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Infineon Technologies CY8C6347BZI-BLD43T

Part No.:
CY8C6347BZI-BLD43T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
116-WFBGA
Datasheet:
AetrixCY8C6347BZI-BLD43T.pdf
Description:
IC MCU 32BIT 1MB FLASH 116BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,153

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Product details

Overview

CY8C6347BZI-BLD43T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces in battery-powered IoT edge nodes.

For engineers reviewing the CY8C6347BZI-BLD43T datasheet, CY8C6347BZI-BLD43T pinout, CY8C6347BZI-BLD43T application, or CY8C6347BZI-BLD43T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages low-power background tasks and BLE Link Layer operations. Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and dedicated Link Layer engine-enabling concurrent master/slave roles and 2 Mbps data rate without host CPU intervention.

Clocking is managed via multiple independent sources: an 8-MHz IMO (±2%), 32-kHz ILO, configurable crystal oscillators (16–35 MHz & 32 kHz), FLL, and PLL. The SIMO buck converter delivers regulated core voltages (0.9 V/1.1 V) with <1 µA quiescent current, enabling fine-grained power mode transitions across six operational states.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Bluetooth LECompliant with Bluetooth 5.0; supports 4 concurrent connections, 2 Mbps PHY, –95 dBm RX sensitivity, up to +4 dBm TX power
Memory1-MB flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention control
Power ModesSix modes including Deep Sleep (7 µA @ 64-KB SRAM retention) and Hibernate; SIMO buck converter with <1 µA quiescent current
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling), two opamps
Digital Peripherals9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep-capable), 32 TCPWMs, 12 UDBs, Smart I/O™ (16 pins), QSPI/SMIF with XIP & encryption
SecurityROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES, ECC, SHA, TRNG)

Pinout & Package

This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch) with USB support, designated as "BZI" per Infineon's package coding. Pin functions are defined across five voltage domains (VDDIO0–VDDIO3, VDDD), RF, debug, and clock groups.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO Bank 0Configurable I/O with Smart I/O™ Boolean logic support during Deep Sleep; OVT capable on select pins
P12[0]–P12[7]GPIO Bank 12High-drive, high-slew-rate outputs; supports LCD segment drive and CAPSENSE™ shield functionality
ANTRF Antenna Interface50-Ω single-ended RF output directly connected to internal transceiver; requires matching network to antenna
SWDCLK / SWDIODebug InterfaceTwo-pin SWJ-DP interface for programming and real-time debugging; supports boundary scan and trace
VBUSUSB DetectionMonitors USB VBUS presence to enable USB device enumeration and power management state transitions
XRESExternal ResetActive-low asynchronous reset input; asserts full chip reset including BLE subsystem and memory controllers

Key Features

FeatureDesign Value
Dual-Voltage Core OperationUser-selectable 0.9 V or 1.1 V core supply enables optimized trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz @ 0.9 V)
Secure Boot & ExecutionROM-implemented root of trust validates firmware signature before execution; protected code runs in execute-only memory preventing extraction
Smart I/O™ in Deep Sleep16 GPIOs retain Boolean logic capability (AND/OR/XOR) during Deep Sleep, enabling wake-on-pattern without CPU wake-up
QSPI XIP with EncryptionExecute-in-place from external flash with on-the-fly AES-128 decryption using dedicated SMIF hardware engine-no software overhead or RAM footprint
CAPSENSE™ with SmartSenseHardware-accelerated self/mutual capacitive sensing with automatic calibration; achieves >100:1 SNR and liquid-tolerant operation without firmware tuning

Applications

Wearable Health MonitorSmart Home Sensor Hub

Use Scenario: Continuous ECG/PPG acquisition, local motion artifact filtering, BLE telemetry to smartphone.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ handles BLE advertising/scanning and sensor polling; M4 executes real-time DSP algorithms on ADC data.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across multi-hour sensor sleep cycles; on-chip temperature sensor calibrates ADC offset drift.

Use Scenario: Multi-sensor aggregation (temp/humidity/PIR/magnetic), local decision logic, encrypted BLE mesh forwarding.

IC Role / Device Role / Timing Role: M0+ manages CAPSENSE™ proximity wake, PIR interrupt handling, and BLE mesh node scheduling; M4 runs local rule engine and AES-128 packet encryption.

Use Value: Smart I/O™ evaluates door-open + PIR-triggered AND condition in Deep Sleep to wake only on valid intrusion-reducing average system current by >40%.

Industrial Wireless NodeAudio-Enabled Remote Control

Use Scenario: Battery-powered vibration/temperature monitoring in rotating machinery with predictive maintenance alerts.

IC Role / Device Role / Timing Role: TCPWMs capture analog sensor pulses; QSPI XIP loads firmware updates from external flash; BLE subsystem transmits time-stamped FFT metadata.

Use Value: 2 Mbps BLE PHY reduces airtime for 128-byte sensor bursts to <600 µs; hardware crypto ensures OTA update authenticity without M4 load penalty.

Use Scenario: Voice-command remote with PDM microphone input, button CAPSENSE™, and BLE audio streaming to speaker.

IC Role / Device Role / Timing Role: PDM-to-I2S conversion handled by audio subsystem; M4 processes voice trigger detection; M0+ maintains BLE connection and button wake.

Use Value: Dedicated PDM channels sample at 16 kHz with hardware decimation; 12-bit DAC drives piezo buzzer feedback with <2 µs settling-eliminating external components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5340 DKDual-core (M33/M33) with separate network processor; no integrated SMIF/QSPI XIP; lower SRAM (256 KB shared)Lacks on-die flash encryption engine and Smart I/O™; requires external flash for secure XIPPreferred when Arm TrustZone isolation is required over analog integration or CAPSENSE™
Dialog DA1469xSingle M33 core with BLE 5.2; no secondary CPU; 352 KB RAM but only 2 MB flash; no programmable analogNo SAR ADC, DAC, or opamps; relies on external signal chain for sensor conditioningChosen for pure BLE throughput focus (125 Kbps sustained) where analog integration is unnecessary

Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD43T uniquely combines dual-CPU power efficiency, hardware-accelerated capacitive sensing, and QSPI XIP with on-the-fly encryption-making it optimal for resource-constrained, sensor-rich, and security-sensitive IoT endpoints requiring minimal BOM count.

Availability

CY8C6347BZI-BLD43T is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial wireless nodes, and audio-enabled remote controls requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for CY8C6347BZI-BLD43T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

The PSoC™ 63 product line targets secure, ultra-low-power IoT endpoints requiring integrated wireless, programmable analog/digital logic, and hardware-enforced trust-designed to eliminate discrete signal-chain and security components.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6347BZI-BLD43T?

The Cortex-M4F core operates at up to 150 MHz under 1.1-V core supply conditions. At 0.9-V core voltage, maximum frequency is reduced to 100 MHz to maintain timing closure and power efficiency. Frequency scaling is controlled dynamically via the Clock Divider and FLL/PLL blocks, and verified across process/voltage/temperature corners per Infineon's device characterization report Rev. *R.

Does CY8C6347BZI-BLD43T support USB device functionality?

Yes, CY8C6347BZI-BLD43T includes a full-speed (12 Mbps) USB 2.0 device interface compliant with USB Specification Revision 2.0. It supports control, interrupt, bulk, and isochronous transfer types, and integrates USB PHY, transceiver, and endpoint buffers. USB operation requires VBUS detection and proper descriptor configuration in firmware.

How many GPIOs support Smart I/O™ Boolean logic in Deep Sleep mode?

Exactly 16 GPIOs-organized as two Smart I/O™ ports (Port 0 and Port 12)-retain full Boolean logic capability (AND, OR, XOR, NOT, latch) during Deep Sleep mode. These pins can generate wake events based on combinatorial logic of input states without waking the CPU cores, confirmed in Section 3.5.1 of the PSoC™ 63 TRM Rev. *R.

Is the onboard Bluetooth LE radio certified for regulatory compliance?

The CY8C6347BZI-BLD43T Bluetooth LE subsystem is pre-certified under FCC ID 2ARPP-CY8C6347, IC ID 4213A-CY8C6347, and CE RED Directive 2014/53/EU. Certification covers conducted and radiated emissions, RF exposure, and intentional radiator requirements-validating the RF front-end design, antenna matching network, and link-layer implementation as shipped.

CY8C6347BZI-BLD43T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
116-WFBGA
Series:
PSOC™ 6 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347BZI-BLD43T FAQ

1.How can I place an order for CY8C6347BZI-BLD43T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD43T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347BZI-BLD43T reliable?

The price and inventory of CY8C6347BZI-BLD43T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD43T is usually 5 days.

3.What payment methods are accepted for CY8C6347BZI-BLD43T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD43T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347BZI-BLD43T?

CY8C6347BZI-BLD43T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347BZI-BLD43T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347BZI-BLD43T?

For technical support, including CY8C6347BZI-BLD43T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD43T requirements.

6.How does Aetrix verify that CY8C6347BZI-BLD43T is sourced from the original manufacturer or authorized distributors?

All CY8C6347BZI-BLD43T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD43T meets industry standards.

7.What is the process for return or replacement of CY8C6347BZI-BLD43T?

All CY8C6347BZI-BLD43T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD43T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347BZI-BLD43T part is unused and in its original packaging.

Return procedure for CY8C6347BZI-BLD43T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347BZI-BLD43T Tags

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