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Infineon Technologies CY8C6347LQI-BLD52

Part No.:
CY8C6347LQI-BLD52
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C6347LQI-BLD52.pdf
Description:
IC MCU 32BIT 1MB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,390

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Product details

Overview

CY8C6347LQI-BLD52 from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates at up to 150 MHz (M4) and 100 MHz (M0+), supports 1.7–3.6 V supply, and delivers –95 dBm RX sensitivity and 4 dBm TX power for secure IoT edge node applications.

For engineers reviewing the CY8C6347LQI-BLD52 datasheet, CY8C6347LQI-BLD52 pinout, CY8C6347LQI-BLD52 application, or CY8C6347LQI-BLD52 equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), BLE 5.0 link-layer concurrency (4 connections), QSPI XIP with hardware encryption, CAPSENSE™ liquid-tolerant touch, and SIMO buck converter quiescent current <1 µA.

Technical Context

The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages BLE protocol stack and low-power background operations via IPC and shared memory. Both cores operate independently with separate caches, DMA controllers (16 channels each), and configurable voltage domains (0.9 V or 1.1 V).

Its Bluetooth® LE subsystem integrates a 2.4-GHz RF transceiver, digital PHY, and hardware-accelerated Link Layer engine supporting master/slave roles, 2 Mbps data rate, and simultaneous four-connection management - all with dedicated 5.7 mA TX (0 dBm) and 6.7 mA RX (2 Mbps) current profiles at 3.3 V.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent cache
BLE ComplianceBluetooth 5.0 certified RF transceiver with –95 dBm sensitivity, 4 dBm max TX power, 4 concurrent connections
Memory1-MB flash (RWW), 288-KB SRAM (64-KB retention in Deep Sleep), 32-KB AUXflash, 1-Kb OTP eFuse
Power Efficiency22 µA/MHz (M4 @ 0.9 V); 7 µA Deep Sleep current with 64-KB SRAM retention; SIMO buck IQ <1 µA
Analog Peripherals12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling), two opamps
Digital Flexibility12 UDBs (8 macrocells each), Smart I/O™ (16 pins), 9 SCBs (8 configurable SPI/I2C/UART + 1 Deep Sleep SCB)
Package124-ball BGA (9 × 9 mm, 0.5 mm pitch), RoHS-compliant, thermal pad exposed

Pinout & Package

CY8C6347LQI-BLD52 is housed in a 124-ball BGA package (9 mm × 9 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per the official Infineon pinout diagram for CY8C6347LQI-BLD52 (Rev. *R, page 32), supporting USB, QSPI, BLE antenna interface, and dual-voltage I/O banks (1.8 V / 3.3 V).

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO3I/O Power Supply BanksIndependent 1.7–3.6 V supplies per bank; enable mixed-voltage interfacing (e.g., 1.8 V sensor + 3.3 V display)
VDDD/VDDADigital/Analog Core SupplySeparate 1.7–3.6 V rails; decoupling required for ADC noise immunity and CPU stability
ANTBLE RF Antenna Terminal50-Ω single-ended RF output; requires matching network per layout guidelines for optimal radiated performance
USB_DP/USB_DMUSB Full-Speed InterfaceDifferential pair supporting 12 Mbps; internal PHY eliminates need for external transceiver
QSPI_IO0–QSPI_IO3Quad SPI Data LinesSupport XIP, octal mode, and on-the-fly AES decryption; critical for secure firmware execution from external flash

Key Features

FeatureDesign Value
Dual-Voltage I/O BanksFour independent VDDIO supplies allow direct interfacing with 1.8 V sensors and 3.3 V displays without level shifters
Hardware Crypto AcceleratorOffloads AES-128/256, SHA-256, ECC, and TRNG - enabling secure OTA updates with <50 µs signature verify latency
CAPSENSE™ with SmartSenseSelf-calibrating capacitive sensing with >100:1 SNR and automatic liquid tolerance tuning - no manual threshold adjustment needed
Smart I/O™ in Deep Sleep16 GPIOs retain Boolean logic (AND/OR/XOR) and event generation during 7 µA Deep Sleep - enables wake-on-gesture
QSPI SMIF with 4-KB CacheEnables low-power Execute-In-Place from encrypted external flash at up to 640 Mbps - reduces SRAM footprint by 30% vs. RAM-resident code

Applications

Smart Wearable HubIndustrial Sensor Node

Use Scenario: Wrist-worn health monitor aggregating PPG, accelerometer, and temperature data while maintaining BLE connection to smartphone.

IC Role / Device Role / Timing Role: Dual-core runtime partitioning: M0+ runs BLE stack and sensor polling; M4 processes PDM audio and ADC waveform FFT in real time.

Use Value: 7 µA Deep Sleep with 64-KB SRAM retention extends battery life to 14+ days on coin cell; Smart I/O™ detects tap gesture to wake without CPU intervention.

Use Scenario: Battery-powered vibration and temperature sensor deployed in predictive maintenance system inside factory machinery.

IC Role / Device Role / Timing Role: CAPSENSE™ monitors housing integrity; TCPWM triggers synchronized ADC sampling at 1 kHz; BLE transmits compressed FFT bins every 5 minutes.

Use Value: SIMO buck converter's <1 µA quiescent current enables 5-year operation on AA batteries; hardware crypto secures firmware updates against spoofing.

Secure Access BadgeWireless Human-Machine Interface

Use Scenario: Contactless access card with biometric verification (capacitive fingerprint), NFC emulation, and encrypted BLE pairing.

IC Role / Device Role / Timing Role: M4 executes secure fingerprint match and AES-256 key wrapping; M0+ handles BLE advertising and NFC field detection.

Use Value: ROM-based Secure Boot and eight Protection Contexts prevent unauthorized debug access; OTP eFuse stores unique device keys irreversibly.

Use Scenario: Touch-enabled remote control for smart home gateway, supporting gesture navigation and voice trigger via PDM mic input.

IC Role / Device Role / Timing Role: CAPSENSE™ drives segmented LCD and proximity wake; PDM/I2S subsystem streams audio to host; BLE 5.0 advertises extended range.

Use Value: Integrated 12-bit DAC drives piezo haptics with <2 µs settling; QSPI XIP allows seamless UI animation from external flash without SRAM bloat.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52840Single-core ARM Cortex-M4F (64 MHz), no M0+ companion core; 1-MB flash but only 256-KB RAM; no integrated SIMO buckLacks hardware partitioning for concurrent BLE stack + application processing; higher active current (3.5 mA @ 4 dBm TX)Prefer when cost-sensitive and BLE-only workload fits single-core timing budget
Dialog DA1469xDual-core (Cortex-M33 + Cortex-M0), BLE 5.2, 960-KB flash, 384-KB RAM; includes PMU but no integrated analog ADC/DACNo on-chip 12-bit SAR ADC or CAPSENSE™ - requires external analog front-end for sensor fusionPrefer when ultra-low-power wireless audio streaming is primary, and analog integration is handled externally

Compared with Nordic nRF52840 and Dialog DA1469x, CY8C6347LQI-BLD52 uniquely combines dual-CPU deterministic partitioning, integrated high-SNR analog (ADC/DAC/comparators), and hardware-accelerated CAPSENSE™ - reducing BOM count and firmware complexity in sensor-rich BLE edge nodes.

Availability

CY8C6347LQI-BLD52 is available at Aetrix Electronics and suitable for smart wearables, industrial sensor nodes, secure access badges, and wireless human-machine interfaces requiring stable component supply across multi-year production cycles.

Supply support for CY8C6347LQI-BLD52 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and secure connectivity solutions, with annual R&D investment exceeding €1.4 billion.

CY8C6347LQI-BLD52 belongs to the PSoC™ 63 product line - designed specifically for secure, ultra-low-power IoT endpoints requiring integrated BLE 5.0, programmable analog, and hardware-enforced trust anchors.

FAQ

What is the maximum operating frequency of each CPU core in CY8C6347LQI-BLD52?

The Arm Cortex-M4F core operates at up to 150 MHz with single-cycle multiply, floating-point unit, and memory protection; the Cortex-M0+ core runs at up to 100 MHz with identical MPU support. Both cores support dynamic voltage scaling between 0.9 V and 1.1 V, directly affecting achievable clock speed and active current draw per datasheet Section 3.1.1.

Does CY8C6347LQI-BLD52 support external flash execution with encryption?

Yes - its Serial Memory Interface (SMIF) supports Execute-In-Place (XIP) from external quad SPI flash with on-the-fly AES-128 decryption. A dedicated 4-KB cache optimizes instruction fetch bandwidth, and hardware key storage prevents plaintext exposure during boot or runtime code execution.

How many simultaneous BLE connections does the onboard radio support?

The integrated Bluetooth 5.0 Link Layer engine supports up to four concurrent connections - two as master and two as slave - with full hardware acceleration for advertising, scanning, and connection management. This is confirmed in Section 3.3 of the datasheet and validated in ModusToolbox™ BLE middleware examples.

Is CAPSENSE™ on CY8C6347LQI-BLD52 capable of detecting touch through water or wet surfaces?

Yes - CAPSENSE™ implements adaptive baseline tracking and shield-driven mutual capacitance sensing, achieving >100:1 signal-to-noise ratio and certified liquid tolerance per IEC 61000-4-6. SmartSense auto-tuning eliminates manual calibration, enabling reliable touch detection on wet glass or plastic enclosures without firmware modification.

CY8C6347LQI-BLD52 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 6 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
288K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b, 16x12b SAR, Sigma-Delta; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C6347LQI-BLD52 FAQ

1.How can I place an order for CY8C6347LQI-BLD52 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C6347LQI-BLD52 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C6347LQI-BLD52 reliable?

The price and inventory of CY8C6347LQI-BLD52 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347LQI-BLD52 is usually 5 days.

3.What payment methods are accepted for CY8C6347LQI-BLD52?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347LQI-BLD52 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C6347LQI-BLD52?

CY8C6347LQI-BLD52 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C6347LQI-BLD52 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C6347LQI-BLD52?

For technical support, including CY8C6347LQI-BLD52 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347LQI-BLD52 requirements.

6.How does Aetrix verify that CY8C6347LQI-BLD52 is sourced from the original manufacturer or authorized distributors?

All CY8C6347LQI-BLD52 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347LQI-BLD52 meets industry standards.

7.What is the process for return or replacement of CY8C6347LQI-BLD52?

All CY8C6347LQI-BLD52 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347LQI-BLD52, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C6347LQI-BLD52 part is unused and in its original packaging.

Return procedure for CY8C6347LQI-BLD52:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C6347LQI-BLD52 Tags

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