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Infineon Technologies CY9AF131KAPMC-G-UNE2

Part No.:
CY9AF131KAPMC-G-UNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixCY9AF131KAPMC-G-UNE2.pdf
Description:
IC MCU 32BIT 64KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,500

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Product details

Overview

CY9AF131KAPMC-G-UNE2 from Cypress Semiconductor (now Infineon) is a 4 Mbit (512K × 8) low-power SRAM with PowerSnooze™ and embedded ECC, designed for high-reliability data buffering in industrial controllers and medical instrumentation. It delivers 10 ns access time at 2.2–3.6 V, supports 15 µA deep-sleep current, includes dedicated ERR output for single-bit error detection/correction, and operates across –40°C to +85°C.

For engineers reviewing the CY9AF131KAPMC-G-UNE2 datasheet, CY9AF131KAPMC-G-UNE2 pinout, CY9AF131KAPMC-G-UNE2 application, or CY9AF131KAPMC-G-UNE2 equivalent, key selection criteria include ECC-enabled data integrity, ultra-low IDS in deep-sleep mode, TTL-compatible I/O, multi-voltage support (1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V), and TSOP II package compatibility for space-constrained PCB layouts.

Technical Context

This SRAM integrates on-die ECC encoding/decoding logic that detects and corrects single-bit errors in real time without external circuitry, with ERR asserted as an open-drain output upon correction. Its PowerSnooze™ architecture enables seamless transition between active (ICC = 38 mA typ), standby (ISB2 = 6 mA typ), and deep-sleep (IDS = 15 µA) modes via dedicated DS pin control.

The device uses standard asynchronous SRAM protocol: CE and OE low for read, CE and WE low for write, with address latching on rising edge of CE. All I/O pins (I/O0–I/O7) are bidirectional and TTL-compatible, supporting 1.0 V data retention during power loss when VCC ≥ 1.65 V.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (512K words × 8 bits) - provides sufficient buffer depth for real-time sensor fusion or firmware stack storage in resource-constrained systems.
Access Time (tAA) 10 ns at 2.2–3.6 V - enables direct interfacing with 100 MHz microcontrollers without wait states.
Deep-Sleep Current (IDS) 15 µA max - extends battery life in portable diagnostic equipment during idle periods without data loss.
ECC Functionality Detects and corrects single-bit errors per access - eliminates need for external error-handling firmware or redundant memory mapping.
Operating Voltage 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V - supports legacy 5 V logic, modern low-voltage MCUs, and mixed-supply systems.
Data Retention 1.0 V minimum VCC - maintains stored configuration or calibration data during brown-out conditions.
Temperature Range –40°C to +85°C industrial grade - validated for deployment in factory automation PLCs and outdoor IoT gateways.

Pinout & Package

Package: 44-pin TSOP II (10.16 mm × 20.0 mm, 0.8 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
/CE Chip Enable (active-low) Primary device select; must be low for read/write cycles; high disables all internal operations including ECC logic.
/OE Output Enable (active-low) Controls I/O bus direction; low enables output drivers, high places I/O pins in high-impedance state.
/WE Write Enable (active-low) Asserted with /CE low to initiate write; timing-critical for setup/hold relative to address and data edges.
DS Deep Sleep (active-low) Puts device into 15 µA retention mode; overrides /CE, disabling all access while preserving data at ≥1.0 V VCC.
ERR Error Flag Output (open-drain) Pulled low when ECC detects/corrects a single-bit error; requires external pull-up for system-level fault logging.
I/O0–I/O7 Bidirectional Data Bus 8-bit parallel interface; TTL-compatible voltage thresholds enable direct connection to legacy MCU GPIOs.
A0–A18 Address Inputs 19-bit address bus selects one of 524,288 locations; A0 is LSB, A18 is MSB.

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Mode Reduces current to 15 µA while retaining full 4 Mbit content - critical for battery-powered edge nodes requiring >1-year shelf life.
On-Die ECC Logic Hardware-accelerated single-bit error detection and correction per memory access - eliminates software overhead and improves MTBF in safety-critical systems.
Dedicated ERR Output Open-drain flag signals corrected errors without CPU polling - enables deterministic fault response in real-time OS environments.
Multi-Voltage Operation Three independent VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) - simplifies integration across generations of host processors without level-shifting.
TTL-Compatible I/O Meets standard 1.4 V VIH / 0.4 V VIL thresholds at 3.0 V VCC - ensures interoperability with legacy 3.3 V and 5 V microcontrollers.

Applications

Industrial PLC Data Logging Medical Patient Monitor Buffering

Use Scenario: Storing real-time ECG waveform samples and alarm history during power interruption.

IC Role / Device Role / Timing Role: High-integrity buffer memory with ECC-protected storage and 1.0 V data retention.

Use Value: Prevents loss of diagnostic waveforms during brief AC dropout, meeting IEC 60601-1 data integrity requirements.

Use Scenario: Caching sensor fusion outputs from multiple biometric sensors before transmission.

IC Role / Device Role / Timing Role: Low-latency (10 ns) SRAM acting as temporary staging buffer between ADC subsystem and ARM Cortex-M4 host.

Use Value: Enables deterministic 100 kHz sampling without DMA stalls, reducing jitter in vital sign calculations.

Avionics Flight Recorder Interface Railway Signaling Controller Memory

Use Scenario: Holding last 30 seconds of flight telemetry prior to crash-triggered write-to-flash.

IC Role / Device Role / Timing Role: Radiation-tolerant buffer with ECC correction to mitigate single-event upsets in airborne environments.

Use Value: Maintains data fidelity under ionizing radiation exposure where uncorrected bit flips would corrupt black box records.

Use Scenario: Storing interlocking logic state tables and event timestamps in EN 5012x-certified signaling hardware.

IC Role / Device Role / Timing Role: Industrial-grade SRAM with –40°C to +85°C operation and deep-sleep retention for fail-safe state preservation.

Use Value: Guarantees consistent behavior during thermal cycling and extended power-loss events in trackside cabinets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC-enabled SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV5128BLL-10MLI No embedded ECC; requires external error-checking logic; 10 ns access, 3.3 V only; 44-pin TSOP II. Lacks hardware ECC - increases firmware complexity and CPU load for error handling in safety-critical use cases. Select only if cost sensitivity outweighs reliability requirements and external ECC implementation is acceptable.
AS6C4008-10TIN Includes parity (not full ECC); 10 ns access; 3.3 V only; 32-pin SOJ; no ERR pin or deep-sleep mode. Provides basic error detection only; cannot correct errors or signal correction events - insufficient for IEC 62304 Class C software. Choose only for non-safety applications where parity suffices and board space constraints favor SOJ over TSOP II.

Compared with IS61WV5128BLL-10MLI and AS6C4008-10TIN, CY9AF131KAPMC-G-UNE2 uniquely combines hardware ECC correction, ERR signaling, and 15 µA deep-sleep retention - delivering verified data integrity and ultra-low-power operation in a single monolithic solution.

Availability

CY9AF131KAPMC-G-UNE2 is available at Aetrix Electronics and suitable for industrial PLC data logging, medical patient monitor buffering, avionics flight recorder interfaces, and railway signaling controller memory requiring stable component supply and long-term lifecycle support.

Supply support for CY9AF131KAPMC-G-UNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, acquired by Infineon Technologies in 2020, designs high-reliability memory and microcontroller solutions for industrial, automotive, and medical markets.

This part belongs to the CY7S1049G/E family of PowerSnooze™ SRAMs engineered specifically for applications demanding simultaneous low-power operation, hardware-based data integrity, and wide-voltage flexibility in harsh environments.

FAQ

Does CY9AF131KAPMC-G-UNE2 support automatic error correction without CPU intervention?

Yes. The device performs single-bit error detection and correction autonomously within each memory access cycle using on-die ECC logic. When a correctable error occurs, it is fixed before data is placed on the I/O bus, and the ERR pin asserts low to notify the system - no firmware action is required for correction.

What is the minimum VCC required to retain data in deep-sleep mode?

The device guarantees data retention down to 1.0 V VCC in deep-sleep mode (DS = low). This specification is tested and guaranteed across the full industrial temperature range (–40°C to +85°C), enabling reliable operation during brown-out conditions without backup capacitors.

Can the ERR pin be used as a general-purpose interrupt output?

No. ERR is a dedicated open-drain output that pulses low only when a single-bit error is detected and corrected. It does not latch, cannot be cleared by software, and has no programmable threshold or duration - its sole purpose is to signal ECC correction events for system-level logging or diagnostics.

Is CY9AF131KAPMC-G-UNE2 compatible with legacy 5 V microcontrollers?

Yes. The device supports 4.5–5.5 V VCC operation with TTL-compatible input thresholds (VIH = 2.2 V min, VIL = 0.8 V max) and output drive strength sufficient to drive standard 5 V CMOS loads, enabling direct interface with legacy 8051, PIC, or FPGA-based controllers without level shifters.

CY9AF131KAPMC-G-UNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-LQFP
Series:
FM3 MB9A130LA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSIO, I2C, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF131KAPMC-G-UNE2 FAQ

1.How can I place an order for CY9AF131KAPMC-G-UNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF131KAPMC-G-UNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF131KAPMC-G-UNE2 reliable?

The price and inventory of CY9AF131KAPMC-G-UNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF131KAPMC-G-UNE2 is usually 5 days.

3.What payment methods are accepted for CY9AF131KAPMC-G-UNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF131KAPMC-G-UNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF131KAPMC-G-UNE2?

CY9AF131KAPMC-G-UNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF131KAPMC-G-UNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF131KAPMC-G-UNE2?

For technical support, including CY9AF131KAPMC-G-UNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF131KAPMC-G-UNE2 requirements.

6.How does Aetrix verify that CY9AF131KAPMC-G-UNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AF131KAPMC-G-UNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF131KAPMC-G-UNE2 meets industry standards.

7.What is the process for return or replacement of CY9AF131KAPMC-G-UNE2?

All CY9AF131KAPMC-G-UNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF131KAPMC-G-UNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF131KAPMC-G-UNE2 part is unused and in its original packaging.

Return procedure for CY9AF131KAPMC-G-UNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AF131KAPMC-G-UNE2 Tags

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