Infineon Technologies CY9AF144NBBGL-GE1
- Part No.:
- CY9AF144NBBGL-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9AF144NBBGL-GE1.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 96FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,825
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF144NBBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM (16 KB SRAM0 + 16 KB SRAM1), and operation up to 40 MHz. It integrates UART/CSIO/I²C interfaces, 24-channel 12-bit ADC (2.0 μs conversion), RTC, HDMI-CEC, and six low-power modes - deployed in industrial motor control and smart sensor nodes requiring deterministic real-time response.
For engineers reviewing the CY9AF144NBBGL-GE1 datasheet, CY9AF144NBBGL-GE1 pinout, CY9AF144NBBGL-GE1 application, or CY9AF144NBBGL-GE1 equivalent, key selection criteria include dual-bank Flash for seamless firmware updates, 5 V-tolerant I/O on selected pins, hardware CRC acceleration (CCITT CRC16/IEEE-802.3 CRC32), and SWJ-DP debug support without ETM.
Technical Context
The device implements an ARM Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for OS task scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent instruction fetch and data access.
Peripheral integration includes an 8-channel DMA controller with 32-bit addressing and burst/block/demand transfer modes, dual watchdog timers (hardware clocked by 100 kHz CR oscillator), and Clock Supervision (CSV) that monitors external clock failure or frequency anomaly using internal CR oscillators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with Thumb-2 instruction set and low-latency interrupt handling. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background erase/write in one bank while executing from the other. |
| SRAM | 32 KB total: 16 KB SRAM0 (I/D bus), 16 KB SRAM1 (system bus) - enables parallel code/data access and memory partitioning for safety-critical tasks. |
| ADC | 24-channel 12-bit SAR, 2.0 μs conversion @ 2.7–3.6 V - provides fast analog sensing for closed-loop motor control or battery monitoring. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention options - extends battery life in always-on sensor or remote control applications. |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP), no ETM - delivers full debug visibility with minimal pin count and standard toolchain compatibility. |
| Operating Voltage | 1.65 V to 3.6 V - supports direct interfacing with Li-ion, coin-cell, or regulated 3.3 V supplies without level-shifting. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per quadrant minimize noise coupling and ensure stable core/peripheral operation. |
| XTAL / EXTAL | Main clock input/output | Connects to 4–48 MHz crystal or external clock source; enables precise timing for USB, communication, or PWM generation. |
| OSC32K / OSC32KOUT | Sub-clock input/output | Drives 32.768 kHz crystal for RTC and low-power wake-up timer with ±20 ppm accuracy over temperature. |
| PA0–PA15, PB0–PB15, etc. | Multi-function GPIO | Up to 83 fast I/O pins with port relocate function - allows flexible peripheral mapping to avoid PCB routing conflicts. |
| AD0–AD23 | ADC input channels | 24 dedicated analog inputs with internal sampling capacitor; share pins with GPIO but require configuration before use. |
| TXD0–TXD7 / RXD0–RXD7 | UART/CSIO/I²C serial I/O | 8 configurable serial interface channels; ch.4–ch.7 support 16-step FIFO for high-throughput data streaming. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables live firmware update: erase/write one bank while executing from the other - eliminates system downtime during field upgrades. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation - reduces CPU load by >90% for integrity checks on UART/I²C received frames or Flash data blocks. |
| HDMI-CEC transceiver | Integrated header block auto-transmission, ACK generation, and arbitration loss detection - eliminates external CEC PHY for TV remote control and home automation hubs. |
| Port relocate function | Allows dynamic assignment of UART, I²C, or timer outputs to any compatible GPIO pin - simplifies PCB layout and avoids signal congestion on fixed pinouts. |
| Two-stage LVD | LVD1 triggers interrupt for graceful shutdown; LVD2 asserts reset below safe voltage - prevents data corruption during brown-out conditions in battery-powered systems. |
Applications
| Industrial Motor Control | Smart Home Sensor Hub |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, thermal monitoring, and CAN/UART telemetry. IC Role / Device Role / Timing Role: Real-time control unit executing FOC algorithm, managing PWM timing, ADC sampling synchronization, and fault-safe shutdown. Use Value: 2.0 μs ADC conversion and 40 MHz core enable sub-10 μs control loop cycles; dual-bank Flash permits OTA firmware patching without halting motion. | Use Scenario: Multi-sensor node aggregating temperature, humidity, occupancy, and ambient light data for Zigbee/Thread gateway. IC Role / Device Role / Timing Role: Low-power host MCU managing sensor polling, data fusion, encryption, and wireless interface handoff. Use Value: Deep Standby RTC mode draws <1.5 μA while maintaining time and waking every 30 s; 5 V-tolerant I/O directly interfaces legacy sensors without level shifters. |
| Remote Control Transceiver | Energy Monitoring Endpoint |
Use Scenario: HDMI-CEC enabled universal remote supporting TV, soundbar, and streaming stick control via single IR/RF link. IC Role / Device Role / Timing Role: CEC protocol engine with built-in START/EOM/ACK generation and repeat code detection. Use Value: Eliminates external CEC transceiver IC; hardware-accelerated frame transmission ensures compliance with HDMI 1.3a timing requirements (±100 ns edge accuracy). | Use Scenario: DIN-rail mounted electricity meter logging voltage, current, and power factor at 1 kHz sampling rate. IC Role / Device Role / Timing Role: High-precision data acquisition controller with synchronized 24-channel ADC scan and CRC-protected flash storage. Use Value: Scanning conversion mode with 16-step FIFO captures full waveform cycles; CRC accelerator validates 1 MB/day of logged data with <50 μs overhead per 1 kB block. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CEC | Lacks integrated CEC transceiver and hardware CRC; requires external PHY and software CRC for similar functionality | Choose when higher CPU speed and larger SRAM outweigh need for seamless firmware updates or CEC protocol offload. |
| RP2040 | Dual-core ARM Cortex-M0+, 2 MB Flash, 264 KB SRAM, no hardware RTC or CEC | No native HDMI-CEC, no hardware CSV/LVD2 reset, limited analog capability (only 4-channel 12-bit ADC) | Prefer for cost-sensitive consumer IoT where dual-core simplicity and USB mass storage boot suffice over industrial-grade reliability features. |
Compared with STM32F103VCT6 and RP2040, CY9AF144NBBGL-GE1 uniquely combines dual-bank Flash for zero-downtime updates, integrated HDMI-CEC transceiver, and hardware CRC acceleration - making it optimal for certified industrial and AV equipment where functional safety and protocol compliance are mandatory.
Availability
CY9AF144NBBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor control, smart home sensor hubs, remote control transceivers, and energy monitoring endpoints requiring stable component supply across multi-year production cycles.
Supply support for CY9AF144NBBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the FM3 family of 32-bit ARM Cortex-M3 microcontrollers, designed specifically for cost-sensitive industrial control, home appliance, and audio/video equipment requiring robust real-time performance and integrated communication peripherals.
FAQ
Does CY9AF144NBBGL-GE1 support external memory expansion?
No. Unlike earlier CY9A140NB series variants (e.g., CY9AF141LB), this part omits the External Bus Interface. It relies solely on on-chip 256 KB Flash and 32 KB SRAM for program and data storage, eliminating external memory complexity but limiting maximum application size to internal memory capacity.
What debug tools are compatible with CY9AF144NBBGL-GE1?
It supports standard ARM Serial Wire JTAG Debug Port (SWJ-DP) with CMSIS-DAP, Segger J-Link, and ST-Link v2.1 adapters. No Embedded Trace Macrocell (ETM) is included, so instruction trace is unavailable - only breakpoints, watchpoints, and register/memory inspection are supported.
Is hardware flow control available on UART channels?
No. Hardware flow control (CTS/RTS) is explicitly excluded from CY9AF144NBBGL-GE1 per the datasheet - only channel 4 supports it in higher-pin-count variants like CY9AF142LB. Software XON/XOFF or application-level buffering must be used for flow management.
How does the dual-bank Flash architecture improve firmware reliability?
Dual-bank Flash allows simultaneous execution from one bank while erasing/writing the other. This enables atomic firmware updates: new code is validated in the inactive bank before switching vector tables, preventing bricking during power loss or interruption - critical for unattended industrial deployments.
CY9AF144NBBGL-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM3 MB9A140NB
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF144NBBGL-GE1 FAQ
1.How can I place an order for CY9AF144NBBGL-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF144NBBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF144NBBGL-GE1 reliable?
The price and inventory of CY9AF144NBBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF144NBBGL-GE1 is usually 5 days.
3.What payment methods are accepted for CY9AF144NBBGL-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF144NBBGL-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF144NBBGL-GE1?
CY9AF144NBBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF144NBBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF144NBBGL-GE1?
For technical support, including CY9AF144NBBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF144NBBGL-GE1 requirements.
6.How does Aetrix verify that CY9AF144NBBGL-GE1 is sourced from the original manufacturer or authorized distributors?
All CY9AF144NBBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF144NBBGL-GE1 meets industry standards.
7.What is the process for return or replacement of CY9AF144NBBGL-GE1?
All CY9AF144NBBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF144NBBGL-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF144NBBGL-GE1 part is unused and in its original packaging.
Return procedure for CY9AF144NBBGL-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF144NBBGL-GE1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
