Infineon Technologies CY9AF156MAPMC-G-JNE2
- Part No.:
- CY9AF156MAPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
CY9AF156MAPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 544KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,922
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF156MAPMC-G-JNE2 from Spansion (now Cypress Semiconductor, part of Infineon) is a 32-bit ARM Cortex-M3 microcontroller with dual-bank 512 KB Flash (496 KB upper + 16 KB lower), 64 KB on-chip SRAM (32 KB SRAM0 + 32 KB SRAM1), and integrated peripherals including 24-channel 12-bit ADC (2.0 µs conversion), 16-channel base timer, HDMI-CEC/remote control interface, RTC, and dual watchdog timers. It operates at up to 40 MHz across 1.65–3.6 V and targets low-power embedded motor control and industrial HMI applications.
For engineers reviewing the CY9AF156MAPMC-G-JNE2 datasheet, CY9AF156MAPMC-G-JNE2 pinout, CY9AF156MAPMC-G-JNE2 application, or CY9AF156MAPMC-G-JNE2 equivalent, key selection criteria include dual-bank Flash execution capability, 103 GPIOs in 120-pin LQFP package, hardware CRC acceleration (CCITT CRC16/IEEE-802.3 CRC32), QPRC encoder interface, and six configurable low-power modes including Deep Standby RTC.
Technical Context
This MCU implements the ARMv7-M architecture (Cortex-M3 r2p1) with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus SysTick for OS scheduling. Its memory subsystem features independent I-code/D-code buses for SRAM0 and system bus for SRAM1, enabling concurrent CPU and DMA access.
The peripheral set includes a 16-channel multi-function serial interface (UART/CSIO/I²C), 8-channel DMA controller with burst/block/demand transfer modes, and dedicated motor-control blocks: PWM/PPG timers, dead-time insertion, A/D activation compare, and DTIF emergency stop interrupt - all coordinated via the multi-function timer block.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task handling with Thumb-2 instruction set |
| Flash Memory | 512 KB dual-bank (496 KB upper + 16 KB lower) - supports simultaneous read/erase/write for seamless firmware updates |
| SRAM | 64 KB total (32 KB SRAM0 + 32 KB SRAM1) - SRAM0 accessible via I/D buses for zero-wait code/data; SRAM1 for DMA-peripheral buffering |
| ADC | 24-channel 12-bit SAR, 2.0 µs conversion @ 2.7–3.6 V - meets sub-µs sampling requirements for closed-loop motor current sensing |
| Timers | 16-channel base timer + 3×16-bit free-run + QPRC + dual 32/16-bit down counter - provides synchronized PWM generation, position capture, and precise interval timing |
| Low-Power Modes | SLEEP, TIMER, RTC, STOP, Deep Standby RTC, Deep Standby STOP - enables µA-range operation with RAM retention options for rapid wake-up |
| CRC Accelerator | CCITT CRC16 & IEEE-802.3 CRC32 - offloads integrity checks from CPU during firmware OTA or sensor data streaming |
Pinout & Package
CY9AF156MAPMC-G-JNE2 is housed in a 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch) package with exposed thermal pad. Pin functions are fully relocatable per peripheral via port relocation registers, supporting flexible PCB layout and signal routing optimization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | 1.65–3.6 V core I/O domain; multiple pairs ensure stable decoupling and noise immunity |
| XTAL1 / XTAL2 | Main oscillator input/output | Supports 4–48 MHz crystal or external clock source for primary system timing |
| RTCXTAL1 / RTCXTAL2 | Real-time clock oscillator | Connects 32.768 kHz crystal for battery-backed timekeeping in STOP/Deep Standby modes |
| INITX | Reset input | Active-low asynchronous reset pin with internal pull-up; triggers power-on or external reset event |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin JTAG/SWD debug port for programming, breakpointing, and real-time trace without dedicated debug header |
| AIN / BIN / ZIN | Quadrature encoder inputs | Dedicated edge-configurable pins for high-resolution position/revolution counting in motor feedback systems |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables background firmware update: execute from upper bank while erasing/writing lower bank - no application interruption |
| Port relocation function | Allows dynamic assignment of UART, I²C, or timer outputs to any compatible GPIO - eliminates fixed pinout constraints in layout |
| HDMI-CEC/Remote Control interface | Hardware-accelerated CEC frame transmission/reception with automatic ACK, arbitration loss detection, and 4-byte remote buffer - reduces host CPU overhead in AV control systems |
| Quadrature Position/Revolution Counter (QPRC) | 16-bit position + 16-bit revolution counters with programmable A/B/Z edge detection - delivers precise motion tracking without software polling |
| Dual watchdog timers | Independent hardware (CR-oscillator-clocked) and software watchdogs - ensures fail-safe recovery even during deep sleep or clock failure |
Applications
| Industrial Motor Control | Smart Home HMI Panel |
|---|---|
Use Scenario: Brushless DC motor drive with field-oriented control (FOC) requiring real-time current sampling, PWM modulation, and position feedback. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithm, generating synchronized 3-phase PWM, capturing encoder pulses via QPRC, and triggering ADC conversions on timer events. Use Value: Integrated motor-control peripherals reduce external component count; dual-bank Flash enables safe over-the-air firmware updates during runtime. | Use Scenario: Touch-enabled wall-mounted thermostat with local display, wireless connectivity, and IR/CEC remote control support. IC Role / Device Role / Timing Role: Central application processor managing UI rendering, sensor fusion (temp/humidity), IR decode, HDMI-CEC command relay, and RTC-based scheduling. Use Value: Hardware CEC engine and 6 low-power modes extend battery life; 103 GPIOs accommodate capacitive touch overlay and LED indicators. |
| Energy Metering Gateway | Factory Automation I/O Module |
Use Scenario: DIN-rail mounted gateway aggregating pulse outputs from mechanical meters and communicating via RS-485/LPWAN. IC Role / Device Role / Timing Role: Data concentrator with UART/CSIO for meter interfacing, CRC32 acceleration for secure firmware validation, and RTC for timestamped log entries. Use Value: Dual 12-bit ADCs monitor auxiliary supply rails; LVD1/LVD2 provide early warning and auto-reset on brownout conditions. | Use Scenario: Modular digital I/O expansion unit with isolated inputs/outputs, status LEDs, and diagnostic reporting over CAN or Ethernet. IC Role / Device Role / Timing Role: Peripheral manager coordinating GPIO state changes, reading opto-isolated inputs, driving LED drivers, and servicing CAN messages via DMA-assisted UART/CSIO. Use Value: 8-channel DMA enables zero-CPU-load data movement between peripherals and SRAM; external bus interface supports optional NOR flash for configuration storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MB9AF156NAPMC-G-JNE2 | Same die, identical peripherals and memory map, but rated for -40°C to +105°C industrial temperature range vs. CY9AF156MAPMC-G-JNE2's -40°C to +85°C | Required for extended ambient environments such as factory-floor PLC modules or outdoor energy gateways | Select when operating beyond 85°C ambient or requiring full industrial temp qualification |
| MB9AF156RAPMC-G-JNE2 | Same silicon, but configured with 256 KB Flash (240 KB upper + 16 KB lower) and 32 KB SRAM instead of 512 KB/64 KB | Suitable for cost-sensitive applications where firmware footprint and RAM usage are constrained, e.g., basic sensor nodes or simple HMI controllers | Choose when full 512 KB Flash and dual SRAM banks are not required - reduces BOM cost without sacrificing peripheral set |
Compared with MB9AF156NAPMC-G-JNE2 and MB9AF156RAPMC-G-JNE2, CY9AF156MAPMC-G-JNE2 offers the optimal balance of Flash capacity, temperature rating, and feature completeness for mid-tier industrial controllers - retaining full peripheral functionality while targeting standard commercial-extended temperature deployment.
Availability
CY9AF156MAPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart home HMI panels, energy metering gateways, and factory automation I/O modules requiring stable component supply, long-term lifecycle assurance, and qualified sourcing.
Supply support for CY9AF156MAPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion Inc. - acquired by Cypress Semiconductor in 2015 and later integrated into Infineon Technologies - specialized in embedded flash microcontrollers and memory solutions for industrial and automotive markets.
The MB9A150RA series was designed specifically for cost-sensitive, low-power embedded controllers requiring robust real-time performance, integrated analog/motor peripherals, and field-upgradable firmware - targeting industrial automation, building controls, and consumer appliance applications.
FAQ
What is the maximum operating frequency and voltage range for CY9AF156MAPMC-G-JNE2?
The CY9AF156MAPMC-G-JNE2 operates at up to 40 MHz across a supply voltage range of 1.65 V to 3.6 V. Its main clock supports 4–48 MHz external crystals or oscillators, and the built-in PLL enables precise frequency synthesis. The device maintains full specification compliance across this voltage range, including ADC accuracy and Flash write timing.
Does CY9AF156MAPMC-G-JNE2 support in-system programming and firmware updates without halting execution?
Yes - its dual-bank Flash architecture allows one bank (e.g., lower 16 KB) to be erased and reprogrammed while application code continues executing from the other bank (e.g., upper 496 KB). This enables true background firmware updates with zero interruption to real-time tasks such as motor control or sensor acquisition.
How many general-purpose I/O pins are available, and what is their voltage tolerance?
The CY9AF156MAPMC-G-JNE2 provides up to 103 high-speed general-purpose I/O pins in its 120-pin LQFP package. Some pins are explicitly specified as 5V-tolerant in the datasheet's "I/O Circuit Type" table, allowing direct interfacing with legacy 5V logic without level-shifting circuitry - particularly useful for industrial I/O expansion.
Is hardware debug support included, and what interface does it use?
Yes - the device integrates a Serial Wire JTAG Debug Port (SWJ-DP) compliant with ARM CoreSight standards. It supports full debugging capabilities including breakpoints, watchpoints, memory inspection, and real-time variable monitoring using standard tools like Segger J-Link or Cypress PSoC Programmer, with no external debug adapter required beyond a 5-pin SWD connector.
CY9AF156MAPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9A150RA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 544KB (544K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF156MAPMC-G-JNE2 FAQ
1.How can I place an order for CY9AF156MAPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF156MAPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF156MAPMC-G-JNE2 reliable?
The price and inventory of CY9AF156MAPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF156MAPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF156MAPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF156MAPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF156MAPMC-G-JNE2?
CY9AF156MAPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF156MAPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF156MAPMC-G-JNE2?
For technical support, including CY9AF156MAPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF156MAPMC-G-JNE2 requirements.
6.How does Aetrix verify that CY9AF156MAPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF156MAPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF156MAPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF156MAPMC-G-JNE2?
All CY9AF156MAPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF156MAPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF156MAPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AF156MAPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF156MAPMC-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

