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Infineon Technologies CY9AF144NBBGL-GE1

Part No.:
CY9AF144NBBGL-GE1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
96-LFBGA
Datasheet:
AetrixCY9AF144NBBGL-GE1.pdf
Description:
IC MCU 32BIT 288KB FLASH 96FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,825

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Product details

Overview

CY9AF144NBBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 40 MHz. It integrates UART/CSIO/I²C interfaces, 24-channel 12-bit ADC (2.0 μs conversion), RTC, HDMI-CEC, and six low-power modes - deployed in industrial motor control and smart sensor nodes requiring deterministic real-time response.

For engineers reviewing the CY9AF144NBBGL-GE1 datasheet, CY9AF144NBBGL-GE1 pinout, CY9AF144NBBGL-GE1 application, or CY9AF144NBBGL-GE1 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant I/O on selected pins, hardware CRC acceleration (CCITT CRC16/IEEE-802.3 CRC32), and SWJ-DP debug support without ETM.

Technical Context

The device implements an ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for OS task scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.

Peripheral integration includes an 8-channel DMA controller with 32-bit addressing and burst/block/demand transfer modes, dual watchdog timers (hardware clocked by 100 kHz CR oscillator), and Clock Supervision (CSV) that monitors external clock failure or frequency anomaly using internal CR oscillators.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with Thumb-2 instruction set and low-latency interrupt handling.
Flash Memory256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background erase/write in one bank while executing from the other.
SRAM32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - enables parallel code/data access and memory partitioning for safety-critical tasks.
ADC24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - provides fast analog sensing for closed-loop motor control or battery monitoring.
Low-Power ModesSix modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in always-on sensor or remote control applications.
Debug InterfaceSerial Wire JTAG Debug Port (SWJ-DP), no ETM - delivers full debug visibility with minimal pin count and standard toolchain compatibility.
Operating Voltage1.65 V to 3.6 V - supports direct interfacing with Li-ion, coin-cell, or regulated 3.3 V supplies without level-shifting.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated power/ground pairs per quadrant minimize noise coupling and ensure stable core/peripheral operation.
XTAL / EXTALMain clock input/outputConnects to 4–48 MHz crystal or external clock source; enables precise timing for USB, communication, or PWM generation.
OSC32K / OSC32KOUTSub-clock input/outputDrives 32.768 kHz crystal for RTC and low-power wake-up timer with ±20 ppm accuracy over temperature.
PA0–PA15, PB0–PB15, etc.Multi-function GPIOUp to 83 fast I/O pins with port relocate function - allows flexible peripheral mapping to avoid PCB routing conflicts.
AD0–AD23ADC input channels24 dedicated analog inputs with internal sampling capacitor; share pins with GPIO but require configuration before use.
TXD0–TXD7 / RXD0–RXD7UART/CSIO/I²C serial I/O8 configurable serial interface channels; ch.4–ch.7 support 16-step FIFO for high-throughput data streaming.

Key Features

FeatureDesign Value
Dual-bank Flash memoryEnables live firmware update: erase/write one bank while executing from the other - eliminates system downtime during field upgrades.
Hardware CRC acceleratorOffloads CCITT CRC16 and IEEE-802.3 CRC32 computation - reduces CPU load by >90% for integrity checks on UART/I²C received frames or Flash data blocks.
HDMI-CEC transceiverIntegrated header block auto-transmission, ACK generation, and arbitration loss detection - eliminates external CEC PHY for TV remote control and home automation hubs.
Port relocate functionAllows dynamic assignment of UART, I²C, or timer outputs to any compatible GPIO pin - simplifies PCB layout and avoids signal congestion on fixed pinouts.
Two-stage LVDLVD1 triggers interrupt for graceful shutdown; LVD2 asserts reset below safe voltage - prevents data corruption during brown-out conditions in battery-powered systems.

Applications

Industrial Motor ControlSmart Home Sensor Hub

Use Scenario: Closed-loop BLDC motor drive with current sensing, thermal monitoring, and CAN/UART telemetry.

IC Role / Device Role / Timing Role: Real-time control unit executing FOC algorithm, managing PWM timing, ADC sampling synchronization, and fault-safe shutdown.

Use Value: 2.0 μs ADC conversion and 40 MHz core enable sub-10 μs control loop cycles; dual-bank Flash permits OTA firmware patching without halting motion.

Use Scenario: Multi-sensor node aggregating temperature, humidity, occupancy, and ambient light data for Zigbee/Thread gateway.

IC Role / Device Role / Timing Role: Low-power host MCU managing sensor polling, data fusion, encryption, and wireless interface handoff.

Use Value: Deep Standby RTC mode draws <1.5 μA while maintaining time and waking every 30 s; 5 V-tolerant I/O directly interfaces legacy sensors without level shifters.

Remote Control TransceiverEnergy Monitoring Endpoint

Use Scenario: HDMI-CEC enabled universal remote supporting TV, soundbar, and streaming stick control via single IR/RF link.

IC Role / Device Role / Timing Role: CEC protocol engine with built-in START/EOM/ACK generation and repeat code detection.

Use Value: Eliminates external CEC transceiver IC; hardware-accelerated frame transmission ensures compliance with HDMI 1.3a timing requirements (±100 ns edge accuracy).

Use Scenario: DIN-rail mounted electricity meter logging voltage, current, and power factor at 1 kHz sampling rate.

IC Role / Device Role / Timing Role: High-precision data acquisition controller with synchronized 24-channel ADC scan and CRC-protected flash storage.

Use Value: Scanning conversion mode with 16-step FIFO captures full waveform cycles; CRC accelerator validates 1 MB/day of logged data with <50 μs overhead per 1 kB block.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F103VCT672 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CECLacks integrated CEC transceiver and hardware CRC; requires external PHY and software CRC for similar functionalityChoose when higher CPU speed and larger SRAM outweigh need for seamless firmware updates or CEC protocol offload.
RP2040Dual-core ARM Cortex-M0+, 2 MB Flash, 264 KB SRAM, no hardware RTC or CECNo native HDMI-CEC, no hardware CSV/LVD2 reset, limited analog capability (only 4-channel 12-bit ADC)Prefer for cost-sensitive consumer IoT where dual-core simplicity and USB mass storage boot suffice over industrial-grade reliability features.

Compared with STM32F103VCT6 and RP2040, CY9AF144NBBGL-GE1 uniquely combines dual-bank Flash for zero-downtime updates, integrated HDMI-CEC transceiver, and hardware CRC acceleration - making it optimal for certified industrial and AV equipment where functional safety and protocol compliance are mandatory.

Availability

CY9AF144NBBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor control, smart home sensor hubs, remote control transceivers, and energy monitoring endpoints requiring stable component supply across multi-year production cycles.

Supply support for CY9AF144NBBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.

This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive industrial control, home appliance, and audio/video equipment requiring robust real-time performance and integrated communication peripherals.

FAQ

Does CY9AF144NBBGL-GE1 support external memory expansion?

No. Unlike earlier CY9A140NB series variants (e.g., CY9AF141LB), this part omits the External Bus Interface. It relies solely on on-chip 256 KB Flash and 32 KB SRAM for program and data storage, eliminating external memory complexity but limiting maximum application size to internal memory capacity.

What debug tools are compatible with CY9AF144NBBGL-GE1?

It supports standard ARM Serial Wire JTAG Debug Port (SWJ-DP) with CMSIS-DAP, Segger J-Link, and ST-Link v2.1 adapters. No Embedded Trace Macrocell (ETM) is included, so instruction trace is unavailable - only breakpoints, watchpoints, and register/memory inspection are supported.

Is hardware flow control available on UART channels?

No. Hardware flow control (CTS/RTS) is explicitly excluded from CY9AF144NBBGL-GE1 per the datasheet - only channel 4 supports it in higher-pin-count variants like CY9AF142LB. Software XON/XOFF or application-level buffering must be used for flow management.

How does the dual-bank Flash architecture improve firmware reliability?

Dual-bank Flash allows simultaneous execution from one bank while erasing/writing the other. This enables atomic firmware updates: new code is validated in the inactive bank before switching vector tables, preventing bricking during power loss or interruption - critical for unattended industrial deployments.

CY9AF144NBBGL-GE1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
96-LFBGA
Series:
FM3 MB9A140NB
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, EBI/EMI, I2C, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
288KB (288K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF144NBBGL-GE1 FAQ

1.How can I place an order for CY9AF144NBBGL-GE1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF144NBBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF144NBBGL-GE1 reliable?

The price and inventory of CY9AF144NBBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144NBBGL-GE1 is usually 5 days.

3.What payment methods are accepted for CY9AF144NBBGL-GE1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144NBBGL-GE1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF144NBBGL-GE1?

CY9AF144NBBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF144NBBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF144NBBGL-GE1?

For technical support, including CY9AF144NBBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144NBBGL-GE1 requirements.

6.How does Aetrix verify that CY9AF144NBBGL-GE1 is sourced from the original manufacturer or authorized distributors?

All CY9AF144NBBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144NBBGL-GE1 meets industry standards.

7.What is the process for return or replacement of CY9AF144NBBGL-GE1?

All CY9AF144NBBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144NBBGL-GE1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF144NBBGL-GE1 part is unused and in its original packaging.

Return procedure for CY9AF144NBBGL-GE1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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