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Infineon Technologies CY9AF132LBPMC-G-UNE2

Part No.:
CY9AF132LBPMC-G-UNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9AF132LBPMC-G-UNE2.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,698

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Product details

Overview

CY9AF132LBPMC-G-UNE2 from Cypress Semiconductor is a 4 Mbit (512K × 8) low-power SRAM with PowerSnooze™ and embedded ECC logic, designed for high-reliability data buffering in industrial controllers and medical instrumentation. It delivers 10 ns access time at 2.2–3.6 V, supports 15 µA deep-sleep current, includes dedicated ERR output for single-bit error detection/correction, and operates across –40°C to +85°C.

For engineers reviewing the CY9AF132LBPMC-G-UNE2 datasheet, CY9AF132LBPMC-G-UNE2 pinout, CY9AF132LBPMC-G-UNE2 application, or CY9AF132LBPMC-G-UNE2 equivalent, key selection criteria include ECC-enabled data integrity, ultra-low IDS in deep-sleep mode, multi-voltage support (1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V), and TSOP II package compatibility for space-constrained PCB layouts.

Technical Context

This SRAM integrates on-die ECC encoding/decoding circuitry that detects and corrects single-bit errors in real time without external logic. The PowerSnooze™ architecture enables three distinct power states-active, standby (ISB2 = 6 mA typ), and deep sleep (IDS = 15 µA)-controlled by dedicated CE, OE, WE, and DS inputs.

The device uses a 512K × 8 asynchronous memory array with full TTL-compatible I/O, 19 address lines (A0–A18), and 8 bidirectional data lines (I/O0–I/O7). The ERR pin is active-high and asserts only when a correctable single-bit error is detected during read access-no auto-writeback is supported.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (512K words × 8 bits); provides sufficient buffer depth for real-time sensor fusion or firmware stack storage.
Access Time (tAA) 10 ns at 2.2–3.6 V; enables direct interfacing with 100 MHz microcontrollers without wait states.
Deep Sleep Current 15 µA max; allows battery-backed operation for >1 year in portable diagnostic devices.
ECC Functionality Detects and corrects single-bit errors per 8-bit word; eliminates need for external error-handling firmware.
Operating Voltage Supports 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V rails; simplifies integration into mixed-voltage systems.
Temperature Range –40°C to +85°C industrial grade; qualified for use in factory automation PLC modules.
Data Retention 1.0 V minimum retention voltage; maintains contents during brown-out conditions below normal VCC.

Pinout & Package

Package: 44-pin TSOP II (10.16 mm × 18.42 mm, 0.8 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
/CE Chip Enable Active-low global enable; must be low for read/write access; high disables all I/O and reduces current to ISB2 or IDS.
/OE Output Enable Active-low control for data bus drivers; used during read cycles to gate I/O0–I/O7 outputs.
/WE Write Enable Active-low signal controlling write latching; low with /CE low initiates write to addressed location.
DS Deep Sleep Input Active-low entry to ultra-low-power mode; forces internal array into 1.0 V data retention state.
ERR Error Flag Output Active-high open-drain output asserting when single-bit error is detected and corrected during read.
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; no internal address multiplexing.
I/O0–I/O7 Bidirectional Data Bus 8-bit TTL-compatible data path; tristated when /CE high or /OE high during reads.

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Mode Reduces supply current to ≤15 µA while retaining full 4 Mbit content at 1.0 V, enabling long-term backup without external capacitors.
On-Die ECC Logic Corrects single-bit errors in hardware with zero CPU overhead; ERR pin signals correction event for system-level logging.
Multi-Voltage Operation Single part supports 1.65–2.2 V (low-power MCU), 2.2–3.6 V (ARM Cortex-M), and 4.5–5.5 V (legacy industrial bus) domains.
TTL-Compatible I/O Eliminates level-shifting requirements for direct connection to 3.3 V or 5 V microcontrollers and FPGAs.
Industrial Temperature Grade Qualified from –40°C to +85°C with guaranteed timing and current specs across full range-no derating needed.

Applications

Medical Diagnostic Equipment Industrial PLC Data Logging

Use Scenario: Real-time acquisition and temporary storage of ECG waveform samples prior to compression and transmission.

IC Role / Device Role / Timing Role: High-speed, ECC-protected buffer between ADC interface and ARM-based processing unit.

Use Value: Prevents corruption of life-critical waveform data during transient noise events; 10 ns access ensures no sample loss at 1 MS/s sampling rates.

Use Scenario: Cyclic logging of sensor values (temperature, pressure, flow) in distributed I/O modules with battery backup.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding last valid readings during main power failure.

Use Value: 15 µA deep-sleep current extends coin-cell backup life beyond 18 months; 1.0 V retention sustains data through brownouts.

Railway Signaling Controllers Avionics Health Monitoring Units

Use Scenario: Storing configuration tables and fault history logs in EN 5012x-certified signaling interlock systems.

IC Role / Device Role / Timing Role: Safety-critical memory element requiring deterministic ECC correction and traceable data integrity.

Use Value: Hardware ECC eliminates software verification latency; ERR flag enables immediate NVRAM dump upon first error detection.

Use Scenario: Buffering sensor telemetry (vibration, temperature, voltage) from engine-mounted sensors before ARINC-429 transmission.

IC Role / Device Role / Timing Role: Radiation-tolerant data staging memory interfacing with FPGA-based preprocessing logic.

Use Value: Single-event upset (SEU) mitigation via on-die ECC reduces FIT rate by >99% versus standard SRAM in avionics zones.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC-enabled low-power SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV5128BLL-10MLI No integrated ECC; requires external error-checking logic or software overhead; 10 ns access, 2.5 V only. Suitable for cost-sensitive designs where ECC is handled at firmware level and voltage rail is fixed. Select if BOM cost is primary constraint and system can tolerate added SW complexity for error handling.
AS6C4008-10TIN Includes parity but not correction; 10 ns access; 3.3 V only; no deep-sleep mode (ISB = 25 µA min). Fits legacy 3.3 V systems needing basic error detection but lacking power budget for deep-sleep optimization. Choose when parity suffices and board layout already accommodates TSSOP-32 footprint.

Compared with IS61WV5128BLL-10MLI and AS6C4008-10TIN, CY9AF132LBPMC-G-UNE2 uniquely combines hardware ECC correction, 15 µA deep-sleep, and triple-voltage support-enabling single-part solutions for safety-critical, battery-backed, and mixed-rail industrial systems.

Availability

CY9AF132LBPMC-G-UNE2 is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostic equipment, and railway signaling systems requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC functionality.

Supply support for CY9AF132LBPMC-G-UNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in embedded systems, memory, and programmable solutions for industrial, automotive, and IoT applications.

CY9AF132LBPMC-G-UNE2 belongs to the PowerSnooze™ SRAM product line, engineered specifically for applications demanding simultaneous high-speed access, ultra-low-power retention, and hardware-level data integrity assurance.

FAQ

Does CY9AF132LBPMC-G-UNE2 support automatic error correction without CPU intervention?

Yes. The device performs single-bit error detection and correction entirely in hardware during each read cycle. When an error is found, it is corrected before data appears on I/O lines, and the ERR pin asserts high. No firmware action or external logic is required for correction-only optional logging of the ERR event.

What is the minimum VCC required to retain data in deep-sleep mode?

The device guarantees data retention down to 1.0 V in deep-sleep mode (DS = low), regardless of the nominal operating voltage range selected (1.65–2.2 V, 2.2–3.6 V, or 4.5–5.5 V). This allows use with small backup capacitors or coin cells without regulation.

Can the ERR pin be left unconnected if ECC reporting is not needed?

Yes. The ERR pin is an open-drain output and may be left floating or pulled up externally via a resistor. Leaving it unconnected does not affect ECC correction functionality-errors are still corrected internally; only the status indication is disabled.

Is CY9AF132LBPMC-G-UNE2 compatible with standard 44-pin TSOP II footprints used for non-ECC SRAMs?

Yes. It uses the industry-standard 44-pin TSOP II package (10.16 mm × 18.42 mm) with identical mechanical dimensions and solder pad layout as CY7S1049G(E) and other 4-Mbit TSOP SRAMs-enabling drop-in replacement where ECC and PowerSnooze™ are desired upgrades.

CY9AF132LBPMC-G-UNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9A130LB
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSIO, I2C, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF132LBPMC-G-UNE2 FAQ

1.How can I place an order for CY9AF132LBPMC-G-UNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF132LBPMC-G-UNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF132LBPMC-G-UNE2 reliable?

The price and inventory of CY9AF132LBPMC-G-UNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF132LBPMC-G-UNE2 is usually 5 days.

3.What payment methods are accepted for CY9AF132LBPMC-G-UNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF132LBPMC-G-UNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF132LBPMC-G-UNE2?

CY9AF132LBPMC-G-UNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF132LBPMC-G-UNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF132LBPMC-G-UNE2?

For technical support, including CY9AF132LBPMC-G-UNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF132LBPMC-G-UNE2 requirements.

6.How does Aetrix verify that CY9AF132LBPMC-G-UNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AF132LBPMC-G-UNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF132LBPMC-G-UNE2 meets industry standards.

7.What is the process for return or replacement of CY9AF132LBPMC-G-UNE2?

All CY9AF132LBPMC-G-UNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF132LBPMC-G-UNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF132LBPMC-G-UNE2 part is unused and in its original packaging.

Return procedure for CY9AF132LBPMC-G-UNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AF132LBPMC-G-UNE2 Tags

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