Infineon Technologies CY9AF144LBPMC-G-JNE2
- Part No.:
- CY9AF144LBPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AF144LBPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,788
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF144LBPMC-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and integrated peripherals including 24-channel 12-bit ADC (2.0 μs conversion), 8-channel DMA, and up to 8 serial interfaces (UART/CSIO/I²C). It operates at up to 40 MHz, supports six low-power modes (including Deep Standby RTC/Stop), and targets embedded motor control and industrial sensor nodes.
For engineers reviewing the CY9AF144LBPMC-G-JNE2 datasheet, CY9AF144LBPMC-G-JNE2 pinout, CY9AF144LBPMC-G-JNE2 application, or CY9AF144LBPMC-G-JNE2 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant GPIOs on selected pins, hardware CRC acceleration (CCITT CRC16 & IEEE-802.3 CRC32), and SWJ-DP debug interface without ETM support.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read-erase-write across upper (240 KB) and lower (16 KB main + 32 KB work) banks, and two independent SRAM blocks (SRAM0 on I/D-code bus, SRAM1 on system bus).
Peripheral integration includes eight 16-bit base timers (PWM/PPG/reload/PWC), dual watchdogs (hardware clocked by 100 kHz CR oscillator, active in all low-power modes except Deep Standby), HDMI-CEC/remote receiver (2 channels), RTC with leap-year support, and Clock Supervision (CSV) that monitors external clock failure or frequency anomaly using internal CR oscillators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with Thumb-2 instruction set and low-latency interrupt handling. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower main + 32 KB lower work) - supports background firmware update without halting application code. |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1) - separates instruction/data access paths to reduce bus contention during DMA transfers. |
| ADC | 24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - delivers high-resolution analog sensing for closed-loop motor control or battery monitoring. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention option - extends battery life in always-on sensor endpoints while preserving context. |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP), no ETM - provides full run-control and register/memory access with minimal pin count (SWDIO/SWCLK/nRESET). |
| Supply Voltage | 1.65 V to 3.6 V - compatible with single-cell Li-ion, 3.3 V logic rails, and energy-harvesting power sources. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power pins ensure noise isolation for ADC and PLL operation. |
| XTAL / EXTAL | Main clock input/output | Connects to 4–48 MHz crystal or external oscillator; required for precise timing and PLL operation. |
| OSC32K / OSC32KOUT | Sub-clock input/output | Drives 32.768 kHz RTC crystal; enables timekeeping and wake-up from Stop/Deep Standby modes. |
| SWDIO / SWCLK | Debug interface signals | Enable non-intrusive programming and real-time debugging via Serial Wire protocol (2-pin SWJ-DP). |
| P00–P57 | General-purpose I/O | Up to 83 GPIOs with port relocate function; some pins support 5 V tolerance for mixed-voltage interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates with zero downtime: erase/write one bank while executing from the other. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing integrity check latency in communication stacks. |
| HDMI-CEC transceiver | Integrates header block auto-transmission, arbitration loss detection, and automatic ACK reply - simplifies smart TV remote control subsystem design. |
| Two independent watchdogs | Hardware watchdog (100 kHz CR clock) remains active in Deep Standby Stop mode; software watchdog offers flexible timeout configuration. |
| Port relocate function | Allows dynamic remapping of peripheral functions (e.g., UART0, I²C0) to alternate GPIO pins - increases PCB layout flexibility and reduces routing congestion. |
Applications
| Industrial Motor Control | Smart Home Sensor Hub |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, position feedback, and thermal monitoring. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM generation via base timers, and sampling ADC channels at 2.0 μs intervals. Use Value: Dual-bank Flash allows field-upgradable motor profiles; 5 V-tolerant GPIOs interface directly with Hall-effect sensors and gate drivers. | Use Scenario: Battery-powered multi-sensor node aggregating temperature, humidity, motion, and ambient light data. IC Role / Device Role / Timing Role: System-on-chip managing ultra-low-power sleep cycles, RTC-triggered wake-ups, and burst-mode ADC scanning. Use Value: Deep Standby RTC mode draws <1 μA while retaining RAM and timekeeping; hardware CRC verifies OTA firmware packets. |
| Energy Metering Interface | CEC-Controlled AV Equipment |
Use Scenario: Isolated metering front-end communicating via UART/RS-485 to host MCU or gateway. IC Role / Device Role / Timing Role: Signal conditioner and protocol handler converting analog meter outputs into Modbus/IEC 62056 frames. Use Value: 24-channel ADC supports simultaneous voltage/current/neutral sensing; UART with dedicated baud rate generator ensures accurate serial timing. | Use Scenario: HDMI-connected audio/video receiver implementing CEC command routing and device discovery. IC Role / Device Role / Timing Role: HDMI-CEC physical layer transceiver and protocol engine handling START/EOM/ACK generation and arbitration loss recovery. Use Value: Integrated CEC logic eliminates external transceiver IC; automatic ACK reply reduces firmware overhead in remote control response path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | ARM Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or hardware CRC accelerator | Lacks built-in HDMI-CEC and sub-clock RTC wake-up from Deep Standby | Choose when higher SRAM headroom is needed and CEC/low-power RTC features are not required. |
| RP2040 | Dual-core ARM Cortex-M0+, 2 MB Flash (external QSPI), 264 KB SRAM, no analog peripherals or hardware watchdog | No integrated ADC, no hardware CRC, no low-power deep sleep with RTC retention | Prefer for cost-sensitive USB-hosted applications where external Flash suffices and analog sensing is handled externally. |
Compared with STM32F103VCT6 and RP2040, CY9AF144LBPMC-G-JNE2 uniquely combines dual-bank Flash for safe firmware updates, hardware-accelerated CRC for secure communication, and Deep Standby RTC mode with RAM retention-making it optimal for battery-constrained, field-upgradable embedded controllers requiring robust timing and analog integration.
Availability
CY9AF144LBPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart home sensor hubs, energy metering interfaces, and CEC-controlled AV equipment requiring stable component supply and long-term lifecycle support.
Supply support for CY9AF144LBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control applications in industrial automation, appliance control, and consumer electronics with integrated analog and communication peripherals.
FAQ
Does CY9AF144LBPMC-G-JNE2 support external memory expansion?
No. Unlike earlier CY9A140NB series variants (e.g., CY9AF141LB), the CY9AF144LBPMC-G-JNE2 explicitly omits External Bus Interface support per the official datasheet revision *D. It relies solely on on-chip Flash and SRAM for program and data storage.
What debug capabilities does this MCU provide?
CY9AF144LBPMC-G-JNE2 supports Serial Wire JTAG Debug Port (SWJ-DP) with full run-control, memory/register access, and flash programming. It does not include Embedded Trace Macrocell (ETM), so instruction trace is unavailable - only basic breakpoint and watchpoint debugging is supported.
Is hardware flow control available on its UART interfaces?
No. Hardware flow control (CTS/RTS) is explicitly excluded from CY9AF144LBPMC-G-JNE2 per the datasheet. Only UART channels 0–3 and 4–7 are supported, but channel 4 - the only one specified for RTS/CTS in other FM3 variants - lacks this feature in this part number.
How does the dual-bank Flash architecture improve firmware reliability?
The dual-bank Flash (240 KB upper + 16 KB lower main + 32 KB lower work) allows erasing and reprogramming one bank while executing code from the other. This enables atomic firmware updates without runtime interruption, critical for medical devices, industrial controllers, and remote IoT endpoints where downtime is unacceptable.
CY9AF144LBPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9A140NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF144LBPMC-G-JNE2 FAQ
1.How can I place an order for CY9AF144LBPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF144LBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF144LBPMC-G-JNE2 reliable?
The price and inventory of CY9AF144LBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144LBPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF144LBPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144LBPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF144LBPMC-G-JNE2?
CY9AF144LBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF144LBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF144LBPMC-G-JNE2?
For technical support, including CY9AF144LBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144LBPMC-G-JNE2 requirements.
6.How does Aetrix verify that CY9AF144LBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF144LBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144LBPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF144LBPMC-G-JNE2?
All CY9AF144LBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144LBPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF144LBPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AF144LBPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF144LBPMC-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

