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Infineon Technologies CY9AF142LAPMC1-G-MNE2
- Part No.:
- CY9AF142LAPMC1-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AF142LAPMC1-G-MNE2.pdf
- Description:
- IC MCU 32BIT 160KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,600
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Product details
Overview
CY9AF142LAPMC1-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 40 MHz. It integrates UART/CSIO/I²C interfaces, 24-channel 12-bit ADC (2.0 µs conversion), 8-channel DMA, RTC, HDMI-CEC, and six low-power modes. Used in industrial motor control and smart sensor nodes requiring deterministic real-time response and code-in-place execution.
For engineers reviewing the CY9AF142LAPMC1-G-MNE2 datasheet, CY9AF142LAPMC1-G-MNE2 pinout, CY9AF142LAPMC1-G-MNE2 application, or CY9AF142LAPMC1-G-MNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, hardware flow control on UART ch.4, 5 V-tolerant GPIO support, and SWJ-DP debug interface compatibility with standard ARM toolchains.
Technical Context
This MCU implements the ARMv7-M architecture (r2p1) with NVIC supporting 48 peripheral interrupts and 16 priority levels. Its memory subsystem features separate I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access without contention.
The dual-operation Flash enables simultaneous read from one bank while erasing/writing to the other - critical for over-the-air (OTA) firmware updates without halting real-time tasks. Peripheral clocking is managed via five sources including main PLL, sub-clock (32.768 kHz), and two internal CR oscillators, with Clock Supervisor (CSV) monitoring external clock integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max - delivers deterministic interrupt latency and Thumb-2 instruction efficiency for embedded control loops. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - enables XIP execution and background update of active firmware image. |
| SRAM | 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - supports cacheless Harvard-style data/instruction separation. |
| ADC | 24-channel 12-bit SAR, 2.0 µs conversion @ 2.7–3.6 V - meets <5 µs sampling requirement for 3-phase motor current sensing. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention - achieves <1 µA RTC-only current for battery-backed timekeeping. |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP) - provides full halt-mode debugging and flash programming without dedicated JTAG pins. |
| Operating Voltage | 1.65 V to 3.6 V - supports direct interfacing with Li-ion battery systems and 3.3 V logic without level shifters. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply / Ground | Dedicated analog/digital power domains with separate decoupling requirements per datasheet Section 12.3.2. |
| XTAL1/XTAL2 | Main crystal oscillator input/output | Supports 4–48 MHz external crystals; required for precise timing in UART baud generation and PLL locking. |
| OSC32IN/OSC32OUT | 32.768 kHz sub-clock crystal | Drives RTC and Watch Counter; enables wake-up from Deep Standby modes with ±20 ppm accuracy. |
| P00–P07, P10–P17, etc. | Multi-function GPIO | Up to 83 fast I/O ports; port relocate function allows remapping of UART/CSIO/I²C to alternate pins for PCB layout optimization. |
| CTS4/RTS4 | Hardware flow control signals | Exclusive to UART channel 4; enables automatic RTS assertion and CTS-driven transmission throttling in noisy industrial environments. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables live firmware patching: execute from Bank A while updating Bank B, eliminating system downtime during OTA updates. |
| Hardware UART flow control (ch.4) | Eliminates RX buffer overflow in high-throughput serial telemetry by dynamically pausing transmission via RTS/CTS handshake. |
| 5 V-tolerant GPIO | Allows direct connection to legacy 5 V peripherals (e.g., sensors, displays) without external level translators, reducing BOM cost and board area. |
| HDMI-CEC transceiver | Integrates full CEC protocol stack (header auto-generation, ACK reply, arbitration loss detection) for TV/AVR remote control interoperability. |
| CRC accelerator (CRC16/CRC32) | Offloads integrity checks from CPU: processes 1 MB/s data streams at <1% CPU utilization, accelerating secure firmware validation. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers using FOC algorithms. IC Role / Device Role / Timing Role: Real-time execution host for PWM generation, ADC sampling (current/voltage), and PID computation with sub-µs timer jitter. Use Value: Base Timer channels configured as 16-bit PWM + PPG provide synchronized gate drive signals; dual-bank Flash allows field-upgradable motor profiles without stopping production lines. | Use Scenario: Battery-powered environmental monitor logging temperature/humidity/pressure with wireless upload. IC Role / Device Role / Timing Role: System controller managing sensor acquisition, RTC-triggered wake-up, low-power sleep scheduling, and UART-to-LoRaWAN bridge. Use Value: Deep Standby RTC mode draws <1.2 µA while maintaining accurate time; 12-bit ADC achieves 0.1°C temp resolution with 2.0 µs conversion for rapid duty-cycled sampling. |
| Home Automation Hub | CEC-Controlled AV System |
Use Scenario: Central gateway aggregating Zigbee/Z-Wave devices and exposing REST API to cloud services. IC Role / Device Role / Timing Role: Application processor running lightweight RTOS, handling multiple concurrent serial protocols and secure TLS handshakes. Use Value: 8-channel DMA moves sensor data directly to SRAM1 while CPU handles crypto; SWJ-DP enables in-field firmware recovery via USB-to-JTAG adapter. | Use Scenario: Set-top box coordinating power-on, volume sync, and input switching across TV, soundbar, and streaming stick. IC Role / Device Role / Timing Role: HDMI-CEC protocol engine generating START/EOM/ACK frames and interpreting remote commands with hardware-assisted timing. Use Value: Built-in CEC transmitter/receiver eliminates need for discrete transceivers; automatic ACK reply reduces firmware overhead by >70% vs. bit-banged implementation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | Single-bank 256 KB Flash, no hardware UART flow control, no HDMI-CEC, 72 MHz max clock | Lacks dual-bank Flash for safe OTA; requires software flow control; unsuitable for CEC-enabled AV products | Select when higher CPU speed is prioritized over firmware update safety and CEC compliance. |
| RP2040 | Dual-core ARM Cortex-M0+, 2 MB Flash, no built-in ADC, no RTC, no hardware CEC | No analog front-end or real-time clock; lacks industrial-grade voltage range (1.8–3.3 V only); no CEC stack | Select for cost-sensitive consumer IoT where dual-core concurrency outweighs analog integration and CEC needs. |
Compared with STM32F103VCT6 and RP2040, CY9AF142LAPMC1-G-MNE2 uniquely combines dual-bank Flash for fail-safe updates, hardware CEC for AV interoperability, and 1.65–3.6 V operation for direct battery interfacing - making it optimal for certified industrial and CE-marked home entertainment designs.
Availability
CY9AF142LAPMC1-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, home automation hubs, and HDMI-CEC-enabled AV systems requiring stable component supply across multi-year production cycles.
Supply support for CY9AF142LAPMC1-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
This device belongs to the FM3 family of general-purpose 32-bit microcontrollers designed for cost-sensitive industrial control, appliance, and consumer electronics applications demanding robust real-time performance and low-power flexibility.
FAQ
Does CY9AF142LAPMC1-G-MNE2 support in-application programming (IAP) of Flash?
Yes. Dual-bank Flash architecture enables true IAP: firmware can execute from Bank A while reprogramming Bank B. The Flash controller supports erase/write operations per sector (1 KB) or full bank, with lock bits preventing accidental overwrite of active code. No external programmer is needed after initial bootload.
What is the maximum operating temperature for this MCU?
The CY9AF142LAPMC1-G-MNE2 is rated for industrial temperature range: –40 °C to +85 °C ambient. Electrical characteristics in Section 12.2 of the datasheet (Rev. *D) specify DC/AC parameters across this full range, including Flash write endurance and ADC linearity.
Is hardware debug supported in all low-power modes?
SWJ-DP debug is available in Sleep, Timer, and RTC modes but disabled in Stop, Deep Standby RTC, and Deep Standby Stop modes. In Stop mode, debug access resumes only after wake-up event; in Deep Standby modes, the debug interface is powered down to minimize leakage current.
Can the 32.768 kHz sub-clock drive the RTC while the main CPU is in Deep Standby Stop mode?
Yes. The sub-clock oscillator remains active in Deep Standby Stop mode, sustaining RTC counting and alarm interrupts. RAM retention is configurable: users may select "keep RAM" or "lose RAM" depending on required wake-up latency and current budget (typ. 0.8 µA vs. 0.3 µA).
CY9AF142LAPMC1-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9A140NA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 160KB (160K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 12x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF142LAPMC1-G-MNE2 FAQ
1.How can I place an order for CY9AF142LAPMC1-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF142LAPMC1-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF142LAPMC1-G-MNE2 reliable?
The price and inventory of CY9AF142LAPMC1-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF142LAPMC1-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF142LAPMC1-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF142LAPMC1-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF142LAPMC1-G-MNE2?
CY9AF142LAPMC1-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF142LAPMC1-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF142LAPMC1-G-MNE2?
For technical support, including CY9AF142LAPMC1-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF142LAPMC1-G-MNE2 requirements.
6.How does Aetrix verify that CY9AF142LAPMC1-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF142LAPMC1-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF142LAPMC1-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF142LAPMC1-G-MNE2?
All CY9AF142LAPMC1-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF142LAPMC1-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF142LAPMC1-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9AF142LAPMC1-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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