My Inquiry
My Account
Infineon Technologies CY8C6347FMI-BLD13T
- Part No.:
- CY8C6347FMI-BLD13T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 104-UFBGA, WLCSP
- Datasheet:
-
CY8C6347FMI-BLD13T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 104WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,910
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C6347FMI-BLD13T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates at 150 MHz (M4) and 100 MHz (M0+), supports 1.7–3.6 V supply, and delivers –95 dBm RX sensitivity and 4 dBm TX power for secure IoT edge nodes.
For engineers reviewing the CY8C6347FMI-BLD13T datasheet, CY8C6347FMI-BLD13T pinout, CY8C6347FMI-BLD13T application, or CY8C6347FMI-BLD13T equivalent, key selection factors include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency (4 connections), QSPI XIP with hardware encryption, and CAPSENSE™ liquid-tolerant touch capability.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power system supervision. Its Bluetooth subsystem includes a 2.4-GHz RF transceiver with digital PHY, hardware-accelerated Link Layer engine, and integrated SIMO buck converter enabling 7 µA Deep Sleep with 64-KB SRAM retention.
Programmable resources include twelve Universal Digital Blocks (UDBs) for custom logic, Smart I/O™ for Boolean operations during Deep Sleep, and a 12-bit SAR ADC with 16-channel sequencer and hardware averaging - all coordinated via a centralized trigger-routing fabric and IPC messaging between cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| BLE Radio | Bluetooth 5.0-compliant 2.4-GHz transceiver; –95 dBm RX sensitivity, 4 dBm programmable TX output, 4 concurrent connections |
| Memory | 1-MB application flash (RWW), 32-KB AUXflash, 32-KB SFlash, 288-KB SRAM with selective retention control |
| Power Efficiency | 22 µA/MHz (M4) / 15 µA/MHz (M0+) @ 0.9 V core; 7 µA Deep Sleep current with 64-KB SRAM retention |
| Analog Peripherals | 12-bit 1-Msps SAR ADC with 16-channel sequencer & hardware averaging; two low-power comparators active in Deep Sleep |
| Digital Interfaces | Nine SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep-capable); USB Full-Speed device; QSPI/SMIF with XIP, encryption, and 4-KB cache |
| Security | ROM-based Secure Boot, execute-only memory, eight Protection Contexts, hardware crypto accelerator (AES, ECC, SHA, TRNG) |
Pinout & Package
This device is housed in a 124-ball BGA package (9 × 9 mm, 0.5-mm pitch) with USB support, as confirmed by Infineon's official datasheet (Rev. *R, p.32). The package includes dedicated RF matching pins, dual VDDIO banks (1.7–3.6 V), and six overvoltage-tolerant (OVT) GPIOs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Bank 0 | Configurable drive modes, slew rates, and Smart I/O™ Boolean logic support during Deep Sleep |
| RF_IN / RF_OUT | BLE RF Interface | Differential 50-Ω antenna interface pins requiring external matching network per layout guidelines |
| VDDIO0 / VDDIO1 | I/O Power Rails | Independent 1.7–3.6 V supplies for two I/O banks; enable mixed-voltage interfacing with external peripherals |
| SWDCK / SWDIO | Debug Interface | 2-pin Serial Wire Debug port supporting programming, real-time trace, and secure debug disable via eFuse |
| USB_DP / USB_DM | USB 2.0 FS Interface | Full-speed differential pair compliant with USB 2.0 specification; requires 1.5-kΩ pull-up on DP for device enumeration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Power Gating | Independent voltage scaling (0.9 V / 1.1 V) and clock gating per core enables dynamic power optimization across real-time and protocol tasks |
| Hardware BLE Link Layer | Dedicated engine offloads M0+ from timing-critical packet handling, enabling deterministic 2-Mbps throughput and simultaneous master/slave roles |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption eliminates boot latency and protects firmware IP at runtime |
| CAPSENSE™ SmartSense | Self-calibrating capacitive sensing with automatic SNR optimization and liquid-tolerant operation-no manual tuning required in production |
| Programmable Analog | Integrated CTBm opamps, 12-bit DAC (<2 µs settling), and temperature sensor routed to ADC enable closed-loop sensor conditioning without external components |
Applications
| Smart Wearable Sensor Hub | Secure BLE Gateway |
|---|---|
Use Scenario: Wrist-worn health monitor aggregating PPG, accelerometer, and ambient light data with local preprocessing and encrypted BLE transmission. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion on M4 while M0+ hosts BLE stack; CAPSENSE™ enables touchless gesture control. Use Value: 7 µA Deep Sleep with SRAM retention extends battery life >14 days on coin cell; hardware crypto ensures HIPAA-compliant data handoff. | Use Scenario: Industrial asset tracker relaying vibration, temperature, and GPS data via BLE to edge gateway, then forwarding via cellular/LTE-M. IC Role / Device Role / Timing Role: M0+ manages multi-sensor polling and BLE advertising; M4 runs lightweight TLS stack and OTA update verification. Use Value: On-chip SIMO buck converter maintains stable 3.3 V under pulsed LTE transmit load; OTP eFuse secures device identity and firmware signing keys. |
| Capacitive Touch Remote Control | Audio-Enabled Smart Tag |
Use Scenario: Battery-powered TV remote with glass-panel touch buttons, proximity wake, and haptic feedback via integrated DAC-driven actuator driver. IC Role / Device Role / Timing Role: CAPSENSE™ self/mutual sensing detects finger hover and swipe; 12-bit DAC generates precise haptic waveforms. Use Value: SmartSense auto-tunes baseline drift across temperature; 68-QFN-compatible pinout allows compact 2-layer PCB design. | Use Scenario: Asset tag with voice memo recording, playback, and proximity-triggered BLE alert using onboard PDM microphone and I²S speaker interface. IC Role / Device Role / Timing Role: PDM channels digitize audio; I²S/TDM routes stereo stream to external codec; TCPWM drives LED status indicators. Use Value: Two PDM inputs enable beamforming; hardware-accelerated AES encrypts stored audio before BLE transfer to prevent eavesdropping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52840 DK | Single-core Cortex-M4F (64 MHz), no M0+ companion core; lacks programmable analog (no SAR ADC, DAC, opamps) | Suitable for BLE-centric apps without local sensor processing or analog signal conditioning | Choose when BLE throughput and RF range are primary; avoid if mixed-signal preprocessing or dual-core task partitioning is required |
| CC2642R1F | Arm Cortex-M4F (48 MHz) + dedicated RF core; no programmable logic (UDBs) or Smart I/O; 352-KB flash, 80-KB RAM | Better RF coexistence in noisy industrial environments; limited peripheral flexibility for custom timing or logic functions | Prefer for high-reliability 2.4-GHz mesh networks; not suitable for CAPSENSE™ touch or QSPI XIP with encryption use cases |
Compared with nRF52840 DK and CC2642R1F, CY8C6347FMI-BLD13T uniquely integrates dual CPUs, hardware BLE link layer, programmable analog/digital blocks, and secure XIP - enabling full-stack edge intelligence without external components or performance compromises.
Availability
CY8C6347FMI-BLD13T is available at Aetrix Electronics and suitable for smart wearables, BLE gateways, capacitive touch remotes, and audio-enabled asset tags requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for CY8C6347FMI-BLD13T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, sensors, and secure microcontrollers for industrial, automotive, and IoT markets.
The PSoC™ 63 product line targets secure, ultra-low-power wireless edge devices - combining dual-core processing, BLE 5.0, programmable analog/digital fabric, and hardware-rooted security in a single chip.
FAQ
What is the maximum operating frequency of each CPU core in CY8C6347FMI-BLD13T?
The Arm Cortex-M4F core operates up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection; the Cortex-M0+ core runs up to 100 MHz with identical MPU support. Both cores support dynamic voltage scaling between 0.9 V and 1.1 V to optimize performance-per-watt across operating modes.
Does CY8C6347FMI-BLD13T support external flash execution with hardware encryption?
Yes - its Serial Memory Interface (SMIF) supports Execute-In-Place (XIP) from external quad-SPI flash with on-the-fly AES-128 decryption. A dedicated 4-KB cache improves XIP performance while reducing active power, and encryption keys are managed in secure memory protected by the hardware crypto accelerator.
How many simultaneous Bluetooth Low Energy connections does this device support?
The integrated BLE 5.0 subsystem supports up to four concurrent connections - two as master and two as slave - managed entirely by the hardware Link Layer engine. This enables robust star-topology networks without CPU intervention, preserving M0+ cycles for application logic and sensor management.
Is CAPSENSE™ on CY8C6347FMI-BLD13T capable of liquid-tolerant operation?
Yes - CAPSENSE™ uses adaptive scanning, shield electrode support, and SmartSense auto-tuning to maintain reliable touch detection under water droplets or wet conditions. It achieves >100:1 signal-to-noise ratio (SNR) and supports both self-capacitance and mutual-capacitance configurations without external calibration.
CY8C6347FMI-BLD13T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 104-UFBGA, WLCSP
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 70
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347FMI-BLD13T FAQ
1.How can I place an order for CY8C6347FMI-BLD13T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347FMI-BLD13T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347FMI-BLD13T reliable?
The price and inventory of CY8C6347FMI-BLD13T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347FMI-BLD13T is usually 5 days.
3.What payment methods are accepted for CY8C6347FMI-BLD13T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347FMI-BLD13T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347FMI-BLD13T?
CY8C6347FMI-BLD13T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347FMI-BLD13T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347FMI-BLD13T?
For technical support, including CY8C6347FMI-BLD13T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347FMI-BLD13T requirements.
6.How does Aetrix verify that CY8C6347FMI-BLD13T is sourced from the original manufacturer or authorized distributors?
All CY8C6347FMI-BLD13T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347FMI-BLD13T meets industry standards.
7.What is the process for return or replacement of CY8C6347FMI-BLD13T?
All CY8C6347FMI-BLD13T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347FMI-BLD13T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347FMI-BLD13T part is unused and in its original packaging.
Return procedure for CY8C6347FMI-BLD13T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C6347FMI-BLD13T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
