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Infineon Technologies CY9AF144MAPMC-G-MNE2
- Part No.:
- CY9AF144MAPMC-G-MNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9AF144MAPMC-G-MNE2.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,188
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Product details
Overview
CY9AF144MAPMC-G-MNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 40 MHz. It integrates UART/CSIO/I²C serial interfaces, 24-channel 12-bit ADC (2.0 µs conversion), RTC, HDMI-CEC, and six low-power modes - deployed in industrial motor control and smart appliance main control units.
For engineers reviewing the CY9AF144MAPMC-G-MNE2 datasheet, CY9AF144MAPMC-G-MNE2 pinout, CY9AF144MAPMC-G-MNE2 application, or CY9AF144MAPMC-G-MNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 5 V-tolerant GPIO support on selected pins, hardware flow control exclusion (per datasheet Rev. *D), and absence of External Bus Interface - critical for embedded BOM validation and real-time OS integration.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.
The peripheral set includes an 8-channel DMA controller with 32-bit addressing, dual watchdog timers (hardware clocked by 100 kHz CR oscillator), and CRC accelerator supporting CCITT CRC16 and IEEE-802.3 CRC32 - all operating within 1.65 V–3.6 V supply range and validated across Sleep, RTC, Stop, and Deep Standby power modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time execution with Thumb-2 instruction set |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports concurrent erase/write/read per bank for robust OTA updates |
| SRAM | 32 KB total (16 KB SRAM0 on I/D bus + 16 KB SRAM1 on system bus) - isolates code/data paths to reduce bus contention |
| ADC | 24-channel 12-bit SAR, 2.0 µs conversion @ 2.7–3.6 V - meets fast-sampling requirements in motor current sensing |
| Serial Interfaces | Up to 8 channels: 4 with 16×9-bit FIFO (ch.4–7), 4 without FIFO (ch.0–3); UART/CSIO/I²C configurable per channel - flexible peripheral multiplexing |
| Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention option - extends battery life in always-on sensor hubs |
| Clock Sources | Five sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - enables precise timing and low-power clock gating |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual VCC/VSS pairs ensure stable core/peripheral rail decoupling; 1.65–3.6 V operation |
| P00–P07, P10–P17, etc. | General-purpose I/O | Up to 83 GPIOs; port relocate function allows dynamic peripheral pin assignment; some pins 5 V tolerant |
| XTAL1 / XTAL2 | Main clock oscillator input/output | Supports 4–48 MHz crystal; paired with internal oscillator for fail-safe clock switching |
| OSC32IN / OSC32OUT | Sub-clock oscillator input/output | Drives 32.768 kHz RTC crystal; enables calendar timekeeping during Deep Standby |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin SWJ-DP (no JTAG) - minimal debug footprint for production programming and field diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash architecture | Enables background firmware update: one bank executes while the other is erased/written - zero-downtime field upgrades |
| Independent SRAM banks | SRAM0 (I/D bus) hosts code and stack; SRAM1 (system bus) buffers sensor data - eliminates CPU stall on DMA transfers |
| HDMI-CEC transceiver | Hardware-accelerated CEC frame generation (START/EOM/ACK) and automatic ACK reply - reduces CPU load in AV remote control stacks |
| CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 calculation from CPU - cuts integrity check latency in communication protocols |
| Two-stage LVD | LVD1 triggers interrupt for graceful shutdown; LVD2 asserts reset below threshold - prevents data corruption during brown-out |
Applications
| Industrial Motor Control | Smart Home Appliance MCU |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing and thermal monitoring. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, sampling ADC at 2.0 µs, managing PWM timers and UART-based host communication. Use Value: Dual-bank Flash allows seamless field firmware updates without halting motor operation; 5 V-tolerant GPIO interfaces directly with legacy sensor modules. | Use Scenario: Washing machine main board managing water valves, drum motor, display, and Wi-Fi module. IC Role / Device Role / Timing Role: System orchestrator handling RTC-based cycle scheduling, HDMI-CEC remote commands, and multi-channel ADC for temperature/weight sensing. Use Value: Deep Standby RTC mode maintains accurate timekeeping at <1 µA; integrated CRC engine validates OTA firmware packets before flash write. |
| Energy Metering Gateway | IoT Edge Sensor Hub |
Use Scenario: Sub-metering node aggregating current/voltage readings and transmitting via RS-485. IC Role / Device Role / Timing Role: Data concentrator with UART hardware flow control disabled (per datasheet), using CSIO for isolated SPI-to-RS485 bridge. Use Value: 24-channel ADC supports simultaneous sampling across multiple CT sensors; six low-power modes extend battery backup duration during grid outage. | Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and motion. IC Role / Device Role / Timing Role: Ultra-low-power coordinator waking periodically via Watch Counter, reading sensors via I²C, and transmitting via BLE SoC over UART. Use Value: Sub-clock RTC and Deep Standby Stop mode achieve <2 µA sleep current; unique 41-bit ID enables secure device onboarding in cloud platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM; no dual-bank Flash or HDMI-CEC; supports external bus | Lacks built-in CEC transceiver and dual-bank update capability; requires external components for remote control stack | Select when higher CPU frequency and larger SRAM are prioritized over CEC and safe firmware update features |
| RP2040 | Dual-core ARM Cortex-M0+, 2 MB Flash, 264 KB SRAM; no RTC, no hardware CEC, no analog peripherals beyond 4-channel ADC | No native RTC or HDMI-CEC; relies on software timing and external ICs for remote control and calendar functions | Select for cost-sensitive, high-throughput USB/PIO applications where analog integration and calendar timekeeping are secondary |
Compared with STM32F103VCT6 and RP2040, CY9AF144MAPMC-G-MNE2 uniquely delivers integrated HDMI-CEC transceiver, dual-bank Flash for atomic firmware updates, and RTC with calendar support - making it optimal for consumer electronics requiring remote control, time-aware scheduling, and field-upgradable firmware without external components.
Availability
CY9AF144MAPMC-G-MNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart home appliance MCU, energy metering gateway, and IoT edge sensor hub applications requiring stable component supply, long-term lifecycle support, and qualified automotive-grade traceability.
Supply support for CY9AF144MAPMC-G-MNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive, low-power embedded control in white goods, industrial automation, and building automation systems.
FAQ
Does CY9AF144MAPMC-G-MNE2 support hardware flow control on UART?
No. Per the official datasheet Rev. *D, CY9AF144MAPMC-G-MNE2 - along with CY9AF141LB and CY9AF142LB - does not support hardware flow control (CTS/RTS). Only UART channel 4 on earlier FM3 variants includes this feature. Designers must implement software handshaking or external logic if flow control is required.
What is the maximum ADC sampling rate achievable with this MCU?
The 12-bit SAR ADC achieves a minimum conversion time of 2.0 µs at 2.7–3.6 V, enabling up to 500 kSPS per channel. With scanning mode and FIFO buffering (16-step depth), sustained multi-channel acquisition at ≥200 kSPS is feasible - verified under recommended operating conditions in Section 12.5 of the datasheet.
Is External Bus Interface available on CY9AF144MAPMC-G-MNE2?
No. The datasheet explicitly states that CY9AF144LB (the base variant of this part) does not support External Bus Interface. This applies to CY9AF144MAPMC-G-MNE2. Designers requiring external memory expansion must use alternative FM3 variants like CY9AF146MB or select a different MCU family with EBI support.
How is the unique device ID used in secure boot implementations?
The 41-bit factory-programmed unique ID is accessible via dedicated register and used as entropy source or hardware root-of-trust anchor. It enables cryptographic binding of firmware images to specific devices during secure boot verification - supported by Infineon's FM3 security libraries and validated in application notes AN91441 and AN92204.
CY9AF144MAPMC-G-MNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9A140NA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF144MAPMC-G-MNE2 FAQ
1.How can I place an order for CY9AF144MAPMC-G-MNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF144MAPMC-G-MNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF144MAPMC-G-MNE2 reliable?
The price and inventory of CY9AF144MAPMC-G-MNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144MAPMC-G-MNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF144MAPMC-G-MNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144MAPMC-G-MNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF144MAPMC-G-MNE2?
CY9AF144MAPMC-G-MNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF144MAPMC-G-MNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF144MAPMC-G-MNE2?
For technical support, including CY9AF144MAPMC-G-MNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144MAPMC-G-MNE2 requirements.
6.How does Aetrix verify that CY9AF144MAPMC-G-MNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF144MAPMC-G-MNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144MAPMC-G-MNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF144MAPMC-G-MNE2?
All CY9AF144MAPMC-G-MNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144MAPMC-G-MNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF144MAPMC-G-MNE2 part is unused and in its original packaging.
Return procedure for CY9AF144MAPMC-G-MNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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