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Infineon Technologies CY8C6347FMI-BUD43T
- Part No.:
- CY8C6347FMI-BUD43T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 104-UFBGA, WLCSP
- Datasheet:
-
CY8C6347FMI-BUD43T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 104WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,924
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Product details
Overview
CY8C6347FMI-BUD43T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® LE 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7 V to 3.6 V, supports Deep Sleep mode at 7 µA (64-KB SRAM retention), and delivers up to 4 dBm TX power with –95 dBm RX sensitivity. Used in battery-powered IoT edge nodes requiring secure wireless sensor aggregation and local decision-making.
For engineers reviewing the CY8C6347FMI-BUD43T datasheet, CY8C6347FMI-BUD43T pinout, CY8C6347FMI-BUD43T application, or CY8C6347FMI-BUD43T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency (4 connections), QSPI XIP with hardware encryption, CAPSENSE™ liquid-tolerant touch, and ROM-based Secure Boot for firmware integrity.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and protocol stacks while the Cortex-M0+ manages BLE Link Layer operations and low-power state coordination. Both cores share memory-mapped peripherals via a high-bandwidth interconnect, with IPC and DMA enabling zero-copy data movement between domains.
Its Bluetooth® LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and hardware-accelerated Link Layer engine supporting simultaneous master/slave roles and 2 Mbps data rate. The on-chip SIMO buck converter enables sub-1 µA quiescent operation in Deep Sleep, and the 32-kHz ILO + RTC maintains timekeeping in backup domain with 64 bytes of retention memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| BLE Compliance | Bluetooth® LE 5.0 certified; supports 4 concurrent connections, 2 Mbps PHY, and programmable TX up to +4 dBm |
| Memory | 1-MB application flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep current (64-KB SRAM retained); 22 µA/MHz M4 active current @ 0.9 V core |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators (Deep Sleep-capable), 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 9 configurable SCBs (SPI/I2C/UART/USB) |
| Security | ROM-based Secure Boot, execute-only memory, 8 Protection Contexts, hardware crypto accelerator (AES/SHA/RSA/TRNG) |
Pinout & Package
Package: 104-ball Wafer-Level Chip-Scale Package (WLCSP), 0.4-mm pitch, 4.22 mm × 4.22 mm footprint, 0.5-mm height. RoHS-compliant, halogen-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply Rails | Four independent 1.7–3.6 V I/O banks enable mixed-voltage interface design (e.g., 1.8 V sensor + 3.3 V display) |
| VDDD/VDDA | Digital/Analog Core Supply | Separate 1.7–3.6 V supplies allow analog noise isolation and dynamic voltage scaling per CPU core |
| XTAL_IN/XTAL_OUT | External Crystal Interface | Supports 32 kHz watch crystal for RTC or 16–35 MHz crystal for precise clocking; internal load caps configurable |
| ANT | RF Antenna Terminal | 50-Ω single-ended RF output directly drives PCB trace antenna or matching network; no external PA required |
| SWDIO/SWCLK | Debug Interface | 2-pin SWD interface supports full debug, programming, and boundary scan; accessible even in Deep Sleep via dedicated wake-up path |
| P0[0]–P0[7] | Smart I/O™ Port | 16-pin Smart I/O bank (P0/P1) executes Boolean logic (AND/OR/XOR) on GPIO states during Deep Sleep without CPU wake-up |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 1.1 V or 0.9 V core operation per CPU enables fine-grained trade-off between performance and ultra-low-power runtime |
| QSPI XIP with Encryption | Execute-in-place from external flash with on-the-fly AES-128 decryption and 4-KB cache reduces boot latency and eliminates external RAM for code storage |
| CAPSENSE™ SmartSense | Hardware-accelerated auto-tuning compensates for environmental drift and liquid presence, enabling reliable touch control in wet industrial enclosures |
| BLE Link Layer Offload | Dedicated hardware engine handles packet assembly, CRC, whitening, and connection management-freeing M0+ for application tasks |
| Programmable Analog Integration | On-die temperature sensor routed to ADC, dual opamps with low-power modes, and comparator wake-up capability enable self-monitoring sensor nodes |
Applications
| Smart Home Sensor Hub | Industrial Predictive Maintenance Node |
|---|---|
Use Scenario: Aggregates data from multiple environmental sensors (temp/humidity/pressure) and transmits alerts via BLE to gateway. IC Role / Device Role / Timing Role: Dual-core orchestrator: M0+ runs BLE stack and sensor polling; M4 processes sensor fusion algorithms and local anomaly detection. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends coin-cell life beyond 5 years; CAPSENSE™ enables waterproof touch controls on enclosure. | Use Scenario: Mounted on rotating machinery to monitor vibration, temperature, and acoustic emissions; triggers BLE alert on threshold breach. IC Role / Device Role / Timing Role: Real-time signal processor: M4 executes FFT-based spectral analysis on PDM microphone input; M0+ manages BLE connection and firmware OTA updates. Use Value: 1-Msps SAR ADC with 16-channel sequencer captures synchronized multi-sensor waveforms; hardware crypto secures OTA firmware images. |
| Wearable Health Monitor | Asset Tracking Tag |
Use Scenario: Worn on body to measure heart rate (PPG), skin temperature, and motion (accelerometer); streams encrypted biometrics to smartphone. IC Role / Device Role / Timing Role: Secure BLE endpoint: M0+ handles encrypted GATT services and connection security; M4 runs PPG signal filtering and HRV analysis. Use Value: Integrated 12-bit DAC drives LED drivers for optical sensing; TRNG and Secure Boot prevent firmware tampering and data spoofing. | Use Scenario: Attached to logistics pallets to log location (via BLE proximity), temperature, shock events, and battery level; reports to BLE scanner network. IC Role / Device Role / Timing Role: Low-power telemetry controller: Smart I/O™ detects shock via GPIO edge-triggered wake; M0+ logs timestamped events to retained SRAM. Use Value: 64-byte backup domain + RTC maintains accurate time stamping across power cycles; OVT pins tolerate 5.5 V supply surges in warehouse environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840 | Single-core Cortex-M4F (64 MHz), no M0+ offload; 1-MB flash but only 256-KB RAM; no integrated SIMO buck | Lacks hardware BLE link-layer offload and dual-CPU power partitioning; higher active current in complex BLE + sensor apps | Prefer when cost-sensitive designs require basic BLE + simple sensor fusion without concurrent real-time processing demands |
| Dialog DA1469x | Single-core Cortex-M33 (150 MHz), integrated PMU but no dual-core architecture; 2-MB flash, 384-KB RAM | No M4/M0+ division of labor; BLE stack runs entirely on main core, increasing interrupt latency under load | Choose when maximum flash capacity and AI inference (CMSIS-NN) are prioritized over deterministic BLE timing and ultra-low Deep Sleep current |
Compared with nRF52840 and DA1469x, CY8C6347FMI-BUD43T uniquely combines BLE link-layer hardware offload, dual-voltage CPU scaling, and sub-1 µA SIMO quiescent current-enabling longer battery life in always-on sensor edge nodes with concurrent real-time and wireless tasks.
Availability
CY8C6347FMI-BUD43T is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial predictive maintenance nodes, wearable health monitors, and asset tracking tags requiring stable component supply across multi-year production cycles.
Supply support for CY8C6347FMI-BUD43T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
This part belongs to the PSoC™ 63 product line-designed specifically for secure, ultra-low-power IoT endpoints that integrate wireless connectivity, programmable analog/digital logic, and hardware-enforced firmware trust anchors.
FAQ
What is the maximum supported external QSPI flash size and interface speed?
CY8C6347FMI-BUD43T supports external octal SPI flash with throughput up to 640 Mbps using its Serial Memory Interface (SMIF). It can address up to 2 GB of external memory space via 32-bit addressing, and Execute-In-Place (XIP) is fully supported with on-the-fly AES-128 decryption enabled in hardware.
Does this device support USB device functionality, and what are the electrical requirements?
Yes, CY8C6347FMI-BUD43T includes a full-speed (12 Mbps) USB 2.0 device interface compliant with USB Battery Charging v1.2. It requires an external 1.5-kΩ pull-up resistor on D+ and supports automatic enumeration. The USB PHY draws 6.5 mA typical during active transfer at 3.3 V, and the internal regulator supplies VBUS detect and suspend detection.
How is Secure Boot implemented, and can it be disabled after programming?
Secure Boot is enforced by ROM-resident code that verifies SHA-256 hash and ECDSA signature of the first boot image before execution. Once the "Secure Boot Enable" bit in the eFuse array is programmed (one-time), Secure Boot cannot be disabled. Debug access remains available only if the "Debug Lock" eFuse is left unprogrammed during initial provisioning.
What GPIO features are available during Deep Sleep mode, and how many pins remain functional?
In Deep Sleep mode, up to 16 GPIOs across two Smart I/O™ ports (P0 and P1) retain full Boolean logic capability-including AND, OR, XOR, and latch functions-without waking either CPU. Additionally, six overvoltage-tolerant (OVT) pins and two low-power comparators can generate wake events, and all 84 GPIOs maintain configured drive strength and pull-up/down states.
CY8C6347FMI-BUD43T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 104-UFBGA, WLCSP
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347FMI-BUD43T FAQ
1.How can I place an order for CY8C6347FMI-BUD43T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347FMI-BUD43T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347FMI-BUD43T reliable?
The price and inventory of CY8C6347FMI-BUD43T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347FMI-BUD43T is usually 5 days.
3.What payment methods are accepted for CY8C6347FMI-BUD43T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347FMI-BUD43T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347FMI-BUD43T?
CY8C6347FMI-BUD43T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347FMI-BUD43T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347FMI-BUD43T?
For technical support, including CY8C6347FMI-BUD43T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347FMI-BUD43T requirements.
6.How does Aetrix verify that CY8C6347FMI-BUD43T is sourced from the original manufacturer or authorized distributors?
All CY8C6347FMI-BUD43T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347FMI-BUD43T meets industry standards.
7.What is the process for return or replacement of CY8C6347FMI-BUD43T?
All CY8C6347FMI-BUD43T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347FMI-BUD43T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347FMI-BUD43T part is unused and in its original packaging.
Return procedure for CY8C6347FMI-BUD43T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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