Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C6347BZI-BLD53

Part No.:
CY8C6347BZI-BLD53
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
116-WFBGA
Datasheet:
AetrixCY8C6347BZI-BLD53.pdf
Description:
IC MCU 32BIT 1MB FLASH 116BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,768

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C6347BZI-BLD53 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, delivers up to 4 dBm TX power, –95 dBm RX sensitivity, and supports four concurrent BLE connections in low-power Deep Sleep (7 µA with 64-KB SRAM retention). Used in battery-powered IoT edge nodes requiring secure wireless sensor aggregation.

For engineers reviewing the CY8C6347BZI-BLD53 datasheet, CY8C6347BZI-BLD53 pinout, CY8C6347BZI-BLD53 application, or CY8C6347BZI-BLD53 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency, QSPI XIP with hardware encryption, CAPSENSE™ liquid-tolerant touch, and ROM-based Secure Boot for firmware integrity.

Technical Context

The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles compute-intensive tasks (e.g., audio processing, protocol stacks) while the Cortex-M0+ manages real-time BLE link-layer operations and peripheral control. Both cores share memory-mapped peripherals via a high-bandwidth interconnect and coordinate via IPC and dual-channel DMA.

Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver with digital PHY, hardware-accelerated Link Layer engine, and configurable TX power (–20 to +4 dBm), enabling certified BLE 5.0 operation including 2 Mbps data rate and long-range coded PHY support without host CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches
BLE ComplianceBluetooth 5.0 certified; supports master/slave modes, 4 simultaneous connections, 2 Mbps PHY
Memory1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention
Power Efficiency7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling)
Digital Flexibility12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 32 TCPWM blocks
SecurityROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES/SHA/RSA/TRNG)

Pinout & Package

This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch), designated as "BZI" per Infineon's package coding. The package supports USB interface and includes dedicated RF matching pins, antenna feed (ANT), and differential RFIO lines.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO3I/O Power Supply BanksIndependent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V comms)
RFIO_P / RFIO_NDifferential RF Transceiver OutputDirect connection to balun or matching network; requires controlled 50-Ω impedance routing
ANTSingle-Ended Antenna InterfaceAlternative antenna path when using integrated single-ended RF driver; bypasses balun requirement
SWDCK / SWDIOARM Serial Wire Debug InterfaceTwo-pin debug port supporting programming, real-time trace, and secure debug disable via eFuse
XTAL32K_IN / XTAL32K_OUT32.768-kHz Crystal Oscillator TerminalsDrive external watch crystal for RTC accuracy; supports load capacitance tuning via internal caps (12.5 pF default)

Key Features

FeatureDesign Value
Secure Dual-Core BootROM-resident Secure Boot validates signed firmware images before M0+ execution, preventing unauthorized code injection
Hardware BLE Link LayerDedicated Link Layer engine offloads connection management, advertising, and scanning-freeing both CPUs for application logic
QSPI XIP with EncryptionExecute-in-place from external flash with on-the-fly AES-128 decryption, eliminating boot-time flash copy and reducing attack surface
CAPSENSE™ SmartSenseSelf-calibrating capacitive sensing with automatic SNR optimization and liquid-tolerant algorithm-no manual tuning required
Smart I/O™ in Deep Sleep16 GPIOs grouped into two Smart I/O ports perform Boolean logic (AND/OR/XOR) autonomously during Deep Sleep, enabling wake-on-pattern detection

Applications

Wireless Sensor NodeSmart Home Hub

Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting encrypted telemetry every 5 seconds via BLE to gateway.

IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion, BLE advertising, and ultra-low-power scheduling with 32-kHz RTC wake-up.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context across 5-sec intervals; dual-core enables concurrent sensor read + BLE packet prep without latency.

Use Scenario: Central hub aggregating BLE, Zigbee, and Thread devices, bridging to Wi-Fi cloud uplink.

IC Role / Device Role / Timing Role: BLE 5.0 central controller managing four concurrent peripheral connections while hosting ModusToolbox™ middleware stack.

Use Value: Hardware Link Layer supports 4 simultaneous BLE links at 2 Mbps; QSPI XIP with encryption secures OTA firmware updates from external flash.

Wearable Health MonitorIndustrial Asset Tag

Use Scenario: Chest-worn ECG patch sampling PDM microphone and analog front-end, streaming processed biometrics via BLE.

IC Role / Device Role / Timing Role: Real-time signal processor (M4F) running filtering algorithms; M0+ handles BLE GATT server and CAPSENSE™ button interface.

Use Value: Integrated PDM/I2S audio subsystem eliminates external codec; 12-bit SAR ADC with 16-channel sequencer captures multi-sensor analog inputs synchronously.

Use Scenario: Ruggedized tag monitoring vibration, temperature, and orientation on rotating machinery, reporting via periodic BLE broadcast.

IC Role / Device Role / Timing Role: Low-power edge node performing FFT-based vibration analysis, storing logs in retained SRAM, and broadcasting status via BLE advertising packets.

Use Value: 22 µA/MHz M4 efficiency at 0.9 V enables sustained 20-MHz processing during analysis; Smart I/O™ detects mechanical impact events in Deep Sleep to trigger wake-up.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5340 DKDual-core (M33/M33) with separate network core; no integrated SMIF/QSPI XIP; lower max TX power (+2 dBm)Lacks hardware-accelerated CAPSENSE™ and programmable analog; requires external ADC for multi-channel sensingPreferred for pure BLE mesh or Thread coexistence; less suitable for analog-rich sensor fusion without external components
Dialog DA1469xSingle M33 core with dedicated BLE controller; 128-KB RAM only; no dual-CPU IPC or UDB programmabilityNo programmable logic or Smart I/O™; limited analog (10-bit ADC, no DAC); no hardware crypto acceleration beyond AESBetter for cost-sensitive, low-compute BLE beacons; insufficient for concurrent real-time processing + BLE + analog acquisition

Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD53 uniquely combines dual-application cores, hardware BLE link layer, programmable analog/digital fabric, and ROM-secured boot-enabling single-chip implementation of secure, sensor-dense, low-power wireless endpoints without external peripherals.

Availability

CY8C6347BZI-BLD53 is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home hubs, wearable health monitors, and industrial asset tags requiring stable component supply, long-term lifecycle support, and qualified automotive-grade traceability.

Supply support for CY8C6347BZI-BLD53 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, security, and embedded control solutions for industrial, automotive, and IoT markets.

This part belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power, wireless-enabled edge devices that integrate heterogeneous processing, analog sensing, and BLE connectivity in a single chip.

FAQ

Does CY8C6347BZI-BLD53 support over-the-air (OTA) firmware updates via BLE?

Yes. The device supports secure OTA updates using its ROM-based Secure Boot and flash partitioning (application flash, AUXflash, SFlash). Firmware images are validated cryptographically before execution, and the QSPI XIP interface allows encrypted update payloads to be streamed directly from external flash without full image buffering in SRAM.

What is the maximum allowed clock frequency for the Cortex-M4F core?

The Cortex-M4F core is rated for operation up to 150 MHz. This maximum frequency is achievable when powered at 1.1 V core voltage and using the PLL clock source. At 0.9 V core voltage, the maximum supported frequency is reduced to 100 MHz to maintain timing closure and power efficiency.

Can the Smart I/O™ blocks operate independently during Deep Sleep mode?

Yes. Two Smart I/O™ ports (16 GPIOs total) remain fully functional in Deep Sleep mode, executing Boolean logic (AND, OR, XOR, NOT) on input signals without waking either CPU. This enables wake-on-pattern detection-for example, triggering a wake event when three specific buttons are pressed simultaneously.

Is external flash required to use the QSPI XIP feature?

Yes. QSPI XIP requires an external quad-SPI flash memory connected to the dedicated QSPI pins (e.g., IO[0]–IO[5], SCLK, HOLD, WP). The on-chip 1-MB flash cannot be used for XIP; it serves only for primary firmware storage and executes from internal buses. External flash must support octal or quad protocols up to 640 Mbps throughput.

CY8C6347BZI-BLD53 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
116-WFBGA
Series:
PSOC™ 6 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347BZI-BLD53 FAQ

1.How can I place an order for CY8C6347BZI-BLD53 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD53 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347BZI-BLD53 reliable?

The price and inventory of CY8C6347BZI-BLD53 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD53 is usually 5 days.

3.What payment methods are accepted for CY8C6347BZI-BLD53?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD53 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347BZI-BLD53?

CY8C6347BZI-BLD53 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347BZI-BLD53 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347BZI-BLD53?

For technical support, including CY8C6347BZI-BLD53 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD53 requirements.

6.How does Aetrix verify that CY8C6347BZI-BLD53 is sourced from the original manufacturer or authorized distributors?

All CY8C6347BZI-BLD53 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD53 meets industry standards.

7.What is the process for return or replacement of CY8C6347BZI-BLD53?

All CY8C6347BZI-BLD53 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD53, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347BZI-BLD53 part is unused and in its original packaging.

Return procedure for CY8C6347BZI-BLD53:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347BZI-BLD53 Tags

  • CY8C6347BZI-BLD53
  • CY8C6347BZI-BLD53 PDF
  • CY8C6347BZI-BLD53 Datasheet
  • CY8C6347BZI-BLD53 Specifications
  • CY8C6347BZI-BLD53 Images
  • Infineon Technologies
  • Infineon Technologies CY8C6347BZI-BLD53
  • Buy CY8C6347BZI-BLD53
  • CY8C6347BZI-BLD53 Price
  • CY8C6347BZI-BLD53 Distributor
  • CY8C6347BZI-BLD53 Supplier
  • CY8C6347BZI-BLD53 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER