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Infineon Technologies CY8C6347FMI-BLD43T
- Part No.:
- CY8C6347FMI-BLD43T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 104-UFBGA, WLCSP
- Datasheet:
-
CY8C6347FMI-BLD43T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 104WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,208
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Product details
Overview
CY8C6347FMI-BLD43T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® LE 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, supports Deep Sleep at 7 µA (64-KB SRAM retention), and delivers up to 4 dBm TX power with –95 dBm RX sensitivity - deployed in battery-powered IoT edge nodes requiring secure wireless sensor aggregation.
For engineers reviewing the CY8C6347FMI-BLD43T datasheet, CY8C6347FMI-BLD43T pinout, CY8C6347FMI-BLD43T application, or CY8C6347FMI-BLD43T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V M4), BLE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and CAPSENSE™ liquid-tolerant proximity sensing capability.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power housekeeping. Both cores share memory-mapped peripherals via a crossbar switch and coordinate via IPC with hardware semaphores and message passing.
Its Bluetooth® LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and dedicated Link Layer engine supporting master/slave roles, 2 Mbps data rate, and RSSI with 4-dB resolution - all operating independently of CPU execution to minimize latency and power overhead during active radio duty cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| BLE Compliance | Bluetooth® LE 5.0 certified; supports 4 concurrent connections and 2 Mbps PHY |
| Memory | 1-MB application flash (RWW), 288-KB SRAM with selective retention, 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 @ 0.9 V core voltage |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 32 TCPWM blocks |
| Security | ROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES/SHA/RSA/TRNG) |
Pinout & Package
This device is housed in a 104-ball Micro-CSP (M-CSP) package with 0.4-mm pitch, optimized for space-constrained IoT endpoints. Pin assignment follows Infineon's PSoC™ 63 BGA/M-CSP footprint standard, supporting configurable GPIOs, dedicated BLE RFIO and antenna matching network pads, and dual-supply domains (VDDIO/VDDD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_3 | I/O Power Supply | Four independent 1.7–3.6 V I/O banks enabling mixed-voltage interface operation |
| VDDD | Digital Core Supply | Core logic supply (0.9 V or 1.1 V selectable); powers CPUs, UDBs, and digital subsystems |
| RFIO / ANT | BLE RF Transceiver Interface | Differential 50-Ω RF output port; requires external matching network for antenna coupling |
| XRES | External Reset Input | Active-low asynchronous reset; debounced internally; overrides all power modes |
| SWDIO / SWCLK | Debug Interface | 2-pin Serial Wire Debug port; supports programming, real-time trace, and secure debug disable |
| P0[0]–P15[7] | Programmable GPIO | Up to 84 pins configurable as digital, analog, CAPSENSE™, or Smart I/O™ with slew-rate control |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Voltage Core Operation | Selectable 0.9 V / 1.1 V CPU supply enables dynamic trade-off between performance (150 MHz M4) and ultra-low active current (22 µA/MHz) |
| QSPI XIP with Encryption | Execute-in-place from external flash with real-time AES-128 decryption - eliminates boot latency and external code storage exposure |
| CAPSENSE™ Liquid Tolerance | Hardware-accelerated self/mutual capacitive sensing with automatic SmartSense tuning - sustains touch function under water or condensation |
| BLE Link Layer Offload | Dedicated hardware engine handles advertising, scanning, connection management, and packet encryption - frees both CPUs for application logic |
| Smart I/O™ in Deep Sleep | Two 16-pin Smart I/O ports perform Boolean logic (AND/OR/XOR) on GPIO states without waking CPUs - enables wake-on-pattern detection |
Applications
| Smart Home Sensor Hub | Wearable Health Monitor |
|---|---|
Use Scenario: Aggregates temperature, humidity, motion, and button inputs; transmits encrypted telemetry via BLE to gateway. IC Role / Device Role / Timing Role: Dual-core MCU executes sensor fusion (M4) and BLE stack (M0+); SIMO buck maintains 0.9-V core during 7-µA Deep Sleep between readings. Use Value: 64-KB SRAM retention preserves context across 30-second sensing intervals; CAPSENSE™ enables waterproof touch controls. | Use Scenario: Measures PPG and ECG signals, runs local arrhythmia detection, streams processed biometrics over BLE. IC Role / Device Role / Timing Role: M4 performs real-time FFT and FIR filtering; SAR ADC samples at 1 Msps with 16-channel sequencing; BLE handles 2-Mbps streaming. Use Value: On-chip opamps condition analog front-end; TRNG seeds session keys for HIPAA-compliant BLE pairing. |
| Industrial Predictive Maintenance Node | Asset Tracking Beacon |
Use Scenario: Captures vibration spectra via MEMS accelerometer, logs FFT coefficients to flash, triggers BLE alert on anomaly threshold breach. IC Role / Device Role / Timing Role: TCPWM timers synchronize ADC sampling to motor RPM; UDBs implement custom PWM-driven excitation waveform generator. Use Value: 1-MB flash stores firmware + 30 days of compressed spectral logs; cryptography accelerator signs log entries before transmission. | Use Scenario: Periodically broadcasts encrypted location and battery status using BLE advertising packets; wakes only for GPS fix or motion trigger. IC Role / Device Role / Timing Role: M0+ manages BLE advertising schedule and motion wake-up; ILO + RTC maintains 10-second beacon interval with ±2% accuracy. Use Value: Deep Sleep current of 7 µA extends CR2032 battery life beyond 12 months; overvoltage-tolerant pins simplify direct connection to tamper switches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core Arm Cortex-M33/M33; no integrated SMIF/QSPI XIP; lacks CAPSENSE™ and programmable analog | Better cryptographic isolation (TrustZone); weaker analog integration limits sensor front-end flexibility | Prefer when secure enclave separation is critical and external ADC/DAC acceptable |
| Dialog DA1469x | Single M33 core + dedicated BLE processor; 512-KB flash; no UDBs or Smart I/O™ | Lower active current (10 µA/MHz), but no hardware offload for sensor preprocessing or GPIO logic | Prefer for pure BLE beaconing with minimal local compute; avoid when CAPSENSE™ or analog co-processing required |
Compared with nRF5340 and DA1469x, CY8C6347FMI-BLD43T uniquely combines BLE 5.0 concurrency, hardware-accelerated capacitive sensing, and reconfigurable digital logic - enabling single-chip sensor hub designs without companion ASICs or FPGA glue logic.
Availability
CY8C6347FMI-BLD43T is available at Aetrix Electronics and suitable for smart home sensor hubs, wearable health monitors, industrial predictive maintenance nodes, and asset tracking beacons requiring stable component supply, long-term lifecycle support, and qualified BLE 5.0 wireless integration.
Supply support for CY8C6347FMI-BLD43T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 63 product line targets secure, ultra-low-power IoT endpoints - integrating BLE, programmable analog/digital fabric, and dual-core processing to eliminate external components in edge-sensing applications.
FAQ
What is the maximum supported external QSPI flash density for XIP operation?
CY8C6347FMI-BLD43T supports up to 128-MB external QSPI flash via SMIF with full Execute-in-Place capability. The interface handles single/dual/quad/octal modes and includes 4-KB cache to reduce fetch latency. Address space is mapped into the CPU instruction bus, allowing direct execution without RAM loading - verified in ModusToolbox™ v3.1+ with PSoC™ 6 SDK v3.2.0.
Does this part support USB device functionality in Deep Sleep mode?
No. USB Full-Speed device interface requires active CPU and clock domains; it is disabled in Deep Sleep and Hibernate modes. Only Smart I/O™, low-power comparators, RTC, and certain TCPWM configurations remain operational. USB enumeration and data transfer must occur in Active or Sleep mode, with wake-up triggered by external event or timer.
How is BLE radio calibration performed during production and field use?
Factory calibration data is stored in SFlash and loaded automatically at boot. Runtime recalibration uses internal temperature and voltage sensors to adjust RF gain and frequency offset - triggered by API call Cy_BLE_StartCalibration() or automatically after significant thermal drift (>10°C change). Calibration completes in <15 ms and does not interrupt ongoing BLE connections.
Can the 12-bit DAC drive a 50-Ω load directly?
No. The 12-bit voltage-mode DAC has a typical output impedance of 150 Ω and is specified for loads ≥10 kΩ. Driving 50-Ω loads requires external buffering - e.g., one of the integrated opamps configured as unity-gain follower. Direct connection causes gain error >15% and settling time degradation beyond the rated <2 µs.
CY8C6347FMI-BLD43T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 104-UFBGA, WLCSP
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 70
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347FMI-BLD43T FAQ
1.How can I place an order for CY8C6347FMI-BLD43T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347FMI-BLD43T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347FMI-BLD43T reliable?
The price and inventory of CY8C6347FMI-BLD43T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347FMI-BLD43T is usually 5 days.
3.What payment methods are accepted for CY8C6347FMI-BLD43T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347FMI-BLD43T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347FMI-BLD43T?
CY8C6347FMI-BLD43T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347FMI-BLD43T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347FMI-BLD43T?
For technical support, including CY8C6347FMI-BLD43T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347FMI-BLD43T requirements.
6.How does Aetrix verify that CY8C6347FMI-BLD43T is sourced from the original manufacturer or authorized distributors?
All CY8C6347FMI-BLD43T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347FMI-BLD43T meets industry standards.
7.What is the process for return or replacement of CY8C6347FMI-BLD43T?
All CY8C6347FMI-BLD43T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347FMI-BLD43T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347FMI-BLD43T part is unused and in its original packaging.
Return procedure for CY8C6347FMI-BLD43T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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