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Infineon Technologies CY8C6347FMI-BUD13T
- Part No.:
- CY8C6347FMI-BUD13T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 104-UFBGA, WLCSP
- Datasheet:
-
CY8C6347FMI-BUD13T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 104WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,024
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Product details
Overview
CY8C6347FMI-BUD13T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 LE radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ for touch interfaces - deployed in battery-powered IoT edge nodes requiring wireless connectivity and low-power sensing.
For engineers reviewing the CY8C6347FMI-BUD13T datasheet, CY8C6347FMI-BUD13T pinout, CY8C6347FMI-BUD13T application, or CY8C6347FMI-BUD13T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency (4 connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep mode.
Technical Context
The device implements a tightly coupled dual-CPU architecture where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages BLE link-layer operations and low-power state coordination. Both cores share memory-mapped peripherals and use IPC and dual DMA controllers (16 channels each) for deterministic inter-core data exchange.
Its Bluetooth subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and hardware-accelerated AES/SHA/TRNG cryptography - enabling certified BLE 5.0 operation without external co-processors or security ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and single-cycle multiply |
| BLE Compliance | Bluetooth 5.0 LE with link-layer engine supporting 4 simultaneous connections and 2 Mbps PHY |
| Memory | 1-MB flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two opamps, two low-power comparators, 12-bit DAC |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 32 TCPWM blocks, 9 SCBs (SPI/I2C/UART configurable) |
| Package | 104-pin WLCSP (0.4-mm pitch), 4.2 mm × 4.2 mm, 0.5-mm height, thermal pad |
Pinout & Package
CY8C6347FMI-BUD13T uses a 104-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4-mm ball pitch, designed for space-constrained wearable and sensor-edge applications. The package includes an exposed thermal pad for enhanced heat dissipation and supports automated optical inspection (AOI) and X-ray void detection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Banks | Four independent 1.7–3.6 V I/O banks enable mixed-voltage interfacing (e.g., 1.8 V sensors + 3.3 V radios) |
| VDDD/VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies allow analog noise isolation and dynamic voltage scaling per CPU core |
| SWDCLK/SWDIO | Debug Interface | 2-pin SWD interface supports full debug, programming, and secure provisioning via ModusToolbox™ |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO | Up to 84 GPIOs with configurable drive strength, slew rate, OVT (6 pins), and Smart I/O™ Boolean logic in Deep Sleep |
| XTAL_IN/XTAL_OUT | External Crystal Oscillator | Supports 32-kHz crystal for RTC and 16–35 MHz crystals for high-accuracy system clock generation |
| RF_ANT | RF Antenna Interface | 50-Ω matched RF output terminal for direct connection to PCB trace antenna or matching network |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 1.1 V or 0.9 V core operation enables dynamic trade-off between performance and ultra-low-power modes |
| Secure Boot & Protection | ROM-based root of trust, execute-only memory, 8 protection contexts, and debug disable prevent firmware tampering and side-channel attacks |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache reduces BOM cost and boot latency |
| CAPSENSE™ SmartSense | Hardware-accelerated auto-tuning for self/mutual capacitive sensing eliminates manual calibration across temperature/humidity |
| Smart I/O™ in Deep Sleep | 16 GPIOs retain Boolean logic (AND/OR/XOR) and event routing during 7-µA Deep Sleep - enables wake-on-gesture without CPU wake |
Applications
| Smart Wearable Sensor Hub | BLE Mesh Node |
|---|---|
Use Scenario: Compact wrist-worn health monitor integrating PPG, accelerometer, and ambient light sensing with continuous BLE streaming. IC Role / Device Role / Timing Role: Dual-core MCU fuses sensor data (M4), manages BLE advertising/connection intervals (M0+), and maintains sub-10-µA average system current using Deep Sleep + Smart I/O™ wake triggers. Use Value: Eliminates external BLE SoC and sensor hub ASIC; 64-KB SRAM retention preserves context across motion-triggered wake cycles. | Use Scenario: Battery-powered industrial mesh node relaying temperature/humidity readings across 10+ hops in a factory environment. IC Role / Device Role / Timing Role: Acts as both BLE peripheral (sensor data collection) and central (mesh forwarding), leveraging concurrent 4-connection link-layer engine and hardware AES encryption. Use Value: Reduces latency and power vs. software BLE stack on generic MCU; on-chip crypto accelerator enables authenticated mesh packet signing at <100 µs overhead. |
| Capacitive Touch Remote Control | Secure OTA Firmware Updater |
Use Scenario: Ultra-thin TV remote with gesture-enabled touchpad, button array, and IR/LED feedback - powered by coin cell. IC Role / Device Role / Timing Role: CAPSENSE™ subsystem detects multi-finger gestures; Smart I/O™ processes swipe logic in Deep Sleep; M0+ handles BLE HID profile transmission. Use Value: Achieves >1-year battery life via 7-µA Deep Sleep and zero-CPU wake for touch events - no companion PMIC required. | Use Scenario: Medical-grade infusion pump requiring cryptographically signed, rollback-resistant firmware updates over BLE. IC Role / Device Role / Timing Role: Enforces secure boot chain, verifies ECDSA-signed images in SFlash, and executes update in execute-only protected memory regions. Use Value: Meets IEC 62304 Class C requirements without external secure element; ROM-based root of trust prevents bootloader compromise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core Cortex-M4F (64 MHz), no M0+ coprocessor; 1-MB flash, 256-KB RAM; BLE 5.0 but no concurrent multi-role support | Lacks hardware-assisted dual-CPU task partitioning - requires software BLE stack sharing CPU time with application | Prefer when BLE-only role dominates and cost sensitivity outweighs power/performance optimization |
| Dialog DA1469x | ARM Cortex-M33 + dedicated BLE controller; 1.5-MB flash, 384-KB RAM; BLE 5.2, higher TX power (+8 dBm), but no programmable analog/digital blocks | No UDBs, Smart I/O™, or CAPSENSE™ - requires external components for sensor fusion or touch interface | Prefer when maximum RF range and BLE 5.2 features are critical, and analog/digital flexibility is secondary |
Compared with nRF52840 and DA1469x, CY8C6347FMI-BUD13T uniquely combines dual-CPU power partitioning, on-die programmable analog/digital logic, and hardware BLE concurrency - enabling lower system-level BOM count and deterministic real-time response in resource-constrained edge devices.
Availability
CY8C6347FMI-BUD13T is available at Aetrix Electronics and suitable for smart wearables, BLE mesh nodes, capacitive touch remotes, and secure OTA firmware updaters requiring stable component supply, long-lifecycle support, and qualified wafer lots.
Supply support for CY8C6347FMI-BUD13T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.
This part belongs to the PSoC™ 63 product line - engineered for secure, ultra-low-power IoT endpoints that integrate wireless connectivity, programmable analog/digital logic, and hardware-enforced trust into a single chip.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6347FMI-BUD13T?
The Cortex-M4F core operates at up to 150 MHz, confirmed in the official Infineon datasheet (002-18787 Rev. *R, Section 3.1.1). This frequency is achievable under 1.1-V core supply with appropriate clock source configuration (e.g., PLL driven by IMO or external crystal). Thermal and voltage derating apply per device-grade specifications.
Does CY8C6347FMI-BUD13T support USB Full-Speed device functionality?
No, CY8C6347FMI-BUD13T does not include USB Full-Speed device interface. Per the datasheet (Section 3.6.3), USB FS is only present in 124-BGA and 116-BGA packages of the PSoC™ 63 family. The BUD13T suffix denotes the 104-M-CSP package variant without USB hardware.
How many CAPSENSE™ electrodes can be implemented simultaneously on this device?
The device supports up to 83 capacitive sensing segments and 8 commons, as specified in the datasheet (Section Features, "Segment LCD Drive" subsection). CAPSENSE™ hardware resources scale with available GPIOs and analog routing - actual electrode count depends on layout, shielding, and SNR requirements, but the silicon supports full utilization of all 84 GPIOs for sensing.
Is the SIMO buck converter integrated into CY8C6347FMI-BUD13T?
Yes, the device includes an on-chip Single-In Multiple-Out (SIMO) DC-DC buck converter with <1 µA quiescent current, documented in the datasheet (Section Features, "Low-power 1.7-V to 3.6-V operation"). It supports three regulated outputs (VCCD, VCCA, VCCIO) and enables efficient multi-rail power management without external regulators.
CY8C6347FMI-BUD13T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 104-UFBGA, WLCSP
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347FMI-BUD13T FAQ
1.How can I place an order for CY8C6347FMI-BUD13T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347FMI-BUD13T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347FMI-BUD13T reliable?
The price and inventory of CY8C6347FMI-BUD13T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347FMI-BUD13T is usually 5 days.
3.What payment methods are accepted for CY8C6347FMI-BUD13T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347FMI-BUD13T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347FMI-BUD13T?
CY8C6347FMI-BUD13T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347FMI-BUD13T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347FMI-BUD13T?
For technical support, including CY8C6347FMI-BUD13T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347FMI-BUD13T requirements.
6.How does Aetrix verify that CY8C6347FMI-BUD13T is sourced from the original manufacturer or authorized distributors?
All CY8C6347FMI-BUD13T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347FMI-BUD13T meets industry standards.
7.What is the process for return or replacement of CY8C6347FMI-BUD13T?
All CY8C6347FMI-BUD13T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347FMI-BUD13T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347FMI-BUD13T part is unused and in its original packaging.
Return procedure for CY8C6347FMI-BUD13T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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