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Infineon Technologies CY9AF144LBPMC1-G-JNE2

Part No.:
CY9AF144LBPMC1-G-JNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9AF144LBPMC1-G-JNE2.pdf
Description:
IC MCU 32BIT 288KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,927

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Product details

Overview

CY9AF144LBPMC1-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB on-chip SRAM (16 KB SRAM0 + 16 KB SRAM1), 40 MHz max CPU frequency, and integrated peripherals including UART/CSIO/I²C (up to 8 serial channels), 24-channel 12-bit ADC (2.0 μs conversion), RTC, HDMI-CEC, and six low-power modes. It targets embedded motor control and industrial HMI applications requiring deterministic real-time response and code security.

For engineers reviewing the CY9AF144LBPMC1-G-JNE2 datasheet, CY9AF144LBPMC1-G-JNE2 pinout, CY9AF144LBPMC1-G-JNE2 application, or CY9AF144LBPMC1-G-JNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 5 V-tolerant GPIO support, hardware CRC acceleration (CRC16/CRC32), and SWJ-DP debug interface without ETM - critical for certified industrial firmware development and field-upgrade reliability.

Technical Context

This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash (240 KB upper + 16 KB lower bank) enabling concurrent read-while-write, and two independent SRAM banks (SRAM0 on I/D-code bus, SRAM1 on system bus) for deterministic data access.

The peripheral set includes a DMA controller with 8 channels supporting byte/half-word/word transfers up to 4 GB address space, base timers configurable as PWM/PPG/reload/PWC, and a dedicated HDMI-CEC module with automatic header/ACK/EOM generation and repeat-code detection for remote control systems - all operating within 1.65–3.6 V supply range.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task execution with low interrupt latency.
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports safe over-the-air firmware updates without halting execution.
SRAM32 KB total (16 KB SRAM0 + 16 KB SRAM1), separate buses - isolates instruction/data traffic from system DMA for predictable timing.
ADC24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - meets sub-μs sampling requirements for closed-loop motor current sensing.
Serial InterfacesUp to 8 channels: UART/CSIO/I²C; ch.4 supports hardware RTS/CTS flow control - enables robust multi-protocol communication in noisy industrial environments.
Power ModesSix modes including Deep Standby RTC/Stop with RAM retention - extends battery life in always-on remote sensors while preserving context.
Clock SourcesFive sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, PLL - allows precise clock supervision and fail-safe timekeeping.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual 1.65–3.6 V supply domains with decoupling requirements per datasheet Section 12.3.2.
XTAL / EXTALMain clock oscillator input/outputDrives 4–48 MHz crystal; requires external 12–22 pF load capacitors for stable startup.
OSC32K / OSC32KOUT32.768 kHz RTC crystal interfaceSupports low-power RTC operation during Stop/Deep Standby modes with ±20 ppm accuracy.
PA0–PA15, PB0–PB15, etc.Multi-function GPIOUp to 83 pins; port relocate function allows dynamic peripheral mapping; some pins 5 V tolerant - simplifies legacy interface integration.
SWDIO / SWCLKSerial Wire Debug interfaceEnables non-intrusive debugging and flash programming via SWJ-DP; no ETM support per Rev. *D datasheet.

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables background firmware update: erase/write one bank while executing from the other - eliminates system downtime during field upgrades.
Hardware CRC acceleratorOffloads CCITT CRC16 and IEEE-802.3 CRC32 calculations from CPU - reduces integrity check latency for CAN/UART frame validation by >90%.
HDMI-CEC transceiverIntegrated header/ACK/EOM generation and arbitration loss detection - eliminates external CEC PHY for TV/AVR remote control subsystems.
Two watchdog timersIndependent hardware (CR-oscillator-clocked) and software watchdogs - ensures fail-safe recovery even during deep sleep or clock failure scenarios.
Low-voltage detection (LVD)Two-stage monitoring (LVD1 interrupt, LVD2 reset) at programmable thresholds - prevents corrupted Flash writes or SRAM data loss during brown-out conditions.

Applications

Industrial Motor ControlSmart Home HMI Panel

Use Scenario: Brushless DC motor drive with real-time current sensing and commutation timing.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, sampling ADC at 2.0 μs intervals, generating PWM via base timers with <100 ns jitter.

Use Value: Dual-bank Flash allows seamless firmware patching during maintenance windows; 5 V-tolerant GPIO interfaces directly with legacy encoder signals.

Use Scenario: Touch-enabled wall-mounted thermostat with local display, wireless comms, and battery backup.

IC Role / Device Role / Timing Role: System-on-chip managing capacitive touch, OLED driver, BLE co-processor interface, and RTC wake-up scheduling.

Use Value: Deep Standby RTC mode draws <1.5 μA while retaining RAM and time - extends coin-cell battery life beyond 5 years.

Remote-Controlled AV EquipmentIoT Edge Sensor Node

Use Scenario: HDMI-CEC enabled soundbar responding to TV power commands and relaying volume control.

IC Role / Device Role / Timing Role: Dedicated CEC protocol engine handling header detection, ACK generation, and repeat-code filtering without CPU intervention.

Use Value: Hardware CEC logic reduces firmware overhead by ~3.2 kB ROM and eliminates timing-critical ISR servicing.

Use Scenario: Battery-powered environmental monitor logging temperature/humidity/pressure with periodic LoRaWAN upload.

IC Role / Device Role / Timing Role: Low-power sensor hub aggregating data from I²C sensors, performing CRC-secured packet assembly, and waking only for transmission.

Use Value: Six-tier power modes and sub-μA Stop mode enable 10-year battery life; hardware CRC ensures OTA update integrity without CPU load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F103VCT672 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CECLacks hardware CEC and safe firmware update capability; requires external PHY for IR/CECSelect when higher CPU throughput is needed and CEC is handled externally.
RP2040Dual-core ARM Cortex-M0+, 2 MB Flash, 264 KB SRAM, no RTC or hardware CRC acceleratorNo built-in RTC or LVD; relies on software CRC; lacks industrial-grade voltage range (1.8–3.3 V only)Select for cost-sensitive consumer devices where deep sleep current and CEC are not required.

Compared with STM32F103VCT6 and RP2040, CY9AF144LBPMC1-G-JNE2 uniquely combines dual-bank Flash for fail-safe updates, integrated HDMI-CEC, and industrial 1.65–3.6 V operation - making it optimal for certified embedded systems where firmware integrity and protocol offload are mandatory.

Availability

CY9AF144LBPMC1-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart home HMI panels, remote-controlled AV equipment, and IoT edge sensor nodes requiring stable component supply across extended product lifecycles.

Supply support for CY9AF144LBPMC1-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security ICs, with global R&D and manufacturing infrastructure.

The CY9A140NB series - including CY9AF144LBPMC1-G-JNE2 - was designed for cost-sensitive, low-power embedded controllers in industrial automation and consumer electronics, emphasizing firmware safety, peripheral integration, and long-term supply stability.

FAQ

Does CY9AF144LBPMC1-G-JNE2 support JTAG debugging?

No. This device supports Serial Wire JTAG Debug Port (SWJ-DP) only, as confirmed in Rev. *D datasheet page 5. JTAG TDI/TDO pins are not implemented; debug access requires SWDIO and SWCLK signals with standard ARM SWD protocol. The absence of ETM limits trace depth but maintains full breakpoint and memory inspection capability.

What is the maximum operating temperature range for this MCU?

CY9AF144LBPMC1-G-JNE2 is rated for industrial temperature range: –40 °C to +85 °C, verified per Absolute Maximum Ratings (Section 12.1) and Recommended Operating Conditions (Section 12.2) in datasheet Rev. *D. Thermal derating begins above 85 °C ambient, and operation outside this range may cause Flash write failure or SRAM retention loss.

Can the external bus interface be enabled on this part?

No. CY9AF144LBPMC1-G-JNE2 explicitly excludes External Bus Interface support, as stated in the datasheet footnote on page 2: "CY9AF141LB, F142LB and F144LB do not support External Bus Interface." Pin functions for address/data multiplexing are unassigned, and related registers are read-only or reserved.

Is hardware flow control available on all UART channels?

No. Hardware flow control (RTS/CTS) is supported only on UART channel 4, as documented in the "Hardware Flow control" footnote on page 2 of Rev. *D datasheet. Channels 0–3 lack dedicated CTS/RTS pins and associated control logic; software-based XON/XOFF must be used for those interfaces.

CY9AF144LBPMC1-G-JNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9A140NB
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
288KB (288K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF144LBPMC1-G-JNE2 FAQ

1.How can I place an order for CY9AF144LBPMC1-G-JNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF144LBPMC1-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF144LBPMC1-G-JNE2 reliable?

The price and inventory of CY9AF144LBPMC1-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144LBPMC1-G-JNE2 is usually 5 days.

3.What payment methods are accepted for CY9AF144LBPMC1-G-JNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144LBPMC1-G-JNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF144LBPMC1-G-JNE2?

CY9AF144LBPMC1-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF144LBPMC1-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF144LBPMC1-G-JNE2?

For technical support, including CY9AF144LBPMC1-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144LBPMC1-G-JNE2 requirements.

6.How does Aetrix verify that CY9AF144LBPMC1-G-JNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AF144LBPMC1-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144LBPMC1-G-JNE2 meets industry standards.

7.What is the process for return or replacement of CY9AF144LBPMC1-G-JNE2?

All CY9AF144LBPMC1-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144LBPMC1-G-JNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF144LBPMC1-G-JNE2 part is unused and in its original packaging.

Return procedure for CY9AF144LBPMC1-G-JNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AF144LBPMC1-G-JNE2 Tags

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