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Infineon Technologies CY8C6347BZI-BLD53T
- Part No.:
- CY8C6347BZI-BLD53T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 116-WFBGA
- Datasheet:
-
CY8C6347BZI-BLD53T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 116BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,452
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Product details
Overview
CY8C6347BZI-BLD53T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports QSPI XIP with on-the-fly encryption-targeted for secure, battery-powered IoT edge nodes.
For engineers reviewing the CY8C6347BZI-BLD53T datasheet, CY8C6347BZI-BLD53T pinout, CY8C6347BZI-BLD53T application, or CY8C6347BZI-BLD53T equivalent, key selection criteria include Bluetooth LE 5.0 link-layer concurrency (4 connections), dual-voltage core operation (0.9 V / 1.1 V), SIMO buck converter quiescent current (<1 µA), and CAPSENSE™ liquid-tolerant proximity sensing capability.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and low-power background operations. Inter-processor communication (IPC) and shared memory enable deterministic task handoff without bus contention.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX power up to +4 dBm, and hardware-accelerated Link Layer supporting simultaneous master/slave roles. The on-chip SIMO DC-DC converter delivers regulated voltages to CPU, BLE, and analog domains with sub-µA quiescent current in Deep Sleep.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| BLE Radio | Bluetooth 5.0-compliant; –95 dBm RX sensitivity; +4 dBm max TX power; 4 concurrent connections |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 @ 0.9 V; SIMO buck <1 µA IQ |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two LP comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), 9 SCBs (8 configurable as SPI/I²C/UART), Smart I/O for GPIO Boolean logic in Deep Sleep |
Pinout & Package
This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch) with USB support, per Infineon's CY8C63x7 package mapping. Pin functions are defined by configurable hardware resources-not fixed-peripheral assignment-and require firmware-defined routing via PSoC Creator or ModusToolbox™.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Rails | Independent 1.7–3.6 V supplies per port group; enable mixed-voltage interfacing and isolation |
| VDDD | Digital Core Supply | Supplies Cortex-M4F/M0+ cores and digital logic; connects to internal SIMO buck output |
| VDDR | RF & BLE Analog Supply | Low-noise supply for BLE transceiver and RF front-end; requires dedicated filtering |
| P0.0–P15.7 | Programmable GPIO | 84 total pins; six overvoltage-tolerant (OVT); Smart I/O available on two 16-pin ports for Deep Sleep logic |
| XTAL_IN/XTAL_OUT | External Crystal Interface | Supports 16–35 MHz crystals for high-accuracy clocking; optional 32-kHz crystal for RTC |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with ROM Root of Trust | Immutable boot validation prevents unauthorized firmware execution; enables field-upgradable trusted images |
| Hardware Cryptography Accelerator | Accelerates AES-128/256, SHA-256, ECC-256, and TRNG-reducing latency for TLS handshake and OTA updates |
| CAPSENSE™ with SmartSense | Self-tuning capacitive sensing with >100:1 SNR and liquid tolerance-enables reliable touch sliders and proximity wake in wet environments |
| QSPI SMIF with XIP + Encryption | Execute code directly from external flash with real-time AES-128 decryption-eliminates need for large internal RAM footprint |
| Deep Sleep SCB | Single I²C/SPI block remains active in Deep Sleep-allows sensor polling or BLE advertising without waking CPUs |
Applications
| Smart Wearable Sensor Hub | Secure BLE Gateway |
|---|---|
Use Scenario: Wrist-worn health monitor collecting ECG, temperature, and motion data with local preprocessing and encrypted BLE transmission. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion on M4F while M0+ handles BLE advertising/connection and RTC-triggered sampling. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to >14 days on coin cell; CAPSENSE™ enables water-resistant touch interface. | Use Scenario: Industrial asset tracker aggregating LoRaWAN sensor data and relaying it via BLE 5.0 to nearby smartphones or gateways. IC Role / Device Role / Timing Role: M0+ runs BLE Link Layer for four concurrent peripheral connections; M4F processes LoRa packet headers and applies AES-128 encryption before relay. Use Value: Hardware crypto accelerator reduces encryption overhead by 90% vs. software-only; SIMO buck enables stable 1.1-V core supply from fading 2.4-V primary battery. |
| Capacitive Control Panel | Audio-Enabled Edge Node |
Use Scenario: Appliance control panel requiring waterproof, gesture-capable touch interface with LED feedback and motor control. IC Role / Device Role / Timing Role: CAPSENSE™ drives self/mutual sensing on 83-segment LCD; TCPWM blocks generate PWM for RGB LEDs and motor drivers. Use Value: SmartSense auto-calibration eliminates factory tuning; 124-BGA package allows compact layout with dedicated VDDR filtering for noise-sensitive analog sensing. | Use Scenario: Voice-controlled smart speaker node capturing far-field audio via PDM mics and streaming processed commands over BLE. IC Role / Device Role / Timing Role: Two PDM receivers feed audio to M4F DSP routines; I2S/TDM interface routes processed voice to external codec or speaker driver. Use Value: Dedicated PDM hardware offloads 100% of mic sampling from CPU; 288-KB SRAM accommodates 200-ms audio buffers without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core (M33/M33) with separate network processor; no integrated SIMO buck; 512-KB flash | Lacks programmable analog (ADC/DAC/opamps) and CAPSENSE™; higher active current (12 µA/MHz M33 @ 1.1 V) | Prefer when BLE mesh networking or Thread coexistence is required over analog integration |
| Dialog DA1469x | Single M33 core with BLE 5.2; 1-MB flash; no secondary CPU; integrated buck but no SIMO topology | No dual-CPU IPC or hardware crypto acceleration; limited analog (no DAC, one comparator) | Prefer for cost-sensitive BLE beacons where dual-core RTOS partitioning is unnecessary |
Compared with nRF5340 and DA1469x, CY8C6347BZI-BLD53T uniquely combines dual-Arm cores, hardware-accelerated cryptography, programmable analog/digital fabric, and ultra-low-power SIMO regulation-making it optimal for feature-rich, battery-constrained IoT endpoints requiring local decision-making and secure wireless telemetry.
Availability
CY8C6347BZI-BLD53T is available at Aetrix Electronics and suitable for smart wearables, industrial BLE gateways, capacitive control panels, and audio-enabled edge nodes requiring stable component supply across multi-year production cycles.
Supply support for CY8C6347BZI-BLD53T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
The PSoC™ 63 product line was designed to deliver secure, ultra-low-power, and highly configurable MCUs for resource-constrained IoT endpoints-integrating BLE 5.0, programmable analog/digital logic, and hardware security into a single die.
FAQ
What debug interfaces does CY8C6347BZI-BLD53T support?
The device supports SWD (Serial Wire Debug) and JTAG via the SWJ-DP interface. Its 32-bit JTAG ID encodes die revision, part number ("E4B0"), and manufacturer ID ("069"). Debug access can be permanently disabled via eFuse to enforce secure boot enforcement and prevent reverse engineering during mass production.
Does CY8C6347BZI-BLD53T support external memory expansion?
Yes-it features a Quad SPI Serial Memory Interface (SMIF) supporting XIP from external flash with on-the-fly AES-128 decryption. It supports single/dual/quad/octal modes up to 640 Mbps and includes a 4-KB cache to reduce latency and power consumption during code execution from external memory.
How is Bluetooth LE coexistence managed with other RF systems?
The BLE radio uses a dedicated VDDR supply rail and internal LDO filtering to isolate analog noise. Its 2.4-GHz transceiver includes RSSI monitoring (4-dB resolution) and adaptive channel selection logic compliant with Bluetooth 5.0 LE Adaptive Frequency Hopping-enabling robust operation alongside Wi-Fi or Zigbee in dense RF environments.
Can CAPSENSE™ operate during Deep Sleep mode?
Yes-CAPSENSE™ can run in Deep Sleep using the low-power comparators and dedicated sensing sequencer. It supports automatic wake-on-touch with hardware-based baseline tracking and noise rejection, consuming less than 10 µA total while maintaining full liquid tolerance and >100:1 SNR without CPU intervention.
CY8C6347BZI-BLD53T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 116-WFBGA
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347BZI-BLD53T FAQ
1.How can I place an order for CY8C6347BZI-BLD53T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD53T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347BZI-BLD53T reliable?
The price and inventory of CY8C6347BZI-BLD53T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD53T is usually 5 days.
3.What payment methods are accepted for CY8C6347BZI-BLD53T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD53T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347BZI-BLD53T?
CY8C6347BZI-BLD53T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347BZI-BLD53T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347BZI-BLD53T?
For technical support, including CY8C6347BZI-BLD53T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD53T requirements.
6.How does Aetrix verify that CY8C6347BZI-BLD53T is sourced from the original manufacturer or authorized distributors?
All CY8C6347BZI-BLD53T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD53T meets industry standards.
7.What is the process for return or replacement of CY8C6347BZI-BLD53T?
All CY8C6347BZI-BLD53T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD53T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347BZI-BLD53T part is unused and in its original packaging.
Return procedure for CY8C6347BZI-BLD53T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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