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Infineon Technologies CY9AF132LAPMC1-G-SNE2

Part No.:
CY9AF132LAPMC1-G-SNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9AF132LAPMC1-G-SNE2.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,991

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Product details

Overview

CY9AF132LAPMC1-G-SNE2 from Cypress Semiconductor is a 4 Mbit (512K × 8) low-power static RAM with PowerSnooze™ and embedded ECC, designed for high-reliability data buffering in industrial controllers and medical instrumentation. It delivers 10 ns access time at 2.2–3.6 V, supports 15 µA deep-sleep current, features an ERR output for single-bit error detection/correction, and operates across –40°C to +85°C.

For engineers reviewing the CY9AF132LAPMC1-G-SNE2 datasheet, CY9AF132LAPMC1-G-SNE2 pinout, CY9AF132LAPMC1-G-SNE2 application, or CY9AF132LAPMC1-G-SNE2 equivalent, key selection criteria include ECC-enabled data integrity, ultra-low IDS in battery-backed systems, voltage flexibility (1.65–3.6 V), and TSOP II package compatibility with legacy SRAM footprints.

Technical Context

The device integrates on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read operations without external circuitry. Its PowerSnooze™ architecture enables seamless transition between active, standby (ISB2 = 6 mA), and deep-sleep (IDS = 15 µA) modes via dedicated DS pin control.

It uses standard TTL-compatible I/O signaling with 512K × 8 organization, address decoding up to A0–A18, and supports asynchronous read/write cycles with CE, OE, and WE control. The ERR pin asserts low only when a correctable single-bit error is detected - no auto-writeback or multi-bit error handling is implemented.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (512K words × 8 bits) - provides byte-wide data interface compatible with 8-bit microcontrollers and legacy bus architectures.
Access Time (tAA) 10 ns at 2.2–3.6 V - enables direct interfacing with 100 MHz system clocks without wait states.
Deep Sleep Current (IDS) 15 µA max - sustains data retention during extended power-off periods in battery-critical applications like portable diagnostics.
ECC Functionality Detects and corrects single-bit errors per 8-bit word - eliminates need for external error-handling firmware or redundant memory layers.
Supply Voltage Range 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V - supports mixed-voltage designs and brown-out resilience across industrial power rails.
Operating Temperature –40°C to +85°C - qualified for use in uncontrolled industrial enclosures and medical equipment without forced cooling.
Data Retention Voltage 1.0 V min - maintains stored contents during ultra-low-voltage backup, reducing hold-up capacitor requirements.

Pinout & Package

Package: 44-pin TSOP II (10.16 mm × 20.00 mm, 0.8 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
/CE Chip Enable Active-low global enable; disables all internal operations and reduces current to ISB2 or IDS depending on DS state.
/OE Output Enable Active-low read strobe; controls I/O bus drivers only - does not affect internal memory array power state.
/WE Write Enable Active-low write strobe; latches data from I/O0–I/O7 into addressed location when /CE and /OE are high.
DS Deep Sleep Input Active-low entry to 15 µA retention mode; overrides /CE and freezes address/data latches until deasserted.
ERR Error Flag Output Open-drain active-low signal pulsed during read if single-bit error detected and corrected - requires external pull-up.
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; no internal address multiplexing required.
I/O0–I/O7 Bidirectional Data Bus 8-bit TTL-compatible data path; high-impedance when /CE high or /OE high during reads/writes.

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Mode Reduces current to 15 µA while retaining full 4 Mbit content - extends battery life in portable monitoring devices by >10× vs standard SRAM.
On-Die ECC Logic Corrects single-bit errors in real time without CPU intervention or memory controller overhead - critical for safety-critical data logging.
ERR Pin Assertion Provides hardware-level notification of corrected errors - enables diagnostic logging or fault escalation without polling or software checks.
Multi-Voltage Operation Single part supports 1.8 V, 3.3 V, and 5 V systems - simplifies BOM consolidation across product variants and legacy upgrades.
Industrial Temperature Range Rated for continuous operation from –40°C to +85°C - eliminates derating concerns in factory automation or outdoor medical deployments.

Applications

Industrial PLC Data Buffering Portable Medical Diagnostic Logger

Use Scenario: Real-time acquisition of sensor data (ECG, SpO₂) with timestamped storage prior to wireless upload.

IC Role / Device Role / Timing Role: High-speed, ECC-protected scratchpad memory holding raw samples during intermittent transmission windows.

Use Value: Prevents silent data corruption in long-duration recordings; 15 µA deep sleep preserves battery charge between measurement cycles.

Use Scenario: Battery-powered handheld ultrasound unit capturing frame buffers before compression and display.

IC Role / Device Role / Timing Role: Low-latency 8-bit data buffer interfacing directly with ADC/DAC peripherals and ARM Cortex-M4 core.

Use Value: 10 ns access time avoids pipeline stalls; ERR flag alerts firmware to potential sensor noise-induced bit flips.

Railway Signaling Event Recorder Smart Grid Edge Controller Cache

Use Scenario: Tamper-resistant logging of switch position changes and fault events in EN 5012x-certified trackside units.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding last-known safe state during mains failure or brownout.

Use Value: 1.0 V data retention allows smaller hold-up capacitors; ECC ensures integrity of safety-critical event timestamps.

Use Scenario: Local caching of metering data and firmware update fragments in DIN-rail-mounted distribution controllers.

IC Role / Device Role / Timing Role: Intermediary buffer between isolated RS-485 comms and flash-based application storage.

Use Value: Multi-voltage support (1.8/3.3 V) matches both MCU I/O and isolated transceiver rails; TSOP II footprint eases PCB layout reuse.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM-with-ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV5128BLL-10MLI No embedded ECC; requires external error-checking logic or software CRC; 10 ns access, 3.3 V only; 32-pin SOJ package. Lacks hardware error correction - unsuitable where silent data corruption must be prevented without CPU overhead. Select only if cost sensitivity outweighs reliability requirements and ECC can be implemented externally.
ON Semiconductor NVSRAM NVMFS16M8T01 Nonvolatile SRAM with integrated EEPROM backup; no ECC; 25 ns access; 48-pin TFBGA; retains data without external battery. Eliminates backup battery but adds latency on store/restore; no real-time correction during active operation. Prefer when data persistence after total power loss is mandatory, and single-bit error rates are low or tolerable.

Compared with IS61WV5128BLL-10MLI and NVMFS16M8T01, CY9AF132LAPMC1-G-SNE2 uniquely combines real-time ECC correction, ultra-low deep-sleep current, and multi-voltage support in a drop-in TSOP II footprint - making it optimal for battery-constrained, safety-aware embedded systems requiring zero-error data integrity.

Availability

CY9AF132LAPMC1-G-SNE2 is available at Aetrix Electronics and suitable for industrial PLC data buffering, portable medical diagnostic loggers, and railway signaling event recorders requiring stable component supply across extended product lifecycles.

Supply support for CY9AF132LAPMC1-G-SNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and medical applications, with emphasis on low-power operation and functional safety.

This device belongs to the PowerSnooze™ SRAM product line, engineered specifically for applications demanding deterministic low-power data retention and hardware-level error resilience without external support circuitry.

FAQ

Does CY9AF132LAPMC1-G-SNE2 support automatic error correction without CPU intervention?

Yes. The device performs single-bit error detection and correction entirely in hardware during each read cycle using on-die ECC logic. No firmware involvement is required - corrected data appears on I/O lines, and the ERR pin signals occurrence. There is no auto-writeback; the original memory location remains unmodified unless explicitly rewritten by the host.

What is the function of the DS pin, and how does it interact with /CE?

The DS (Deep Sleep) pin is active-low and takes precedence over /CE. When DS is low, the device enters 15 µA retention mode regardless of /CE state, disabling all internal timing and freezing address/data latches. To exit deep sleep, DS must be driven high first; /CE then resumes normal control of active/standby modes.

Can CY9AF132LAPMC1-G-SNE2 operate at 1.8 V and still achieve 10 ns access time?

No. At 1.65–2.2 V supply, the guaranteed maximum access time is 15 ns (not 10 ns). The 10 ns specification applies only within the 2.2–3.6 V and 4.5–5.5 V ranges. For 1.8 V systems requiring sub-15 ns performance, design margin verification per actual board conditions is recommended.

Is the ERR pin open-drain, and what pull-up value is recommended?

Yes, ERR is an open-drain output requiring an external pull-up resistor. Cypress recommends a 4.7 kΩ resistor to VCC for standard TTL/CMOS interfacing. The pin asserts low for ≥20 ns upon detection of a correctable error during a read cycle, and returns high-Z afterward - no latching or sustained assertion occurs.

CY9AF132LAPMC1-G-SNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9A130LA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSIO, I2C, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF132LAPMC1-G-SNE2 FAQ

1.How can I place an order for CY9AF132LAPMC1-G-SNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF132LAPMC1-G-SNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF132LAPMC1-G-SNE2 reliable?

The price and inventory of CY9AF132LAPMC1-G-SNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF132LAPMC1-G-SNE2 is usually 5 days.

3.What payment methods are accepted for CY9AF132LAPMC1-G-SNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF132LAPMC1-G-SNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF132LAPMC1-G-SNE2?

CY9AF132LAPMC1-G-SNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF132LAPMC1-G-SNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF132LAPMC1-G-SNE2?

For technical support, including CY9AF132LAPMC1-G-SNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF132LAPMC1-G-SNE2 requirements.

6.How does Aetrix verify that CY9AF132LAPMC1-G-SNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AF132LAPMC1-G-SNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF132LAPMC1-G-SNE2 meets industry standards.

7.What is the process for return or replacement of CY9AF132LAPMC1-G-SNE2?

All CY9AF132LAPMC1-G-SNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF132LAPMC1-G-SNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF132LAPMC1-G-SNE2 part is unused and in its original packaging.

Return procedure for CY9AF132LAPMC1-G-SNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AF132LAPMC1-G-SNE2 Tags

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