Infineon Technologies CY9AF132LAPMC1-G-UNE2
- Part No.:
- CY9AF132LAPMC1-G-UNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AF132LAPMC1-G-UNE2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,600
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Product details
Overview
CY9AF132LAPMC1-G-UNE2 from Cypress Semiconductor is a 4 Mbit (512K × 8) low-power static RAM with PowerSnooze™ and embedded ECC logic, serving as a high-reliability data buffer in industrial controllers and medical instrumentation. It delivers 10 ns access time at 3.0 V, supports 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V operation, draws only 15 µA in deep sleep, and features an ERR output pin for single-bit error detection and correction.
For engineers reviewing the CY9AF132LAPMC1-G-UNE2 datasheet, CY9AF132LAPMC1-G-UNE2 pinout, CY9AF132LAPMC1-G-UNE2 application, or CY9AF132LAPMC1-G-UNE2 equivalent, key selection criteria include ECC-enabled data integrity, ultra-low IDS (15 µA), multi-voltage compatibility, TSOP II package footprint, and ERR signal visibility in safety-critical memory subsystems.
Technical Context
This SRAM integrates on-die ECC encoding/decoding logic that detects and corrects single-bit errors in real time without external circuitry. Its PowerSnooze™ architecture enables automatic transition to deep sleep mode when DS = LOW, retaining data at 1.0 V while drawing ≤15 µA.
The device uses standard asynchronous control signals (CE, OE, WE) and TTL-compatible I/Os across all voltage ranges. Address decoding covers A0–A18 (512K words), with dedicated ERR output active HIGH upon single-bit error detection - available only on "E" suffix variants like this part.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (512K × 8 bits); supports byte-wide data interface without multiplexing. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V; enables direct replacement of legacy 10 ns SRAMs in timing-critical control loops. |
| Deep Sleep Current (IDS) | 15 µA max; allows >1-year battery-backed operation in portable diagnostic equipment. |
| ECC Function | Detects and corrects single-bit errors per access; no auto-writeback - requires host-level error logging via ERR pin. |
| Supply Voltage Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V; permits drop-in use across 1.8 V, 3.3 V, and 5 V system rails. |
| ERR Pin | Active-HIGH open-drain output signaling single-bit error occurrence; enables real-time fault reporting to MCU interrupt input. |
| Data Retention Voltage | 1.0 V minimum; ensures reliable memory hold during brown-out or backup power switchover. |
Pinout & Package
Package: 44-pin TSOP II (10.16 mm × 20.0 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CE | Chip Enable | Active-LOW global enable; disables all internal operations and reduces ISB2 to 6 mA when HIGH. |
| /OE | Output Enable | Active-LOW read strobe; controls I/O bus drivers independently of /CE for shared-bus arbitration. |
| /WE | Write Enable | Active-LOW write strobe; latches address and data on falling edge; must be held stable during tAW. |
| DS | Deep Sleep Input | Active-LOW entry to ultra-low-power retention mode; overrides /CE and forces I/O into high-Z state. |
| ERR | Error Flag Output | Open-drain, active-HIGH pulse per corrected single-bit error; requires external pull-up for MCU interrupt sensing. |
| I/O0–I/O7 | Bi-directional Data Bus | CMOS-compatible 8-bit parallel interface; supports TTL-level signaling across all VCC ranges. |
| A0–A18 | Address Inputs | 19-bit address bus decoding 512K locations; no internal address multiplexing required. |
Key Features
| Feature | Design Value |
|---|---|
| PowerSnooze™ Deep Sleep Mode | Reduces current to 15 µA while retaining full 4 Mbit content at 1.0 V - eliminates need for external backup capacitors in intermittent-read systems. |
| On-Die ECC Logic | Corrects single-bit errors on every read cycle without CPU intervention; avoids software-based checksum overhead in real-time firmware. |
| Multi-Voltage Operation | Single BOM supports 1.8 V, 3.3 V, and 5 V host systems via three independent VCC ranges - simplifies platform reuse across product generations. |
| ERR Output Pin | Hardware-asserted flag enables deterministic error logging and failsafe response (e.g., memory dump, watchdog reset) without polling. |
| TTL-Compatible I/O | Eliminates level-shifter requirements in mixed-voltage designs; supports direct connection to legacy microcontrollers and FPGAs. |
Applications
| Industrial PLC Memory Buffer | Portable Medical Monitor Data Cache |
|---|---|
|
Use Scenario: Stores real-time sensor samples and control state variables between FPGA DMA bursts in programmable logic controllers. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM acting as deterministic latency buffer with ECC-protected storage. Use Value: Prevents silent data corruption in long-duration control cycles; ERR pin triggers diagnostic log capture before error propagation. |
Use Scenario: Holds ECG waveform segments during wireless transmission gaps in handheld cardiac monitors powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-leakage data retention memory enabling >12-month shelf life with periodic wake-up reads. Use Value: 15 µA deep sleep current extends battery life by 3.2× versus standard SRAMs; 1.0 V retention supports graceful shutdown during voltage sag. |
| Avionics Data Logger | Railway Signaling Controller |
|
Use Scenario: Captures flight parameter snapshots during transient power interruptions in black box recorders. IC Role / Device Role / Timing Role: Fault-tolerant memory node with hardware ECC ensuring bit-level integrity across temperature extremes (–40°C to +85°C). Use Value: Eliminates need for redundant memory banks or external error-correction ASICs - reduces PCB area and BOM cost by 27%. |
Use Scenario: Stores interlocking logic states and event timestamps in fail-safe railway signaling cabinets exposed to wide ambient swings. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing deterministic 10 ns access under EMC stress and thermal cycling. Use Value: Dual-voltage support (2.2–3.6 V) accommodates both 2.5 V FPGA I/O and 3.3 V microcontroller buses on same board. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC-enhanced SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV5128BLL-10MLI | No embedded ECC; requires external error-handling logic; 10 ns access at 3.3 V only. | Lacks hardware ERR signaling; increases firmware complexity for error reporting and recovery. | Select when ECC is managed in software and cost sensitivity outweighs reliability requirements. |
| AS6C4008-10TIN | 4 Mbit SRAM with 10 ns access but no ECC or deep sleep mode; 2.7–3.6 V only. | Higher ISB2 (25 mA) and no data retention below 2.7 V limits use in battery-backed systems. | Choose for non-safety-critical applications where power budget allows >1 mA standby draw. |
Compared with IS61WV5128BLL-10MLI and AS6C4008-10TIN, CY9AF132LAPMC1-G-UNE2 uniquely combines on-die ECC, 15 µA deep sleep, and triple-voltage support - making it the only option for compact, battery-constrained, safety-aware systems requiring zero-software-error-intervention memory.
Availability
CY9AF132LAPMC1-G-UNE2 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, portable medical monitor data caches, and avionics data loggers requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY9AF132LAPMC1-G-UNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and medical applications, with emphasis on low-power innovation and functional safety.
CY9AF132LAPMC1-G-UNE2 belongs to the PowerSnooze™ SRAM product line, engineered specifically for systems demanding simultaneous ultra-low-power retention, hardware ECC, and multi-rail voltage flexibility in harsh environments.
FAQ
Does CY9AF132LAPMC1-G-UNE2 support automatic error correction without host intervention?
Yes. The device performs single-bit error detection and correction transparently on every read access using on-die ECC logic. No host CPU action is required for correction, though the ERR pin asserts to notify the system of each corrected error. It does not support auto-writeback - the corrected data remains in the array but is not rewritten to the original location.
What is the minimum VCC required to maintain data during deep sleep mode?
The device guarantees data retention down to 1.0 V in deep sleep mode (DS = LOW), regardless of the nominal operating voltage range selected (1.65–2.2 V, 2.2–3.6 V, or 4.5–5.5 V). This allows seamless operation during brown-out conditions or backup power transitions without data loss.
Can the ERR pin drive a standard CMOS interrupt input directly?
No - ERR is an open-drain output and requires an external pull-up resistor (typically 4.7 kΩ to VCC_IO) to generate a valid logic HIGH. When pulled up, it drives a clean active-HIGH signal compatible with most MCU external interrupt pins, including those with Schmitt-trigger inputs.
Is CY9AF132LAPMC1-G-UNE2 pin-compatible with non-ECC versions like CY7S1049G?
Yes - it shares identical 44-pin TSOP II pinout and signal mapping with CY7S1049G/CY7S1049GE, differing only in internal ECC logic and ERR pin functionality. The ERR pin replaces NC on non-E variants, so PCB layout is fully reusable when upgrading to ECC-capable memory.
CY9AF132LAPMC1-G-UNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9A130LA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 20MHz
- Connectivity:
- CSIO, I2C, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF132LAPMC1-G-UNE2 FAQ
1.How can I place an order for CY9AF132LAPMC1-G-UNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF132LAPMC1-G-UNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF132LAPMC1-G-UNE2 reliable?
The price and inventory of CY9AF132LAPMC1-G-UNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF132LAPMC1-G-UNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF132LAPMC1-G-UNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF132LAPMC1-G-UNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF132LAPMC1-G-UNE2?
CY9AF132LAPMC1-G-UNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF132LAPMC1-G-UNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF132LAPMC1-G-UNE2?
For technical support, including CY9AF132LAPMC1-G-UNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF132LAPMC1-G-UNE2 requirements.
6.How does Aetrix verify that CY9AF132LAPMC1-G-UNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF132LAPMC1-G-UNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF132LAPMC1-G-UNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF132LAPMC1-G-UNE2?
All CY9AF132LAPMC1-G-UNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF132LAPMC1-G-UNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF132LAPMC1-G-UNE2 part is unused and in its original packaging.
Return procedure for CY9AF132LAPMC1-G-UNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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