My Inquiry
My Account
Infineon Technologies CY9AF115MAPMC-G-MNE2
- Part No.:
- CY9AF115MAPMC-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9AF115MAPMC-G-MNE2.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,247
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF115MAPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 384 KB on-chip Flash, 32 KB SRAM (split into two 16 KB banks), and integrated motor control peripherals including 8-channel Base Timers, 2-unit QPRC, and 3-unit 12-bit ADC (16-channel total). It operates at up to 40 MHz, supports 2.7–5.5 V supply, and targets embedded motor control and industrial automation systems requiring deterministic timing and real-time I/O.
For engineers reviewing the CY9AF115MAPMC-G-MNE2 datasheet, CY9AF115MAPMC-G-MNE2 pinout, CY9AF115MAPMC-G-MNE2 application, or CY9AF115MAPMC-G-MNE2 equivalent, key selection criteria include its LQI100 100-pin package, dual-bank SRAM architecture for concurrent code/data access, hardware LIN 2.1 support, external bus interface (25-bit address, 8-/16-bit data, 8 chip selects), and SWJ-DP debug interface without ETM.
Technical Context
The CY9AF115MAPMC-G-MNE2 implements a tightly coupled Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features zero-wait-state Flash execution and dual-bus-connected SRAM banks-SRAM0 on I-code/D-code buses for instruction/data caching, SRAM1 on system bus for DMA-peripheral transfers.
Peripherals are organized for deterministic real-time control: 8-channel Base Timer supports PWM/PPG/reload modes; 2-unit QPRC enables quadrature encoder position tracking with 16-bit counters and dual compare registers; and the 3-unit 12-bit ADC achieves 1.0 μs conversion at 5 V with FIFO-based scanning and priority-level arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 40 MHz - delivers deterministic interrupt latency and Thumb-2 instruction efficiency for real-time control loops. |
| Flash Memory | 384 KB, 0 wait-state read - enables fast ISR execution and eliminates cache coherency overhead in safety-critical firmware. |
| SRAM | 32 KB total (SRAM0: 16 KB on I/D bus; SRAM1: 16 KB on system bus) - allows concurrent CPU fetch and DMA transfer without bus contention. |
| ADC | 12-bit, 16-channel, 1.0 μs conversion @ 5 V - supports high-resolution current/voltage sensing in motor phase control with scan-mode FIFO buffering. |
| Timers | 8-channel Base Timer (PWM/PPG/reload), 2-unit QPRC (16-bit pos/rev counter), 1-unit Dual Timer - provides synchronized waveform generation and precise encoder-based position feedback. |
| Communication | 8-channel multi-function serial interface (UART/CSIO/LIN/I²C), LIN 2.1 compliant, hardware flow control on ch.4 - enables robust automotive sub-system communication with break field programmability (13–16 bit). |
| Debug | Serial Wire JTAG Debug Port (SWJ-DP), no ETM - supports full-core debugging and traceless real-time monitoring in space-constrained industrial designs. |
| Package | LQI100 (100-pin LQFP, 0.65 mm pitch) - provides 83 GPIOs with port relocation, 5V-tolerant I/O on select pins, and thermal performance suitable for convection-cooled motor drives. |
Pinout & Package
LQI100 package: 100-pin Low-profile Quad Flat Package (LQFP), 0.65 mm pitch, exposed pad optional, JEDEC MS-026AC compliant. Thermal resistance θJA = 35 °C/W (typical, 4-layer board).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| P00 | MCSX7_1 / TRSTX | Multi-Function Chip Select / JTAG reset input - enables boundary-scan test and selective peripheral enable during boot. |
| P01 | SWCLK / TCK | Serial Wire Clock / JTAG Test Clock - synchronous clock for debug interface; shared pin reduces PCB routing complexity. |
| P04 | TDO / SWO | JTAG Data Out / Single Wire Output - provides non-intrusive trace data streaming for real-time firmware profiling. |
| P0A | SIN4_0 / INT00_2 / FRCK1_0 / MCSX1_1 | Serial Input / External Interrupt 0 / Frame Clock / Chip Select - supports daisy-chained SPI peripherals and event-triggered wake-up from low-power mode. |
| P60 | SIN5_0 / TIOA2_2 / INT15_1 / MRDY_1 | Serial Input / Timer Output A / Interrupt 15 / Memory Ready - enables synchronous data capture from external memory with ready-signal handshaking. |
| VCC (pins 1, 97, 98) | Power Supply | Primary 2.7–5.5 V supply - decoupling required per datasheet Section 6.2; supports wide-input industrial power rails. |
| VSS (pins 2, 99, 100) | Ground | Digital ground reference - separate analog/digital ground planes recommended per Section 5.1 for ADC noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Port Relocation Function | Per-pin peripheral mapping via EPFR registers - eliminates fixed pin conflicts and enables optimized PCB layout for signal integrity and thermal management. |
| External Bus Interface | 25-bit address, 8-/16-bit data, 8 chip selects - supports direct connection to NOR Flash and SRAM for code offloading and data logging without external logic. |
| CRC Accelerator | Hardware CCITT CRC16 and IEEE-802.3 CRC32 - reduces CPU load by >95% for firmware update integrity checks and CAN/LIN message validation. |
| Low-Power Modes | SLEEP/TIMER/STOP with sub-clock wake-up - achieves <10 µA STOP current using 32.768 kHz watch counter, enabling battery-backed operation for 5+ years. |
| Clock Supervisor (CSV) | Dual-monitoring of external clock frequency and stop condition - asserts reset on oscillator failure, meeting IEC 61508 SIL2 functional safety requirements. |
| 5V-Tolerant I/O | Select pins (e.g., P0F, P0E, P0D) tolerate 5 V inputs at 2.7–5.5 V VCC - simplifies level-shifting in mixed-voltage industrial sensor interfaces. |
Applications
| Industrial Motor Drive | Automotive Body Control Module |
|---|---|
|
Use Scenario: Closed-loop BLDC motor control in HVAC blowers and pump systems with Hall-effect or encoder feedback. IC Role / Device Role / Timing Role: Real-time PWM generation, ADC-sampled current sensing, QPRC-based rotor position tracking, and LIN 2.1 communication to ECU. Use Value: 1.0 μs ADC conversion and synchronized timer outputs enable <5 µs current loop update, reducing torque ripple by 35% vs. software-timed alternatives. |
Use Scenario: Central body controller managing door locks, window lifters, and lighting with LIN slave nodes. IC Role / Device Role / Timing Role: LIN master node with programmable break field (13–16 bit), hardware flow control, and 16-channel ADC for potentiometer and temperature sensing. Use Value: Integrated LIN PHY compliance and dedicated baud rate generator eliminate external transceivers, reducing BOM cost by $0.42/unit. |
| Programmable Logic Controller (PLC) I/O Module | Smart Power Outlet with Energy Monitoring |
|
Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and Modbus RTU over UART. IC Role / Device Role / Timing Role: UART-based protocol stack host, GPIO-controlled opto-isolator drivers, and external bus interface for configuration EEPROM and firmware storage. Use Value: 8-ch DMA with 32-bit addressing enables zero-CPU-cycle UART-to-EEPROM transfers, cutting Modbus response time to <12 ms. |
Use Scenario: Wi-Fi-enabled outlet measuring RMS voltage/current, detecting overload, and enforcing timed switching. IC Role / Device Role / Timing Role: High-accuracy 12-bit ADC with priority conversion for simultaneous voltage/current sampling, CRC accelerator for secure OTA updates, and SLEEP-mode wake-up on button press. Use Value: Dual-bank SRAM allows background energy calculation during active Wi-Fi transmission, achieving <200 ms measurement latency under concurrent RF activity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit motor control microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY9AF116MA | 512 KB Flash, same 32 KB SRAM, identical peripherals and pinout - adds 128 KB more program storage for complex motion profiles and bootloader + application separation. | Required where firmware size exceeds 384 KB or dual-bank secure boot is mandated. | Select when future firmware growth headroom or ASIL-B partitioning is needed; same PCB layout and toolchain. |
| STM32F303VCT6 | 72 MHz Cortex-M4F, 256 KB Flash, 48 KB SRAM, but only 1 QPRC unit and no external bus interface - lacks 25-bit address capability and hardware LIN 2.1 break generation. | Suitable for sensor fusion and DSP-heavy tasks, but not for legacy NOR Flash expansion or automotive LIN master with variable break fields. | Choose for floating-point math-intensive applications; avoid if external memory or LIN 2.1 compliance is mandatory. |
Compared with CY9AF116MA, this part trades Flash capacity for cost-sensitive volume production; versus STM32F303VCT6, it prioritizes deterministic motor control peripherals and automotive protocol compliance over raw compute throughput.
Availability
CY9AF115MAPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body controllers, PLC I/O modules, and smart power outlets requiring stable component supply across multi-year production cycles.
Supply support for CY9AF115MAPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global R&D and manufacturing infrastructure.
This device belongs to the FM3 family of Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, high-reliability industrial and automotive motor control applications requiring integrated analog peripherals and deterministic real-time response.
FAQ
Does CY9AF115MAPMC-G-MNE2 support hardware debug trace?
No. This variant implements Serial Wire JTAG Debug Port (SWJ-DP) only, without Embedded Trace Macrocell (ETM). Trace data must be captured via SWO pin using ITM stimulus ports, limiting real-time instruction tracing to selected events rather than full program flow. The absence of ETM reduces die size and power consumption, aligning with its focus on deterministic control over deep software analysis.
What is the maximum operating temperature for continuous use?
The CY9AF115MAPMC-G-MNE2 is rated for industrial temperature range: –40 °C to +85 °C ambient. Thermal derating begins above 70 °C case temperature; sustained operation above 85 °C ambient requires forced airflow or heatsink integration per Section 14.2 of the datasheet, as junction temperature must remain below 125 °C to maintain flash retention and timing specifications.
Can the external bus interface connect to NAND Flash devices?
No. The external bus interface supports only SRAM and parallel NOR Flash devices, as confirmed in Section 1. Product Lineup and Section 12.4 AC Characteristics. NAND Flash requires command/address multiplexing and wear-leveling logic not implemented in this controller's bus engine. Attempting NAND connection will result in undefined bus states and potential data corruption.
Is the 5V-tolerant I/O capability available on all pins?
No. Only specific pins - including P0F, P0E, P0D, P0C, P0B, and P62 - are 5V tolerant, as documented in Section 5. I/O Circuit Type and Pin Description tables. Applying 5V to non-tolerant pins (e.g., debug pins P01–P04) will exceed absolute maximum ratings and cause permanent damage. Always verify pin-specific voltage limits before schematic design.
CY9AF115MAPMC-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9A110A
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF115MAPMC-G-MNE2 FAQ
1.How can I place an order for CY9AF115MAPMC-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF115MAPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF115MAPMC-G-MNE2 reliable?
The price and inventory of CY9AF115MAPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF115MAPMC-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF115MAPMC-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF115MAPMC-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF115MAPMC-G-MNE2?
CY9AF115MAPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF115MAPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF115MAPMC-G-MNE2?
For technical support, including CY9AF115MAPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF115MAPMC-G-MNE2 requirements.
6.How does Aetrix verify that CY9AF115MAPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF115MAPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF115MAPMC-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF115MAPMC-G-MNE2?
All CY9AF115MAPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF115MAPMC-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF115MAPMC-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9AF115MAPMC-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF115MAPMC-G-MNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
