My Inquiry
My Account
Infineon Technologies CY9AF155MBBGL-GE1
- Part No.:
- CY9AF155MBBGL-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 96-LFBGA
- Datasheet:
-
CY9AF155MBBGL-GE1.pdf
- Description:
- IC MCU 32BIT 416KB FLASH 96FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,442
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF155MBBGL-GE1 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 512 KB dual-bank Flash (496 KB upper + 16 KB lower), 64 KB on-chip SRAM (32 KB SRAM0 + 32 KB SRAM1), and 120-pin LQFP package. It operates up to 40 MHz, supports six low-power modes, and integrates UART/CSIO/I²C, 24-channel 12-bit ADC (2.0 µs conversion), and hardware CRC accelerator for CCITT CRC16 and IEEE-802.3 CRC32 - deployed in industrial motor control and embedded HMI systems.
For engineers reviewing the CY9AF155MBBGL-GE1 datasheet, CY9AF155MBBGL-GE1 pinout, CY9AF155MBBGL-GE1 application, or CY9AF155MBBGL-GE1 equivalent, key selection criteria include dual-bank Flash concurrent read/erase capability, 5 V-tolerant GPIO count (confirmed on pins P00–P07, P10–P17, P20–P27), RTC with leap-year support, and SWJ-DP debug interface without ETM.
Technical Context
This MCU implements a deterministic real-time execution environment via Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels. Its dual-bank Flash enables live firmware updates without halting operation, while independent SRAM0 (I/D-code bus) and SRAM1 (system bus) allow concurrent CPU and DMA access.
The peripheral set includes a 16-channel multi-function serial interface with per-channel mode selection (UART/CSIO/I²C), QPRC for encoder position tracking, HDMI-CEC transceiver with automatic ACK and arbitration loss detection, and two watchdog timers - one hardware-based (low-speed CR oscillator) active in all sleep modes except Deep Standby RTC/Stop.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, 40 MHz max - deterministic interrupt latency and Thumb-2 instruction efficiency for real-time control loops. |
| Flash Memory | 512 KB dual-bank (496 KB upper + 16 KB lower), 0-wait-state read - enables background erase/write during code execution. |
| SRAM | 64 KB total (32 KB SRAM0 + 32 KB SRAM1), separate buses - allows simultaneous CPU fetch and DMA transfer without contention. |
| ADC | 24-channel 12-bit SAR, 2.0 µs conversion @ 2.7–3.6 V - supports high-speed sensor sampling in motor current sensing. |
| Low-Power Modes | Six modes including Deep Standby RTC/Stop with RAM retention option - extends battery life in always-on embedded controllers. |
| Clock Sources | Five sources: 4–48 MHz main XTAL, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, PLL - enables robust clock supervision and failover. |
| Debug Interface | Serial Wire JTAG Debug Port (SWJ-DP) only - standard ARM debug access without ETM trace capability. |
Pinout & Package
Package: 120-pin LQFP (LQM120), 0.4 mm pitch, body size 14 × 14 mm, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core I/O supply at 1.65–3.6 V; dedicated pairs per power domain reduce noise coupling. |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 4–48 MHz external crystal; internal load capacitors configurable via register. |
| OSC32K / OSC32KOUT | 32.768 kHz sub-clock crystal terminals | Drives RTC and low-power timer; internal trimming available for ±20 ppm accuracy. |
| P00–P07, P10–P17, P20–P27 | General-purpose I/O | 5 V-tolerant digital I/O with per-pin pull-up control and port relocate function - simplifies legacy 5 V interface integration. |
| SWDIO / SWCLK | Debug interface signals | Serial Wire Debug I/O and clock - enables programming and real-time debugging without JTAG TAP controller overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash architecture | Enables seamless firmware update: erase/write one bank while executing from the other - eliminates system downtime during field upgrades. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU - reduces integrity check latency for communication buffers and Flash data. |
| Quadrature Position Counter (QPRC) | 16-bit position + 16-bit revolution counters with AIN/BIN/ZIN edge configuration - directly interfaces rotary encoders for closed-loop motor control. |
| HDMI-CEC transceiver | Full protocol stack support: automatic header transmission, ACK reply, arbitration loss detection - enables remote control interoperability in AV equipment. |
| Two independent watchdogs | Hardware watchdog (CR oscillator) remains active in Sleep/Timer/RTC/Stop modes - ensures fail-safe recovery even during deep low-power operation. |
Applications
| Industrial Motor Control | Smart Home HMI Controller |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback and current sensing. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, QPRC-based rotor position capture, and 24-channel ADC sampling of phase currents. Use Value: Dual-bank Flash allows over-the-air firmware updates without stopping motor operation; 2.0 µs ADC enables precise current loop timing. | Use Scenario: Touch-enabled wall panel managing lighting, HVAC, and security subsystems. IC Role / Device Role / Timing Role: Central application processor handling UI rendering, sensor polling, and HDMI-CEC command relay to AV devices. Use Value: Integrated HDMI-CEC transceiver eliminates external protocol IC; RTC with leap-year support maintains accurate scheduling across years. |
| Energy Metering Gateway | Factory Automation I/O Module |
Use Scenario: Substation gateway aggregating Modbus RTU data from smart meters and forwarding via Ethernet. IC Role / Device Role / Timing Role: Protocol translation engine with UART-to-Ethernet bridging, CRC-accelerated frame validation, and secure boot from protected Flash. Use Value: Hardware CRC16/CRC32 offload ensures deterministic Modbus response time; 64 KB SRAM buffers large telemetry payloads. | Use Scenario: DIN-rail mounted remote I/O node with digital input/output, analog sensing, and fieldbus connectivity. IC Role / Device Role / Timing Role: Deterministic I/O scheduler using Base Timers and External Interrupt Controller for <100 µs input response latency. Use Value: Six low-power modes enable energy harvesting operation; 5 V-tolerant GPIOs interface directly with legacy 24 V PLC signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F103VCT6 | 72 MHz Cortex-M3, 256 KB Flash, 48 KB SRAM, no dual-bank Flash or HDMI-CEC | Lacks encoder QPRC and CEC; requires external transceiver for AV control | Select when higher CPU speed is critical and CEC/QPRC are not required. |
| RP2040 | Dual-core Arm Cortex-M0+, 2 MB Flash, no hardware CRC accelerator or QPRC | No native HDMI-CEC or motor control peripherals; relies on software CRC and GPIO bit-banging | Select for cost-sensitive consumer IoT where dual-core simplicity outweighs real-time peripheral depth. |
Compared with STM32F103VCT6 and RP2040, CY9AF155MBBGL-GE1 uniquely combines dual-bank Flash for safe OTA updates, integrated HDMI-CEC for AV interoperability, and QPRC for direct encoder interfacing - making it optimal for industrial edge controllers requiring field-upgradable firmware and multi-protocol connectivity.
Availability
CY9AF155MBBGL-GE1 is available at Aetrix Electronics and suitable for industrial motor control, smart home HMI, energy metering gateways, and factory automation I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for CY9AF155MBBGL-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
CY9AF155MBBGL-GE1 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-optimized, low-power embedded controllers in motor drives, HMI, and industrial IoT edge nodes.
FAQ
Does CY9AF155MBBGL-GE1 support JTAG debugging?
No. This device implements Serial Wire JTAG Debug Port (SWJ-DP) only - it supports SWD (Serial Wire Debug) protocol but does not include full JTAG TAP controller or Embedded Trace Macrocell (ETM). Debugging is performed via SWDIO/SWCLK pins using standard ARM CoreSight tools.
What is the maximum operating temperature range for CY9AF155MBBGL-GE1?
The CY9AF155MBBGL-GE1 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is confirmed in the "Operating Ranges" section of the official datasheet (Document Number 002-05646 Rev. *F), and applies to all DC and AC electrical characteristics.
Can the 32.768 kHz sub-clock drive the RTC while the device is in Deep Standby Stop mode?
Yes. In Deep Standby Stop mode, the sub-clock oscillator remains active and continues to drive the RTC, preserving calendar time and enabling wake-up via RTC alarm. RAM retention is optional and configurable via control register settings.
Is external memory expansion supported, and what interface types are available?
Yes. The External Bus Interface supports SRAM, NOR Flash, and NAND Flash devices via up to 8 chip selects, with 8-/16-bit data width and up to 25-bit addressing (256 MB address space). Address/data multiplexing and external RDY signal handshake are implemented for timing flexibility.
CY9AF155MBBGL-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 96-LFBGA
- Series:
- FM3 MB9A150RB
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 416KB (416K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF155MBBGL-GE1 FAQ
1.How can I place an order for CY9AF155MBBGL-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF155MBBGL-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF155MBBGL-GE1 reliable?
The price and inventory of CY9AF155MBBGL-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF155MBBGL-GE1 is usually 5 days.
3.What payment methods are accepted for CY9AF155MBBGL-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF155MBBGL-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF155MBBGL-GE1?
CY9AF155MBBGL-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF155MBBGL-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF155MBBGL-GE1?
For technical support, including CY9AF155MBBGL-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF155MBBGL-GE1 requirements.
6.How does Aetrix verify that CY9AF155MBBGL-GE1 is sourced from the original manufacturer or authorized distributors?
All CY9AF155MBBGL-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF155MBBGL-GE1 meets industry standards.
7.What is the process for return or replacement of CY9AF155MBBGL-GE1?
All CY9AF155MBBGL-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF155MBBGL-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF155MBBGL-GE1 part is unused and in its original packaging.
Return procedure for CY9AF155MBBGL-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF155MBBGL-GE1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
