Infineon Technologies CY8C6347BZI-BLD53
- Part No.:
- CY8C6347BZI-BLD53
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6347BZI-BLD53.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 116BGA
- Quantity:
- Payment:

- Shipping:

Inventory:6,768
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Product details
Overview
CY8C6347BZI-BLD53 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, delivers up to 4 dBm TX power, –95 dBm RX sensitivity, and supports four concurrent BLE connections in low-power Deep Sleep (7 µA with 64-KB SRAM retention). Used in battery-powered IoT edge nodes requiring secure wireless sensor aggregation.
For engineers reviewing the CY8C6347BZI-BLD53 datasheet, CY8C6347BZI-BLD53 pinout, CY8C6347BZI-BLD53 application, or CY8C6347BZI-BLD53 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency, QSPI XIP with hardware encryption, CAPSENSE™ liquid-tolerant touch, and ROM-based Secure Boot for firmware integrity.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles compute-intensive tasks (e.g., audio processing, protocol stacks) while the Cortex-M0+ manages real-time BLE link-layer operations and peripheral control. Both cores share memory-mapped peripherals via a high-bandwidth interconnect and coordinate via IPC and dual-channel DMA.
Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver with digital PHY, hardware-accelerated Link Layer engine, and configurable TX power (–20 to +4 dBm), enabling certified BLE 5.0 operation including 2 Mbps data rate and long-range coded PHY support without host CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| BLE Compliance | Bluetooth 5.0 certified; supports master/slave modes, 4 simultaneous connections, 2 Mbps PHY |
| Memory | 1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 32 TCPWM blocks |
| Security | ROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES/SHA/RSA/TRNG) |
Pinout & Package
This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch), designated as "BZI" per Infineon's package coding. The package supports USB interface and includes dedicated RF matching pins, antenna feed (ANT), and differential RFIO lines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V comms) |
| RFIO_P / RFIO_N | Differential RF Transceiver Output | Direct connection to balun or matching network; requires controlled 50-Ω impedance routing |
| ANT | Single-Ended Antenna Interface | Alternative antenna path when using integrated single-ended RF driver; bypasses balun requirement |
| SWDCK / SWDIO | ARM Serial Wire Debug Interface | Two-pin debug port supporting programming, real-time trace, and secure debug disable via eFuse |
| XTAL32K_IN / XTAL32K_OUT | 32.768-kHz Crystal Oscillator Terminals | Drive external watch crystal for RTC accuracy; supports load capacitance tuning via internal caps (12.5 pF default) |
Key Features
| Feature | Design Value |
|---|---|
| Secure Dual-Core Boot | ROM-resident Secure Boot validates signed firmware images before M0+ execution, preventing unauthorized code injection |
| Hardware BLE Link Layer | Dedicated Link Layer engine offloads connection management, advertising, and scanning-freeing both CPUs for application logic |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption, eliminating boot-time flash copy and reducing attack surface |
| CAPSENSE™ SmartSense | Self-calibrating capacitive sensing with automatic SNR optimization and liquid-tolerant algorithm-no manual tuning required |
| Smart I/O™ in Deep Sleep | 16 GPIOs grouped into two Smart I/O ports perform Boolean logic (AND/OR/XOR) autonomously during Deep Sleep, enabling wake-on-pattern detection |
Applications
| Wireless Sensor Node | Smart Home Hub |
|---|---|
Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting encrypted telemetry every 5 seconds via BLE to gateway. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion, BLE advertising, and ultra-low-power scheduling with 32-kHz RTC wake-up. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across 5-sec intervals; dual-core enables concurrent sensor read + BLE packet prep without latency. | Use Scenario: Central hub aggregating BLE, Zigbee, and Thread devices, bridging to Wi-Fi cloud uplink. IC Role / Device Role / Timing Role: BLE 5.0 central controller managing four concurrent peripheral connections while hosting ModusToolbox™ middleware stack. Use Value: Hardware Link Layer supports 4 simultaneous BLE links at 2 Mbps; QSPI XIP with encryption secures OTA firmware updates from external flash. |
| Wearable Health Monitor | Industrial Asset Tag |
Use Scenario: Chest-worn ECG patch sampling PDM microphone and analog front-end, streaming processed biometrics via BLE. IC Role / Device Role / Timing Role: Real-time signal processor (M4F) running filtering algorithms; M0+ handles BLE GATT server and CAPSENSE™ button interface. Use Value: Integrated PDM/I2S audio subsystem eliminates external codec; 12-bit SAR ADC with 16-channel sequencer captures multi-sensor analog inputs synchronously. | Use Scenario: Ruggedized tag monitoring vibration, temperature, and orientation on rotating machinery, reporting via periodic BLE broadcast. IC Role / Device Role / Timing Role: Low-power edge node performing FFT-based vibration analysis, storing logs in retained SRAM, and broadcasting status via BLE advertising packets. Use Value: 22 µA/MHz M4 efficiency at 0.9 V enables sustained 20-MHz processing during analysis; Smart I/O™ detects mechanical impact events in Deep Sleep to trigger wake-up. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core (M33/M33) with separate network core; no integrated SMIF/QSPI XIP; lower max TX power (+2 dBm) | Lacks hardware-accelerated CAPSENSE™ and programmable analog; requires external ADC for multi-channel sensing | Preferred for pure BLE mesh or Thread coexistence; less suitable for analog-rich sensor fusion without external components |
| Dialog DA1469x | Single M33 core with dedicated BLE controller; 128-KB RAM only; no dual-CPU IPC or UDB programmability | No programmable logic or Smart I/O™; limited analog (10-bit ADC, no DAC); no hardware crypto acceleration beyond AES | Better for cost-sensitive, low-compute BLE beacons; insufficient for concurrent real-time processing + BLE + analog acquisition |
Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD53 uniquely combines dual-application cores, hardware BLE link layer, programmable analog/digital fabric, and ROM-secured boot-enabling single-chip implementation of secure, sensor-dense, low-power wireless endpoints without external peripherals.
Availability
CY8C6347BZI-BLD53 is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home hubs, wearable health monitors, and industrial asset tags requiring stable component supply, long-term lifecycle support, and qualified automotive-grade traceability.
Supply support for CY8C6347BZI-BLD53 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, security, and embedded control solutions for industrial, automotive, and IoT markets.
This part belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power, wireless-enabled edge devices that integrate heterogeneous processing, analog sensing, and BLE connectivity in a single chip.
FAQ
Does CY8C6347BZI-BLD53 support over-the-air (OTA) firmware updates via BLE?
Yes. The device supports secure OTA updates using its ROM-based Secure Boot and flash partitioning (application flash, AUXflash, SFlash). Firmware images are validated cryptographically before execution, and the QSPI XIP interface allows encrypted update payloads to be streamed directly from external flash without full image buffering in SRAM.
What is the maximum allowed clock frequency for the Cortex-M4F core?
The Cortex-M4F core is rated for operation up to 150 MHz. This maximum frequency is achievable when powered at 1.1 V core voltage and using the PLL clock source. At 0.9 V core voltage, the maximum supported frequency is reduced to 100 MHz to maintain timing closure and power efficiency.
Can the Smart I/O™ blocks operate independently during Deep Sleep mode?
Yes. Two Smart I/O™ ports (16 GPIOs total) remain fully functional in Deep Sleep mode, executing Boolean logic (AND, OR, XOR, NOT) on input signals without waking either CPU. This enables wake-on-pattern detection-for example, triggering a wake event when three specific buttons are pressed simultaneously.
Is external flash required to use the QSPI XIP feature?
Yes. QSPI XIP requires an external quad-SPI flash memory connected to the dedicated QSPI pins (e.g., IO[0]–IO[5], SCLK, HOLD, WP). The on-chip 1-MB flash cannot be used for XIP; it serves only for primary firmware storage and executes from internal buses. External flash must support octal or quad protocols up to 640 Mbps throughput.
CY8C6347BZI-BLD53 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347BZI-BLD53 FAQ
1.How can I place an order for CY8C6347BZI-BLD53 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD53 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347BZI-BLD53 reliable?
The price and inventory of CY8C6347BZI-BLD53 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD53 is usually 5 days.
3.What payment methods are accepted for CY8C6347BZI-BLD53?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD53 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347BZI-BLD53?
CY8C6347BZI-BLD53 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347BZI-BLD53 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347BZI-BLD53?
For technical support, including CY8C6347BZI-BLD53 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD53 requirements.
6.How does Aetrix verify that CY8C6347BZI-BLD53 is sourced from the original manufacturer or authorized distributors?
All CY8C6347BZI-BLD53 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD53 meets industry standards.
7.What is the process for return or replacement of CY8C6347BZI-BLD53?
All CY8C6347BZI-BLD53 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD53, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347BZI-BLD53 part is unused and in its original packaging.
Return procedure for CY8C6347BZI-BLD53:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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