Infineon Technologies CY9AF144MBPMC-G-JNE2
- Part No.:
- CY9AF144MBPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9AF144MBPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,460
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF144MBPMC-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 40 MHz. It integrates UART/CSIO/I²C interfaces, 24-channel 12-bit ADC (2.0 μs conversion), 8-channel DMA, RTC, HDMI-CEC, and six low-power modes - deployed in industrial motor control and smart appliance main control units.
For engineers reviewing the CY9AF144MBPMC-G-JNE2 datasheet, CY9AF144MBPMC-G-JNE2 pinout, CY9AF144MBPMC-G-JNE2 application, or CY9AF144MBPMC-G-JNE2 equivalent, key selection criteria include dual-bank Flash for safe firmware updates, 5 V-tolerant GPIO support, hardware watchdog independence from main clock, and SWJ-DP debug interface compatibility with standard ARM toolchains.
Technical Context
This MCU implements the ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem features dual-operation Flash enabling concurrent read-erase-write across upper (240 KB) and lower (16 KB) banks, and split SRAM architecture (SRAM0 on I/D-code bus, SRAM1 on system bus) to reduce core-peripheral contention.
The peripheral set includes eight base timers (configurable as PWM/PPG/reload/PWC), two independent 12-bit ADC units with FIFO-based scanning and priority conversion, and HDMI-CEC transceiver logic with automatic ACK generation and arbitration loss detection - all operating within 1.65–3.6 V supply range and validated for deep standby RTC mode with RAM retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task execution with NVIC interrupt latency under 12 cycles |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports live firmware update without halting application code |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1), split bus mapping - isolates instruction/data access from peripheral DMA transfers |
| ADC | 24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - meets sub-10 μs sampling requirements for closed-loop motor current sensing |
| Low-Power Modes | Six modes including Deep Standby RTC with RAM retention - extends battery life in always-on remote control receivers |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP) only - compatible with CMSIS-DAP, Segger J-Link, and OpenOCD without ETM trace |
| I/O Voltage Tolerance | 5 V tolerant on selected pins - simplifies level-shifting in mixed-voltage industrial I/O subsystems |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated analog/digital power domains with separate decoupling requirements per datasheet Section 12.3.2 |
| XTAL1/XTAL2 | Main crystal oscillator input/output | Supports 4–48 MHz external crystals; internal load capacitance configurable via register |
| OSC32K1/OSC32K2 | 32.768 kHz RTC crystal terminals | Enables autonomous RTC operation during Stop and Deep Standby RTC modes |
| P00–P07, P10–P17, etc. | Multi-function GPIO ports | Up to 83 pins; port relocate function allows remapping of UART/CSIO/I²C to alternate pins without PCB change |
| RESET | Active-low reset input | Accepts asynchronous deassertion; triggers Power-on Reset, LVD2 reset, or software-initiated reset |
| TMS/TCK/TDO/TDI/SWCLK/SWDIO | SWJ-DP debug interface | 5-pin minimal debug footprint; no TRST or nSRST required for standard programming and halt debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash architecture | Enables background firmware update: erase/write lower bank while executing from upper bank, eliminating system downtime |
| Split SRAM bus mapping | SRAM0 (I/D-code) and SRAM1 (system bus) prevent CPU-DMA bus contention during high-throughput peripheral transfers |
| HDMI-CEC transceiver logic | Hardware-accelerated CEC frame generation (START/EOM/ACK) and automatic ACK reply - offloads 100% of protocol timing-critical tasks from CPU |
| Two-stage LVD monitoring | LVD1 triggers interrupt for graceful shutdown; LVD2 asserts reset to prevent undefined state during brownout - no external supervisor IC needed |
| Port relocate function | Runtime-configurable peripheral pin assignment (e.g., move UART0 from P30/P31 to P50/P51) - increases PCB layout flexibility and reduces BOM variants |
Applications
| Industrial Motor Control | Smart Appliance Main Controller |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current/voltage sensing and commutation timing. IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, managing 24-channel ADC sampling, PWM output, and fault protection logic. Use Value: 2.0 μs ADC conversion and 40 MHz core enable ≤10 μs current loop update; dual-bank Flash permits field firmware patching without motor stoppage. | Use Scenario: Washing machine control board managing water valves, heater, drum motor, and user interface. IC Role / Device Role / Timing Role: System-on-chip handling sensor inputs (temp, water level), actuator outputs, display, and communication (Wi-Fi module UART). Use Value: 5 V-tolerant GPIO directly interface legacy 5 V sensors; RTC with alarm interrupt schedules delayed start and energy-saving sleep cycles. |
| Remote Control Receiver Unit | HDMI-CEC Enabled AV Equipment |
Use Scenario: IR remote receiver with repeat code detection and wake-from-sleep functionality. IC Role / Device Role / Timing Role: Low-power subsystem MCU using Watch Counter and RTC to wake every 64 s for IR pulse sampling. Use Value: Deep Standby RTC mode with RAM retention draws <1 μA while preserving context; built-in repeat code logic eliminates host CPU polling overhead. | Use Scenario: TV or soundbar implementing HDMI-CEC for one-touch play and system audio control. IC Role / Device Role / Timing Role: CEC protocol engine handling physical layer signaling, message framing, and arbitration resolution. Use Value: Hardware CEC transmitter/receiver logic ensures ±100 ns timing compliance per HDMI spec; automatic ACK generation prevents CPU timing jitter from violating CEC setup/hold windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CEC | Lacks hardware CEC support and true concurrent Flash operations; requires software-managed firmware update | Select when higher CPU speed and larger SRAM outweigh need for CEC or atomic firmware swap |
| RP2040 | Dual-core ARM Cortex-M0+, 2 MB Flash, 264 KB SRAM, no CEC, no analog peripherals beyond ADC | No 12-bit ADC, no RTC with calendar, no hardware watchdog clocked by CR oscillator | Select for cost-sensitive consumer devices where USB-hosted programming and PIO flexibility supersede industrial timing/peripheral fidelity |
Compared with STM32F103VCT6 and RP2040, CY9AF144MBPMC-G-JNE2 uniquely delivers certified HDMI-CEC PHY compliance, dual-bank Flash for zero-downtime updates, and integrated RTC with leap-year correction - making it optimal for CE-certified AV equipment and industrial controllers requiring guaranteed firmware integrity and precise timekeeping.
Availability
CY9AF144MBPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart appliance main control, remote control receiver units, and HDMI-CEC enabled AV equipment requiring stable component supply across multi-year production cycles.
Supply support for CY9AF144MBPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive industrial and consumer embedded systems requiring robust low-power operation, rich analog integration, and standardized connectivity (UART/I²C/CEC).
FAQ
Does CY9AF144MBPMC-G-JNE2 support in-system programming via UART?
No. In-system programming is supported exclusively through the Serial Wire JTAG Debug Port (SWJ-DP). UART is configured as a peripheral interface only and lacks bootloader capability. Firmware updates must be performed using standard ARM debug tools such as pyOCD or Segger Embedded Studio with SWD connection.
What is the maximum operating temperature for this MCU?
The CY9AF144MBPMC-G-JNE2 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is confirmed in Section 12.2 (Recommended Operating Conditions) of datasheet 002-05637 Rev. *D, with derating applied above 70 °C for sustained 40 MHz operation.
Is the RTC battery-backed when VCC is removed?
No. The RTC operates from VCC and retains time only during low-power modes (Stop, Deep Standby RTC) while VCC remains within 1.65–3.6 V. It does not include a dedicated VBAT pin or internal capacitor backup; external supercapacitor or coin cell circuitry is required for true battery-backed timekeeping.
Can the 12-bit ADC perform simultaneous sampling across multiple channels?
No. The two 12-bit ADC units operate independently but do not support hardware-triggered simultaneous sampling. Each unit performs sequential conversions per scan sequence; inter-unit synchronization requires software coordination via shared trigger sources like timer overflow events.
CY9AF144MBPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9A140NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF144MBPMC-G-JNE2 FAQ
1.How can I place an order for CY9AF144MBPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF144MBPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF144MBPMC-G-JNE2 reliable?
The price and inventory of CY9AF144MBPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144MBPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF144MBPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144MBPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF144MBPMC-G-JNE2?
CY9AF144MBPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF144MBPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF144MBPMC-G-JNE2?
For technical support, including CY9AF144MBPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144MBPMC-G-JNE2 requirements.
6.How does Aetrix verify that CY9AF144MBPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF144MBPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144MBPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF144MBPMC-G-JNE2?
All CY9AF144MBPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144MBPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF144MBPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AF144MBPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF144MBPMC-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

