Infineon Technologies CY8C6347BZI-BLD44

Overview

CY8C6347BZI-BLD44 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces. Used in battery-powered IoT edge nodes requiring wireless connectivity and real-time sensor processing.

For engineers reviewing the CY8C6347BZI-BLD44 datasheet, CY8C6347BZI-BLD44 pinout, CY8C6347BZI-BLD44 application, or CY8C6347BZI-BLD44 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles compute-intensive tasks (e.g., audio preprocessing, BLE stack offload) while the Cortex-M0+ manages low-power background operations (e.g., sensor polling, CAPSENSE™ scanning). Inter-processor communication uses hardware IPC channels with doorbell interrupts and shared memory.

Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated Link Layer engine supporting master/slave roles and 2 Mbps PHY. Clocking combines an 8-MHz IMO (±2%), FLL/PLL frequency synthesis, and crystal oscillators (16–35 MHz, 32 kHz).

Key Specifications

Pinout & Package

This device is packaged in a 104-ball Wafer-Level Chip-Scale Package (WLCSP), 0.4-mm pitch, 4.2 mm × 4.2 mm body size, with bottom-side thermal pad. Pin functions are defined per the Infineon CY8C6347BZI-BLD44 pinout diagram (Document No. 002-18787 Rev. *R, Page 32).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Bluetooth MCU applications.

Compared with nRF5340 DK and DA1469x, CY8C6347BZI-BLD44 uniquely combines dual-core flexibility, hardware-accelerated touch/analog, QSPI encryption, and sub-µA SIMO buck quiescent current-making it optimal for integrated, secure, sensor-rich BLE endpoints.

Availability

CY8C6347BZI-BLD44 is available at Aetrix Electronics and suitable for smart home sensor hubs, wireless medical wearables, industrial BLE gateway nodes, and capacitive touch remote controls requiring stable component supply, long-term lifecycle support, and qualified automotive/industrial-grade traceability.

Supply support for CY8C6347BZI-BLD44 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CY8C6347BZI-BLD44 belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power, wireless edge devices that integrate sensing, processing, connectivity, and human interface in a single chip.

FAQ

What is the maximum operating frequency of the Cortex-M4F core in CY8C6347BZI-BLD44?

The Cortex-M4F core operates at up to 150 MHz, confirmed in the Electrical Specifications section (Table 6-2, "CPU Frequency") of the official datasheet (002-18787 Rev. *R). This frequency is achievable when powered at 1.1 V core voltage and using the PLL clock source. At 0.9 V core, the maximum frequency is reduced to maintain timing closure and power efficiency.

Does CY8C6347BZI-BLD44 support USB device functionality?

No, CY8C6347BZI-BLD44 does not include a USB Full-Speed device interface. Per the package table in the datasheet (Page 3), this variant (BLD44 suffix) is specified for the 104-M-CSP package without USB. USB-capable variants use different part numbers (e.g., CY8C6347BZI-BLD53) and are offered only in 124-BGA or 104-M-CSP packages with USB routing.

How many simultaneous Bluetooth LE connections does the onboard radio support?

The integrated Bluetooth LE subsystem supports up to four simultaneous connections-two as master and two as slave-as stated in the "Bluetooth® Low Energy subsystem" feature list (Page 1). The Link Layer engine handles connection management, packet scheduling, and encryption independently of the application CPUs, enabling concurrent multi-role operation.

Is external flash required to use QSPI XIP functionality?

Yes, QSPI XIP requires an external quad SPI flash memory connected to the dedicated SMIF pins (e.g., IO0–IO3, SCK, SS). The internal 1-MB flash stores firmware and configuration; external flash provides additional non-volatile storage for application code or assets executed directly via XIP. On-the-fly AES-128 decryption is applied only to data read from external flash during XIP fetches.