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Infineon Technologies CY8C6347BZI-BLD54

Part No.:
CY8C6347BZI-BLD54
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
124-VFBGA
Datasheet:
AetrixCY8C6347BZI-BLD54.pdf
Description:
IC MCU 32BIT 1MB FLASH 124BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,486

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Product details

Overview

CY8C6347BZI-BLD54 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports QSPI XIP with hardware encryption-targeted for secure, battery-powered IoT edge nodes requiring concurrent processing and wireless connectivity.

For engineers reviewing the CY8C6347BZI-BLD54 datasheet, CY8C6347BZI-BLD54 pinout, CY8C6347BZI-BLD54 application, or CY8C6347BZI-BLD54 equivalent, key selection considerations include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), SAR ADC performance (12-bit, 1-Msps, 16-channel sequencer), and Smart I/O™ availability in Deep Sleep mode.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and low-power system orchestration. Inter-processor communication occurs via dedicated IPC channels with hardware semaphore support and shared memory regions protected by MPU.

Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a hardware-accelerated Link Layer engine supporting master/slave roles and 2 Mbps PHY-enabling robust, low-latency wireless sensor networking without host CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply
Memory1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse
Bluetooth LECompliant with BLE 5.0; –95 dBm RX sensitivity, +4 dBm max TX power, 4 concurrent connections
ADC12-bit SAR ADC, 1-Msps sampling rate, 16-channel hardware sequencer with averaging
Power Efficiency7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core
QSPI/SMIFExecute-in-place from external flash with on-the-fly AES-128 encryption and 4-KB cache
GPIO & I/OUp to 84 programmable GPIOs; two Smart I/O™ ports (16 pins) operable in Deep Sleep with Boolean logic

Pinout & Package

This device is packaged in a 124-ball BGA (9 × 9 mm, 0.5-mm pitch), designated as "BZI" per Infineon's package coding. The package supports USB functionality and includes dedicated RF matching pins, high-speed digital I/O banks, and separate analog/digital power domains.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO3I/O Power Supply BanksIndependent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing and noise isolation
VDDD/VDDADigital/Analog Core SupplySeparate regulated domains for digital logic and precision analog circuits to minimize coupling noise
RF_IN/RF_OUTBluetooth RF InterfaceDifferential 50-Ω RF port; requires external matching network for antenna connection
SWDCK/SWDIODebug Interface2-pin SWD interface supporting programming, debug, and boundary scan; accessible during all non-Hibernate modes
P0[0]–P15[7]Programmable GPIOConfigurable drive strength, slew rate, and pull-up/down; six pins are overvoltage-tolerant (up to 5.5 V)
XTAL32K_IN/OUT32-kHz Crystal OscillatorConnects to external 32.768-kHz crystal for RTC and low-power timing; internal load caps configurable

Key Features

FeatureDesign Value
Dual-CPU Power GatingIndependent voltage scaling (0.9 V / 1.1 V) and clock gating per core enables dynamic power optimization across workloads
Hardware Crypto AcceleratorAccelerates AES-128/256, SHA-256, ECC-256, and TRNG-offloading secure boot, OTA updates, and BLE pairing
CAPSENSE™ with SmartSenseSelf-calibrating capacitive sensing with liquid tolerance and proximity detection; no firmware tuning required
Smart I/O™ in Deep Sleep16 GPIOs retain Boolean logic (AND/OR/XOR) and event routing capability while main CPU is powered down
USB Full-Speed DeviceIntegrated USB 2.0 FS PHY with endpoint buffers and descriptor handling-supports HID, CDC, and MSC classes

Applications

Wearable Health MonitorSmart Home Sensor Hub

Use Scenario: Continuous ECG/PPG acquisition with local feature extraction and BLE transmission to smartphone.

IC Role / Device Role / Timing Role: Dual-core MCU performs real-time signal filtering on M4 while M0+ handles BLE advertising, connection management, and power state coordination.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention preserves context between sensor bursts; CAPSENSE™ enables touchless wake-on-approach.

Use Scenario: Multi-sensor node (temp/humidity/PIR/magnetic) aggregating data and relaying via BLE mesh to gateway.

IC Role / Device Role / Timing Role: M0+ executes BLE mesh stack and sensor polling; M4 runs lightweight ML inference for occupancy classification.

Use Value: Four concurrent BLE connections allow direct peer-to-peer relay; Smart I/O™ processes PIR edge events without waking CPU.

Industrial Predictive Maintenance NodeSecure Asset Tracker

Use Scenario: Vibration and temperature monitoring on rotating equipment with local FFT analysis and anomaly flagging.

IC Role / Device Role / Timing Role: M4 executes fixed-point FFT and threshold comparison; M0+ manages BLE connection, watchdog supervision, and low-power timer scheduling.

Use Value: 1-Msps SAR ADC captures wideband vibration spectra; hardware crypto ensures signed firmware updates and encrypted telemetry.

Use Scenario: GPS-denied indoor tracking using BLE RSSI triangulation and motion-triggered location logging.

IC Role / Device Role / Timing Role: M0+ controls accelerometer wake interrupts and BLE scanning; M4 processes motion vectors and encrypts location stamps.

Use Value: 4-dB RSSI resolution enables sub-meter proximity estimation; OTP eFuse stores unique device identity for cloud authentication.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52840Single-core ARM Cortex-M4F (64 MHz), no M0+ companion; 1-MB flash, 256-KB RAM; lacks programmable analog/digital blocksNo on-chip CAPSENSE™, Smart I/O™, or UDB-based peripheral customization; relies on software-defined peripheralsPreferred when BLE throughput and RF coexistence are primary; less suitable for mixed-signal sensor fusion without external components
Dialog DA1469xDual-core (Cortex-M33 + M0), 2.4 GHz BLE 5.2, 1-MB flash, 384-KB RAM; includes dedicated audio DSP but no SAR ADC or opampsOptimized for voice/audio edge processing; lacks integrated high-precision analog front-end and LCD driversBetter for voice-enabled devices; CY8C6347BZI-BLD54 preferred when analog sensing, LCD display, or hardware-programmable logic are required

Compared with nRF52840 and DA1469x, CY8C6347BZI-BLD54 uniquely integrates programmable analog (SAR ADC, opamps, comparators), programmable digital (UDBs, Smart I/O™), and dual-CPU power management-enabling single-chip sensor fusion, UI control, and secure BLE connectivity without external support ICs.

Availability

CY8C6347BZI-BLD54 is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, industrial predictive maintenance nodes, and secure asset trackers requiring stable component supply, long-term lifecycle assurance, and qualified traceable sourcing.

Supply support for CY8C6347BZI-BLD54 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.

CY8C6347BZI-BLD54 belongs to the PSoC™ 63 product line-designed specifically for ultra-low-power, secure, and sensor-rich IoT endpoints that demand integrated wireless, analog, and programmable logic in a single chip.

FAQ

Does CY8C6347BZI-BLD54 support USB device functionality?

Yes, it integrates a full-speed USB 2.0 device interface with on-chip PHY, endpoint buffers, and descriptor handling. It supports standard device classes including HID, CDC, and MSC without external transceivers. USB operation requires VBUS detection and is compatible with 3.3-V I/O signaling.

What is the maximum operating frequency of the Cortex-M4F core?

The Cortex-M4F core operates at up to 150 MHz, enabled by the on-chip PLL or FLL clock sources. Frequency stability is maintained across voltage (0.9–1.1 V) and temperature (–40°C to +85°C) ranges per datasheet specifications, with dynamic voltage/frequency scaling supported in firmware.

Can the SAR ADC perform continuous conversions without CPU intervention?

Yes-the 12-bit SAR ADC supports hardware-triggered, sequenced conversions with automatic channel scanning, result averaging, and DMA transfer. It can operate autonomously using timers or digital signals, storing results directly to SRAM while both CPUs remain in Deep Sleep mode.

Is the Bluetooth LE subsystem certified for regulatory compliance?

Yes, the integrated Bluetooth LE radio has completed FCC, IC, CE, and Telec certifications as part of the CY8C6347BZI-BLD54 module-level qualification. Certified RF parameters-including conducted output power, spurious emissions, and radiated performance-are documented in Infineon's official certification reports (e.g., FCC ID: 2AC7Z-CY8C6347).

CY8C6347BZI-BLD54 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
124-VFBGA
Series:
PSOC™ 6 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347BZI-BLD54 FAQ

1.How can I place an order for CY8C6347BZI-BLD54 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347BZI-BLD54 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347BZI-BLD54 reliable?

The price and inventory of CY8C6347BZI-BLD54 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347BZI-BLD54 is usually 5 days.

3.What payment methods are accepted for CY8C6347BZI-BLD54?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347BZI-BLD54 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347BZI-BLD54?

CY8C6347BZI-BLD54 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347BZI-BLD54 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347BZI-BLD54?

For technical support, including CY8C6347BZI-BLD54 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347BZI-BLD54 requirements.

6.How does Aetrix verify that CY8C6347BZI-BLD54 is sourced from the original manufacturer or authorized distributors?

All CY8C6347BZI-BLD54 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347BZI-BLD54 meets industry standards.

7.What is the process for return or replacement of CY8C6347BZI-BLD54?

All CY8C6347BZI-BLD54 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347BZI-BLD54, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347BZI-BLD54 part is unused and in its original packaging.

Return procedure for CY8C6347BZI-BLD54:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347BZI-BLD54 Tags

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