Infineon Technologies CY8C6347LQI-BLD52T
- Part No.:
- CY8C6347LQI-BLD52T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C6347LQI-BLD52T.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,910
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Product details
Overview
CY8C6347LQI-BLD52T from Infineon is a dual-core Arm® Cortex®-M4F/M0+ microcontroller with integrated Bluetooth® 5.0 radio, 1-MB flash, 288-KB SRAM, and programmable analog/digital peripherals. It operates from 1.7–3.6 V, achieves 7 µA Deep Sleep current with 64-KB SRAM retention, and supports secure boot, hardware crypto acceleration, and CAPSENSE™ capacitive sensing. Used in battery-powered IoT edge nodes requiring concurrent processing, wireless connectivity, and low-power sensor interfacing.
For engineers reviewing the CY8C6347LQI-BLD52T datasheet, CY8C6347LQI-BLD52T pinout, CY8C6347LQI-BLD52T application, or CY8C6347LQI-BLD52T equivalent, key selection criteria include dual-CPU power efficiency (22 µA/MHz @ 0.9 V on M4), Bluetooth LE link-layer concurrency (4 simultaneous connections), QSPI XIP with on-the-fly encryption, and Smart I/O™ Boolean logic in Deep Sleep.
Technical Context
The device implements a tightly coupled dual-CPU subsystem where the Cortex-M4F handles real-time signal processing and security-critical tasks while the Cortex-M0+ manages Bluetooth LE protocol stack and peripheral offload. Memory coherency is maintained via shared SRAM and IPC messaging with hardware semaphore support.
Its Bluetooth LE subsystem integrates a 2.4-GHz RF transceiver with –95 dBm RX sensitivity, programmable TX output up to +4 dBm, and a dedicated link-layer engine supporting master/slave roles and 2 Mbps PHY. The on-chip SIMO buck converter enables sub-1 µA quiescent operation in Deep Sleep mode with backup domain retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 150-MHz Arm Cortex-M4F + 100-MHz Cortex-M0+, each with MPU and independent flash caches |
| Bluetooth LE | Compliant with BLE 5.0; supports 4 concurrent connections, 2 Mbps data rate, –95 dBm RX sensitivity |
| Memory | 1-MB application flash (RWW), 288-KB SRAM (64-KB retainable in Deep Sleep), 1-Kb OTP eFuse |
| Power Efficiency | 7 µA Deep Sleep (64-KB SRAM retained); 22 µA/MHz M4 active current at 0.9 V core voltage |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (16-channel sequencer), two low-power comparators, 12-bit DAC (<2 µs settling) |
| Digital Flexibility | 12 UDBs (8 macrocells each), Smart I/O™ for GPIO Boolean logic in Deep Sleep, 32 TCPWM blocks |
| Security | ROM-based Secure Boot, hardware crypto accelerator (AES/SHA/RSA/ECC/TRNG), 8 Protection Contexts |
Pinout & Package
This device is packaged in a 104-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4-mm pitch, marked "LQI" per Infineon's package code nomenclature. Pin functions are defined per the CY8C6347LQI-BLD52T-specific pinout diagram in Section 4 of datasheet 002-18787 Rev. *R.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO5 | I/O Power Supply Banks | Independent 1.7–3.6 V supplies per bank; enable mixed-voltage I/O interfacing and selective bank shutdown |
| VDDD | Digital Core Supply | Supplies CPU, memory, and digital logic; supports dynamic voltage scaling between 0.9 V and 1.1 V |
| VDDR | RF Analog Supply | Dedicated 1.1-V supply for Bluetooth LE radio; isolated to minimize digital noise coupling |
| P0[0]–P15[7] | Programmable GPIO | Up to 84 pins configurable as digital, analog, or CAPSENSE™; six pins overvoltage-tolerant (up to 5.5 V) |
| XTAL_IN / XTAL_OUT | External Crystal Interface | Supports 32-kHz crystal for RTC or 16–35 MHz crystal for high-accuracy system clock |
| SWDIO / SWCLK | JTAG/SWD Debug Interface | Two-pin Serial Wire Debug interface; fully functional in all power modes except Hibernate |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Voltage Scaling | User-selectable 0.9 V or 1.1 V core voltage per CPU, enabling optimized trade-off between performance and active current |
| Secure Boot Enforcement | Immutable ROM bootloader validates signature and hash of flash-resident firmware before execution, preventing unauthorized code injection |
| Smart I/O™ in Deep Sleep | 16 GPIOs grouped into two Smart I/O ports that execute Boolean logic (AND/OR/XOR) without waking CPUs, reducing wake-event latency |
| QSPI XIP with Encryption | Execute-in-place from external quad SPI flash with AES-128 decryption on-the-fly, eliminating need for RAM copy and protecting IP |
| CAPSENSE™ SmartSense | Hardware-accelerated auto-tuning of sensor parameters (IDAC, scan time, averaging) for robust touch/slide/proximity under varying environmental conditions |
Applications
| Smart Home Sensor Hub | Wireless Medical Wearable |
|---|---|
Use Scenario: Central hub aggregating temperature, humidity, motion, and door/window status from multiple BLE sensors, forwarding data to cloud via Wi-Fi gateway. IC Role / Device Role / Timing Role: Dual-core MCU runs local decision logic (M4) and BLE mesh node stack (M0+); RTC maintains time-synchronized sensor polling intervals. Use Value: 7 µA Deep Sleep with 64-KB SRAM retention enables multi-month battery life; Smart I/O™ processes motion interrupts without CPU wake, extending runtime. | Use Scenario: Continuous ECG and SpO₂ monitoring patch transmitting encrypted biometric data every 5 seconds to smartphone app. IC Role / Device Role / Timing Role: M4 performs real-time ECG waveform filtering and R-peak detection; M0+ handles BLE advertising, connection management, and packet encryption. Use Value: Hardware crypto accelerator offloads AES-128 and TRNG generation from CPUs, preserving battery; –95 dBm RX sensitivity ensures reliable link at body-worn distances. |
| Industrial Predictive Maintenance Node | BLE-Enabled Asset Tracker |
Use Scenario: Vibration and temperature monitoring on rotating machinery, performing FFT analysis onboard and triggering BLE alerts upon anomaly detection. IC Role / Device Role / Timing Role: M4 executes floating-point FFT and threshold logic; CAPSENSE™ detects enclosure tampering; TCPWM generates precise PWM for LED status indicators. Use Value: 1-Msps SAR ADC with 16-channel sequencer captures synchronized multi-sensor data; dual-core isolation prevents BLE stack jitter from affecting timing-critical analysis. | Use Scenario: GPS-denied indoor asset tracking using BLE RSSI triangulation and motion-triggered location updates. IC Role / Device Role / Timing Role: M0+ manages BLE beaconing and connection scanning; accelerometer interrupt wakes M4 only when movement exceeds threshold. Use Value: 22 µA/MHz M4 active current at 0.9 V minimizes energy per inference; Smart I/O™ filters false motion triggers using hardware AND logic on accel INT and timer signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | Single-core Arm Cortex-M4F (64 MHz), no M0+ coprocessor; 1-MB flash, 256-KB RAM; BLE 5.0, but no hardware crypto accelerator for asymmetric algorithms | Lacks dual-CPU task partitioning; requires software BLE stack; no CAPSENSE™ or programmable analog/digital logic | Select when BLE-only functionality suffices and cost sensitivity outweighs need for analog flexibility or secure asymmetric crypto |
| Dialog DA1469x | Arm Cortex-M33 (150 MHz) + dedicated BLE controller; 2-MB flash, 384-KB RAM; ultra-low-power sleep (2.5 µA), but no integrated SIMO buck | No programmable analog (ADC/DAC/opamps) or UDBs; uses external DC-DC for lowest power; limited GPIO count (48) | Select for longest battery life in simple beaconing or sensor readout, where analog integration and logic flexibility are secondary |
Compared with nRF52840-QIAA and DA1469x, CY8C6347LQI-BLD52T uniquely combines dual-CPU deterministic partitioning, hardware-accelerated full crypto suite, and field-programmable analog/digital resources-enabling single-chip implementation of complex, secure, sensor-rich BLE edge nodes without external components.
Availability
CY8C6347LQI-BLD52T is available at Aetrix Electronics and suitable for smart home sensor hubs, wireless medical wearables, industrial predictive maintenance nodes, and BLE-enabled asset trackers requiring stable component supply across design-in, prototyping, and production ramp phases.
Supply support for CY8C6347LQI-BLD52T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers, with global manufacturing and R&D infrastructure.
CY8C6347LQI-BLD52T belongs to the PSoC™ 63 product line, designed specifically for secure, ultra-low-power IoT endpoints that integrate wireless connectivity, sensor processing, and human interface functions in a single chip.
FAQ
What is the maximum operating frequency of the Cortex-M4F core in CY8C6347LQI-BLD52T?
The Cortex-M4F core operates at up to 150 MHz, verified by the device's internal PLL configuration and electrical specifications in Section 6.2.2 of datasheet 002-18787 Rev. *R. This frequency is achievable with the 1.1-V core supply and appropriate clock source (e.g., IMO × PLL). At 0.9-V core voltage, maximum frequency is reduced to maintain timing closure and power integrity.
Does CY8C6347LQI-BLD52T support external QSPI flash execution with hardware encryption?
Yes. The Serial Memory Interface (SMIF) supports Execute-In-Place (XIP) from external quad SPI flash with on-the-fly AES-128 decryption enabled via dedicated hardware cipher engine. Decryption keys are stored in protected flash or eFuse, and the 4-KB SMIF cache improves instruction fetch efficiency during XIP operation.
How many simultaneous Bluetooth LE connections does the on-chip radio support?
The integrated Bluetooth LE subsystem supports up to four simultaneous connections-either as master, slave, or mixed role-as confirmed by the Link Layer engine specification in Section 3.3 of the datasheet. Connection concurrency is managed entirely in hardware without CPU intervention, preserving M0+ cycles for application tasks.
Is CAPSENSE™ tuning fully automated in CY8C6347LQI-BLD52T?
Yes. CAPSENSE™ SmartSense provides fully automatic hardware tuning of IDAC, scan resolution, and averaging settings during initialization and runtime. It dynamically adapts to environmental changes (e.g., moisture, temperature drift) without host CPU involvement, delivering consistent SNR >100:1 across operating conditions.
CY8C6347LQI-BLD52T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 6 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M4F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz, 150MHz
- Connectivity:
- FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 288K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C6347LQI-BLD52T FAQ
1.How can I place an order for CY8C6347LQI-BLD52T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C6347LQI-BLD52T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C6347LQI-BLD52T reliable?
The price and inventory of CY8C6347LQI-BLD52T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C6347LQI-BLD52T is usually 5 days.
3.What payment methods are accepted for CY8C6347LQI-BLD52T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C6347LQI-BLD52T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C6347LQI-BLD52T?
CY8C6347LQI-BLD52T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C6347LQI-BLD52T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C6347LQI-BLD52T?
For technical support, including CY8C6347LQI-BLD52T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C6347LQI-BLD52T requirements.
6.How does Aetrix verify that CY8C6347LQI-BLD52T is sourced from the original manufacturer or authorized distributors?
All CY8C6347LQI-BLD52T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C6347LQI-BLD52T meets industry standards.
7.What is the process for return or replacement of CY8C6347LQI-BLD52T?
All CY8C6347LQI-BLD52T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C6347LQI-BLD52T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C6347LQI-BLD52T part is unused and in its original packaging.
Return procedure for CY8C6347LQI-BLD52T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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