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Infineon Technologies CY8C6347FMI-BLD53T
- Part No.:
- CY8C6347FMI-BLD53T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 104-UFBGA, WLCSP
- Datasheet:
-
CY8C6347FMI-BLD53T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 104WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,196
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Product details
Overview
CY8C6347FMI-BLD53T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates at up to 150 MHz (M4) and 100 MHz (M0+), supports 1.7–3.6 V supply, delivers –95 dBm RX sensitivity, and enables secure IoT edge nodes with hardware crypto acceleration and Secure Boot.
For engineers reviewing the CY8C6347FMI-BLD53T datasheet, CY8C6347FMI-BLD53T pinout, CY8C6347FMI-BLD53T application, or CY8C6347FMI-BLD53T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE 5.0 link-layer concurrency (4 connections), QSPI XIP with on-the-fly encryption, and CAPSENSE™ liquid-tolerant proximity sensing.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and low-power background operations. Inter-processor communication (IPC) uses dedicated hardware mailboxes and event triggers for deterministic latency.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with digital PHY, hardware-accelerated Link Layer engine, and programmable TX output (up to +4 dBm), enabling concurrent master/slave roles and 2 Mbps data rate without host CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| Memory | 1-MB flash (RWW), 288-KB SRAM with retention control, 32-KB AUXflash, 32-KB SFlash, 1-Kb OTP eFuse |
| Bluetooth LE | Compliant with Bluetooth 5.0; –95 dBm RX sensitivity; +4 dBm max TX power; 4 simultaneous connections |
| Power Efficiency | 22 µA/MHz (M4 @ 0.9 V); 7 µA Deep Sleep current with 64-KB SRAM retention; SIMO buck converter <1 µA quiescent |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer, averaging); two low-power comparators; 12-bit DAC (<2 µs settling) |
| Digital Peripherals | 9 SCBs (8 configurable as SPI/I²C/UART, 1 Deep Sleep SCB); 32 TCPWM blocks; 12 UDBs; Smart I/O™ Boolean logic in Deep Sleep |
| Security | ROM-based Secure Boot; execute-only memory; 8 Protection Contexts; hardware crypto accelerator (AES, ECC, SHA, TRNG) |
Pinout & Package
Package: 124-ball BGA (7 × 7 mm, 0.4 mm pitch), RoHS-compliant, moisture-sensitive level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent 1.7–3.6 V I/O domains supporting mixed-voltage interfacing and level-shifting |
| VDDD, VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies enable analog noise isolation and domain-specific power gating |
| SWDCK, SWDIO | Debug Interface | Two-pin Serial Wire Debug interface supporting programming, trace, and real-time debug without halting CPU operation |
| ANT, RF_IN/OUT | RF Interface | Differential 50-Ω antenna port with internal matching; no external balun required for PCB trace antenna |
| XTAL32K, XTAL32K_N | 32-kHz Crystal Input | Dedicated low-power crystal oscillator pins for RTC and Deep Sleep timing with automatic load capacitance tuning |
| USB_DP, USB_DM | USB 2.0 Full-Speed | Integrated USB PHY with internal termination; supports device mode only; no external transceiver needed |
Key Features
| Feature | Design Value |
|---|---|
| Secure Dual-Core Execution | Hardware-enforced isolation between M4 (application) and M0+ (BLE stack), with IPC mailboxes and shared memory protection |
| QSPI XIP with Encryption | Execute-in-place from external flash with AES-128 on-the-fly decryption, eliminating boot-time flash copy and reducing attack surface |
| CAPSENSE™ Liquid Tolerance | Self- and mutual-capacitive sensing with adaptive baseline tracking and shield-driven architecture for reliable touch in wet environments |
| Smart I/O™ in Deep Sleep | 16 GPIOs grouped into two Smart I/O ports that perform Boolean logic (AND/OR/XOR) autonomously during Deep Sleep, enabling wake-on-event without CPU wake-up |
| Programmable Analog Flexibility | Configurable CTBm opamps support rail-to-rail input/output, selectable gain (1–16), and low-power modes active in Hibernate |
Applications
| Smart Home Hub | Industrial Wireless Sensor Node |
|---|---|
Use Scenario: Central gateway aggregating BLE sensors (temperature, occupancy, door/window) and bridging to Wi-Fi/Ethernet. IC Role / Device Role / Timing Role: Dual-core runtime scheduler: M4 processes sensor fusion and local decision logic; M0+ hosts BLE host stack and manages concurrent peripheral connections. Use Value: 4 simultaneous BLE connections and 2 Mbps throughput enable sub-100-ms polling of 10+ sensors; on-chip SIMO buck ensures stable 3.3 V supply across varying RF load. | Use Scenario: Battery-powered vibration/temperature monitor deployed in factory machinery with 5-year battery life. IC Role / Device Role / Timing Role: Ultra-low-power system controller: Deep Sleep current of 7 µA preserves battery; wake-on-interrupt from accelerometer or timer triggers measurement sequence. Use Value: 22 µA/MHz M4 efficiency at 0.9 V core voltage reduces active energy per FFT computation; built-in temperature sensor feeds ADC directly-no external component needed. |
| Wearable Health Monitor | Secure Access Token Device |
Use Scenario: Optical heart-rate and SpO₂ monitor with BLE streaming to smartphone app and local anomaly detection. IC Role / Device Role / Timing Role: Real-time signal processor: M4 runs PPG signal filtering and pulse detection algorithms; ADC oversampling + result averaging improves SNR by >15 dB. Use Value: 12-bit SAR ADC with 16-channel sequencer captures synchronized red/IR photodiode signals; programmable opamp CTBm drives LED drivers with precise current control. | Use Scenario: FIDO2-compliant hardware security key authenticating user login via BLE to laptops or phones. IC Role / Device Role / Timing Role: Root-of-trust execution engine: ROM-based Secure Boot validates signed firmware; crypto accelerator performs ECDSA signing in <5 ms. Use Value: Hardware-isolated Protection Contexts prevent side-channel leakage between BLE transport layer and private key storage; eFuse array stores immutable device attestation keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF5340 DK | Dual-core (M33/M33), no integrated SMIF/QSPI XIP; 512 KB flash; lower RX sensitivity (–96 dBm); no CAPSENSE™ | Lacks analog front-end integration; requires external ADC/opamp for biometric sensing | Preferred when Arm TrustZone security model is prioritized over analog flexibility and capacitive sensing |
| Dialog DA1469x | Single M33 core with BLE 5.2; 1 MB flash; higher TX power (+8 dBm); no dual-CPU IPC or UDB programmability | No hardware-accelerated dual-core task partitioning; limited analog capability (no SAR ADC) | Chosen for ultra-long-range BLE beacons where RF range outweighs need for local signal processing |
Compared with nRF5340 and DA1469x, CY8C6347FMI-BLD53T uniquely combines dual-CPU deterministic partitioning, on-die analog precision (SAR ADC + opamps), and CAPSENSE™-making it optimal for resource-constrained, sensor-rich, and human-interface IoT endpoints requiring local intelligence and security.
Availability
CY8C6347FMI-BLD53T is available at Aetrix Electronics and suitable for smart home hubs, industrial wireless sensor nodes, wearable health monitors, and secure access token devices requiring stable component supply across multi-year production cycles.
Supply support for CY8C6347FMI-BLD53T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 63 product line targets secure, low-power IoT edge devices-integrating BLE 5.0, dual-core processing, and programmable analog/digital fabric to reduce BOM count and accelerate time-to-market for connected endpoints.
FAQ
Does CY8C6347FMI-BLD53T support over-the-air (OTA) firmware updates?
Yes. The device supports robust OTA updates via its dual-bank flash architecture and hardware-assisted Secure Boot. Firmware images are validated using SHA-256 and ECDSA signatures before execution, and the bootloader can roll back to a known-good image if update corruption or authentication failure occurs. This capability is enabled out-of-box in ModusToolbox™ with minimal application code.
What development tools are officially supported for this MCU?
Infineon officially supports ModusToolbox™ IDE (based on Eclipse) with PSoC™ 6 SDK, which includes BLE middleware, CAPSENSE™ Tuner, and power estimation tools. Hardware debugging uses KitProg3 or MiniProg4 programmers. PSoC™ Creator is deprecated; new designs must use ModusToolbox™ for full feature access including QSPI XIP configuration and crypto library integration.
Can the Bluetooth LE subsystem operate independently while the M4 core is in Deep Sleep?
Yes. The M0+ core and BLE subsystem retain full functionality-including advertising, scanning, and connection handling-in Deep Sleep mode with only 7 µA total current. The M4 remains powered off but can be woken via BLE interrupt or IPC signal from M0+, enabling ultra-low-power always-on wireless presence without continuous CPU activity.
Is external flash required for QSPI XIP operation?
No, but it is optional and commonly used. The internal 1-MB flash supports full application storage and execution. QSPI XIP allows executing code directly from external flash (e.g., 8-MB or 16-MB octal SPI device), freeing internal flash for configuration data or firmware redundancy. On-the-fly AES-128 decryption is applied automatically during fetch, ensuring secure external code execution without software overhead.
CY8C6347FMI-BLD53T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 104-UFBGA, WLCSP
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- I2C, LINbus, QSPI, SPI, UART/USART, USB
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 70
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347FMI-BLD53T FAQ
1.How can I place an order for CY8C6347FMI-BLD53T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347FMI-BLD53T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347FMI-BLD53T reliable?
The price and inventory of CY8C6347FMI-BLD53T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347FMI-BLD53T is usually 5 days.
3.What payment methods are accepted for CY8C6347FMI-BLD53T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347FMI-BLD53T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347FMI-BLD53T?
CY8C6347FMI-BLD53T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347FMI-BLD53T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347FMI-BLD53T?
For technical support, including CY8C6347FMI-BLD53T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347FMI-BLD53T requirements.
6.How does Aetrix verify that CY8C6347FMI-BLD53T is sourced from the original manufacturer or authorized distributors?
All CY8C6347FMI-BLD53T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347FMI-BLD53T meets industry standards.
7.What is the process for return or replacement of CY8C6347FMI-BLD53T?
All CY8C6347FMI-BLD53T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347FMI-BLD53T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347FMI-BLD53T part is unused and in its original packaging.
Return procedure for CY8C6347FMI-BLD53T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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