mode?

No. CAPSENSE™ requires active clocking and analog biasing, so it is disabled in Deep Sleep mode. However, Smart I/O™ and low-power comparators remain functional and can trigger wake-up events (e.g., button press or threshold crossing) that then activate CAPSENSE™ upon wake.

CY8C6347BZI-BLD43 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
116-WFBGA
Series:
PSOC™ 6 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347BZI-BLD43 FAQ

1.How can I place an order for CY8C6347BZI-BLD43 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD43 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347BZI-BLD43 reliable?

The price and inventory of CY8C6347BZI-BLD43 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD43 is usually 5 days.

3.What payment methods are accepted for CY8C6347BZI-BLD43?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD43 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347BZI-BLD43?

CY8C6347BZI-BLD43 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347BZI-BLD43 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347BZI-BLD43?

For technical support, including CY8C6347BZI-BLD43 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD43 requirements.

6.How does Aetrix verify that CY8C6347BZI-BLD43 is sourced from the original manufacturer or authorized distributors?

All CY8C6347BZI-BLD43 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD43 meets industry standards.

7.What is the process for return or replacement of CY8C6347BZI-BLD43?

All CY8C6347BZI-BLD43 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD43, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347BZI-BLD43 part is unused and in its original packaging.

Return procedure for CY8C6347BZI-BLD43:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347BZI-BLD43 Tags

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