Infineon Technologies CY9AF141LAPMC1-G-MNE2
- Part No.:
- CY9AF141LAPMC1-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AF141LAPMC1-G-MNE2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,600
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Product details
Overview
CY9AF141LAPMC1-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and integrated peripherals including UART/CSIO/I²C, 24-channel 12-bit ADC (2.0 μs conversion), 8-channel DMA, RTC, HDMI-CEC, and six low-power modes. It targets embedded motor control and industrial HMI applications requiring real-time responsiveness and code security.
For engineers reviewing the CY9AF141LAPMC1-G-MNE2 datasheet, CY9AF141LAPMC1-G-MNE2 pinout, CY9AF141LAPMC1-G-MNE2 application, or CY9AF141LAPMC1-G-MNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 5 V-tolerant GPIO support, hardware flow control on UART ch.4, sub-3.6 V operation down to 1.65 V, and SWJ-DP debug interface compatibility.
Technical Context
This MCU implements an ARM Cortex-M3 r2p1 core running at up to 40 MHz with NVIC supporting 48 peripheral interrupts and 16 priority levels. Its memory subsystem includes dual-operation Flash enabling concurrent read-erase-write across upper (240 KB) and lower (16 KB main + 32 KB work) banks, plus two independent SRAM blocks optimized for instruction/data (SRAM0) and system bus (SRAM1) access.
The peripheral set integrates eight base timers (configurable as PWM/PPG/reload/PWC), dual watchdogs (hardware clocked by 100 kHz CR oscillator), CRC accelerator for CCITT CRC16 and IEEE-802.3 CRC32, and HDMI-CEC transceiver with automatic ACK reply and arbitration loss detection - all operating within 1.65–3.6 V supply range and six defined low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with 24-bit SysTick timer for OS task scheduling. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work) - supports background firmware update without halting application code. |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1), separate I/D and system buses - reduces bus contention during high-throughput peripheral transfers. |
| ADC | 24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - meets fast-sampling requirements in motor current sensing and sensor fusion. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in always-on remote controls and smart sensors. |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP) - provides full visibility into runtime behavior without dedicated trace pins. |
| Supply Voltage | 1.65 V to 3.6 V - compatible with single-cell Li-ion, coin-cell backup, and industrial 3.3 V rails. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | General-purpose I/O with port relocate | Configurable as UART0 TX/RX, CSIO0, or I²C0 SDA/SCL - enables flexible PCB layout and signal routing reuse. |
| P10–P17 | 5 V-tolerant GPIO | Direct interface to legacy 5 V logic or industrial sensors without level shifters - reduces BOM cost and board area. |
| P40–P47 | ADC input channels AN0–AN7 | Dedicated analog inputs with internal sample-and-hold - supports simultaneous sampling across multiple motor phase currents. |
| CLKIN/CLKOUT | Main clock input/output | Accepts 4–48 MHz external crystal or oscillator - provides precise timing source for USB-free communication and PWM generation. |
| RTCXTAL1/RTCXTAL2 | 32.768 kHz RTC crystal interface | Drives autonomous real-time calendar with leap-year compensation - enables time-stamped logging in unattended equipment. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates with zero downtime via bank-swapping - critical for field-deployed industrial controllers. |
| HDMI-CEC transceiver | Integrated CEC protocol engine with automatic START/EOM/ACK generation - eliminates external protocol IC in AV equipment remote management. |
| Hardware UART flow control (ch.4) | CTS/RTS handshaking prevents data loss at high baud rates - ensures reliable host-to-MCU command streaming in HMI panels. |
| Two independent SRAM banks | SRAM0 (I/D bus) + SRAM1 (system bus) allow parallel CPU fetch and DMA transfer - improves throughput in data-acquisition systems. |
| CRC accelerator (CRC16/CRC32) | Offloads integrity checks from CPU during firmware OTA or sensor data logging - reduces interrupt latency by >90% vs software CRC. |
Applications
| Industrial Motor Control | Smart Home Remote Hub |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, thermal monitoring, and CAN-free communication. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing 24-channel ADC sampling, generating 16-bit PWM, and handling UART-based commissioning. Use Value: Dual-bank Flash allows safe field firmware upgrades; 2.0 μs ADC enables precise current reconstruction at 50 kHz switching frequency. | Use Scenario: Central IR/RF/HDMI-CEC hub aggregating commands from multiple remotes and relaying to AV devices. IC Role / Device Role / Timing Role: Protocol translator and scheduler with RTC-triggered wake-up and low-power sleep between events. Use Value: Integrated HDMI-CEC transceiver eliminates external transceiver IC; Deep Standby RTC mode draws <1 μA while maintaining calendar time. |
| Portable Medical Sensor Node | Factory Automation I/O Module |
Use Scenario: Battery-powered wearable device acquiring ECG, temperature, and motion data for cloud upload. IC Role / Device Role / Timing Role: Data acquisition engine with 12-bit ADC oversampling, CRC-secured BLE packet prep, and RTC timestamping. Use Value: 1.65 V minimum supply enables operation until LiPo cell drops to 3.0 V; six low-power modes extend runtime beyond 7 days on 200 mAh battery. | Use Scenario: DIN-rail mounted digital I/O module converting 24 V industrial signals to Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Protocol handler interfacing isolated GPIO, UART-driven RS-485 transceiver, and 16-bit reload timers for pulse-width measurement. Use Value: 5 V-tolerant GPIO accepts direct connection to PLC-level inputs; external bus interface supports optional local display memory expansion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CEC | Lacks integrated CEC and safe firmware update capability; requires external level shifters for 5 V interfaces | Choose when higher CPU speed and larger SRAM outweigh need for CEC and banked Flash. |
| NXP LPC1769 | 100 MHz Cortex-M3, 512 KB Flash, 64 KB SRAM, no RTC with calendar or HDMI-CEC | No built-in RTC calendar or CEC transceiver; uses separate 32.768 kHz crystal for basic timer only | Prefer when raw processing bandwidth and Ethernet MAC are required over time-aware protocols. |
Compared with STM32F103VCT6 and LPC1769, CY9AF141LAPMC1-G-MNE2 uniquely combines dual-bank Flash for fail-safe updates, HDMI-CEC protocol acceleration, and 5 V-tolerant I/O - making it optimal for cost-sensitive, protocol-integrated embedded controllers where field reliability and interface simplicity are critical.
Availability
CY9AF141LAPMC1-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart home hubs, portable medical sensors, and factory automation I/O modules requiring stable component supply across multi-year production cycles.
Supply support for CY9AF141LAPMC1-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-optimized, low-power embedded control applications requiring rich peripheral integration and robust field-upgrade capability.
FAQ
Does CY9AF141LAPMC1-G-MNE2 support in-system programming via UART?
Yes. The device supports bootloader-based firmware updates through UART using the built-in ROM-resident serial boot loader. This enables field reprogramming without JTAG hardware, provided the BOOT pin is asserted during reset and valid hex/bin files are transmitted at supported baud rates (up to 115.2 kbps).
What is the maximum operating temperature range for this MCU?
The CY9AF141LAPMC1-G-MNE2 is rated for industrial temperature range: –40 °C to +85 °C. Electrical characteristics including Flash write/erase endurance (100,000 cycles), ADC accuracy, and clock stability are guaranteed across this full range per datasheet Rev. *D Section 12.2.
Can the dual-bank Flash be used for secure firmware rollback?
Yes. By designating one bank as active and the other as standby, the MCU can validate new firmware in the standby bank before swapping execution. If validation fails or a reset occurs mid-update, the bootloader automatically resumes from the known-good bank - providing atomic, recoverable firmware updates.
Is the HDMI-CEC receiver compliant with CEC 2.0 specification?
Yes. The integrated HDMI-CEC block complies with HDMI CEC 2.0 (HDMI 1.4a and later), supporting logical addressing, broadcast messaging, and arbitration. It implements full transmitter/receiver functionality including automatic ACK, error detection, and repeat code handling per CEA-931-B standard.
CY9AF141LAPMC1-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9A140NA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 12x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF141LAPMC1-G-MNE2 FAQ
1.How can I place an order for CY9AF141LAPMC1-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF141LAPMC1-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF141LAPMC1-G-MNE2 reliable?
The price and inventory of CY9AF141LAPMC1-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF141LAPMC1-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF141LAPMC1-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF141LAPMC1-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF141LAPMC1-G-MNE2?
CY9AF141LAPMC1-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF141LAPMC1-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF141LAPMC1-G-MNE2?
For technical support, including CY9AF141LAPMC1-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF141LAPMC1-G-MNE2 requirements.
6.How does Aetrix verify that CY9AF141LAPMC1-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF141LAPMC1-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF141LAPMC1-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF141LAPMC1-G-MNE2?
All CY9AF141LAPMC1-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF141LAPMC1-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF141LAPMC1-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9AF141LAPMC1-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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