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Infineon Technologies CY9AF314LAPMC1-GNE2

Part No.:
CY9AF314LAPMC1-GNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY9AF314LAPMC1-GNE2.pdf
Description:
IC MCU 32BIT 256KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,694

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Product details

Overview

CY9AF314LAPMC1-GNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 512 KB on-chip Flash, 32 KB SRAM (split into two 16 KB banks), USB 2.0 Full-Speed device/host interface, and integrated motor control peripherals including 8-channel Base Timers, dual QPRC units, and multi-function serial interfaces supporting UART, CSIO, LIN 2.1, and I²C. It operates at up to 40 MHz and targets embedded motor control and industrial automation systems.

For engineers reviewing the CY9AF314LAPMC1-GNE2 datasheet, CY9AF314LAPMC1-GNE2 pinout, CY9AF314LAPMC1-GNE2 application, or CY9AF314LAPMC1-GNE2 equivalent, key selection criteria include its dual-bank SRAM architecture, USB host/device capability with built-in PLL, LIN 2.1 support with configurable break field length, 12-bit ADC conversion time of 1.0 μs at 5 V, and 100-pin LQFP package with 83 GPIOs including port relocation.

Technical Context

The CY9AF314LAPMC1-GNE2 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS integration. Its memory subsystem features zero-wait-state Flash execution and dual-bus-connected SRAM banks-SRAM0 on I-code/D-code buses and SRAM1 on the system bus-enabling concurrent CPU and DMA access.

Peripherals include a full-featured USB controller with six endpoints (Endpoint 1: 256-byte double buffer; Endpoints 0,2–5: 64-byte double buffers), eight-channel DMA with burst/block/demand transfer modes, and dedicated motor control blocks: quadrature position/revolution counters (QPRC), multi-function timers with A/D activation compare and DTIF emergency stop, and base timers configurable as PWM, PPG, reload, or PWC units.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time control with Thumb-2 instruction set and low-latency interrupt handling.
Flash Memory512 KB, 0 wait-state read - supports fast code execution without pipeline stalls in high-speed loops.
SRAM32 KB total (SRAM0: 16 KB on I/D buses; SRAM1: 16 KB on system bus) - allows simultaneous CPU instruction fetch and DMA data movement.
USB InterfaceFull-Speed device/host with built-in PLL - eliminates external clock source requirement for USB operation.
ADC12-bit SAR, 2 units × 16 channels, 1.0 μs conversion @ 5 V - meets timing-critical sampling needs in motor current sensing.
LIN SupportLIN 2.1 with programmable 13–16 bit break field and 1–4 bit delimiter - ensures interoperability with automotive body electronics networks.
Package100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - provides 83 GPIOs with port relocation and 5V-tolerant I/O on selected pins.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual power domains: VCC (2.7–5.5 V) for logic/I/O; USBVCC (3.0–3.6 V) for USB PHY - enables mixed-voltage system integration.
XTAL / EXTALMain clock oscillator input/outputAccepts 4–48 MHz crystal or external clock - provides primary timing reference for CPU, peripherals, and PLL.
OSC32K / RTC32KSub-clock oscillator input/outputConnects 32.768 kHz crystal for RTC and wake-up timer - maintains timekeeping during STOP mode.
USB_DP / USB_DMUSB 2.0 Full-Speed differential pairDirect connection to USB connector with internal termination - eliminates need for external resistors in standard implementations.
PA0–PA15, PB0–PB15, etc.General-purpose I/O with peripheral multiplexing83 total GPIOs with port relocation - allows flexible PCB layout by remapping UART, LIN, or timer outputs to alternate pins.

Key Features

FeatureDesign Value
Dual-bank SRAM architectureSRAM0 (16 KB) on I/D buses + SRAM1 (16 KB) on system bus - enables concurrent instruction fetch and DMA data buffering without contention.
Motor control timer suite8-channel Base Timer + 2-unit Multi-function Timer + 2-unit QPRC - supports encoder-based position feedback, PWM generation, dead-time insertion, and emergency stop triggering (DTIF).
Integrated USB host/deviceBuilt-in USB PLL + 6 endpoints (1×256B + 5×64B double-buffered) - enables firmware updates via USB device mode and peripheral attachment via USB host mode.
LIN 2.1 with configurable framingProgrammable 13–16 bit break field and 1–4 bit delimiter - ensures compatibility with legacy and next-gen automotive LIN nodes.
CRC acceleratorHardware CCITT CRC16 and IEEE-802.3 CRC32 - offloads integrity checking from CPU during firmware OTA updates or CAN/LIN message validation.

Applications

Industrial Motor DriveAutomotive Body Control Module

Use Scenario: Closed-loop control of BLDC/PMSM motors in HVAC blowers and pump systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using QPRC for rotor position, Base Timers for PWM generation, and 12-bit ADC for current sensing.

Use Value: Sub-microsecond ADC conversion and deterministic interrupt latency enable precise current regulation at 20 kHz switching frequency.

Use Scenario: Central gateway managing door locks, window lifts, and lighting via LIN sub-nodes.

IC Role / Device Role / Timing Role: LIN master node with configurable break field timing, UART for diagnostics, and GPIO for relay/LED control.

Use Value: Hardware LIN protocol engine reduces CPU load by >40% versus software bit-banging, improving system responsiveness.

Smart Appliance ControllerProgrammable Logic Controller (PLC) I/O Module

Use Scenario: Washing machine main controller coordinating motor, heater, water valve, and display.

IC Role / Device Role / Timing Role: System orchestrator with USB device for firmware updates, multi-channel UART/CSIO for sensor/actuator communication, and watchdog timers for fail-safe reset.

Use Value: Dual-bank SRAM allows background firmware update while maintaining real-time motor control execution in foreground SRAM0.

Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs.

IC Role / Device Role / Timing Role: Protocol bridge between Modbus RTU (via UART) and local GPIOs, with CRC accelerator for packet integrity verification.

Use Value: Hardware CRC32 computation reduces Modbus response latency by 120 μs per frame versus software implementation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F303VCT6ARM Cortex-M4F core, 256 KB Flash, 48 KB SRAM, no USB host, single QPRC unitLacks USB host and second QPRC - unsuitable for dual-encoder motor systems or peripheral attachment scenariosSelect when floating-point math or higher SRAM density is prioritized over USB host and dual QPRC.
RA4M1 R7FS5A67A3A01CFBARM Cortex-M4, 1 MB Flash, 128 KB SRAM, USB device only, no LIN supportNo LIN transceiver or hardware LIN framing - requires external transceiver and software protocol stackSelect for USB-CDC-based HMI or cloud-connected edge devices where LIN is not required.

Compared with STM32F303VCT6 and RA4M1, the CY9AF314LAPMC1-GNE2 uniquely combines USB host/device capability, dual QPRC, and hardware-accelerated LIN 2.1 framing-making it optimal for cost-sensitive industrial drives and automotive body controllers requiring mixed-protocol connectivity without external ICs.

Availability

CY9AF314LAPMC1-GNE2 is available at Aetrix Electronics and suitable for industrial motor drives, automotive body control modules, smart appliance controllers, and PLC I/O modules requiring stable component supply across multi-year production cycles.

Supply support for CY9AF314LAPMC1-GNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and security solutions.

The CY9AF314LAPMC1-GNE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, high-reliability embedded control applications demanding integrated motor control, LIN/USB connectivity, and robust low-power operation.

FAQ

What is the maximum operating frequency and voltage range for CY9AF314LAPMC1-GNE2?

The CY9AF314LAPMC1-GNE2 operates at up to 40 MHz with a core supply voltage (VCC) range of 2.7 V to 5.5 V. Its USB I/O domain (USBVCC) requires 3.0 V to 3.6 V when USB functionality is active, but defaults to the VCC range when used solely for GPIO. These specifications are validated per Infineon's DC Characteristics table in Rev. *F datasheet.

Does CY9AF314LAPMC1-GNE2 support hardware flow control on UART channels?

No, CY9AF314LAPMC1-GNE2 does not support hardware flow control (CTS/RTS) on any UART channel. The datasheet explicitly states this limitation for CY9AF311LA, F312LA, and F314LA variants. UART channels rely on software-controlled flow or FIFO-based buffering instead.

Is external bus interface supported on this part?

No, the CY9AF314LAPMC1-GNE2 does not support the External Bus Interface. Infineon's datasheet confirms this feature is excluded from CY9AF311LA, F312LA, and F314LA variants. All memory expansion must be handled via SPI, USB, or external serial flash interfaced through CSIO or UART.

What debug interfaces are available on CY9AF314LAPMC1-GNE2?

The CY9AF314LAPMC1-GNE2 supports Serial Wire JTAG Debug Port (SWJ-DP) only. It does not include Embedded Trace Macrocell (ETM) support, as confirmed in the "Debug" section of the datasheet for CY9AF314LA variants. SWJ-DP enables full breakpoint, watchpoint, and memory inspection capabilities via standard Arm debug tools.

CY9AF314LAPMC1-GNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
FM3 MB9A310A
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY9AF314LAPMC1-GNE2 FAQ

1.How can I place an order for CY9AF314LAPMC1-GNE2 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY9AF314LAPMC1-GNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY9AF314LAPMC1-GNE2 reliable?

The price and inventory of CY9AF314LAPMC1-GNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF314LAPMC1-GNE2 is usually 5 days.

3.What payment methods are accepted for CY9AF314LAPMC1-GNE2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF314LAPMC1-GNE2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY9AF314LAPMC1-GNE2?

CY9AF314LAPMC1-GNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY9AF314LAPMC1-GNE2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY9AF314LAPMC1-GNE2?

For technical support, including CY9AF314LAPMC1-GNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF314LAPMC1-GNE2 requirements.

6.How does Aetrix verify that CY9AF314LAPMC1-GNE2 is sourced from the original manufacturer or authorized distributors?

All CY9AF314LAPMC1-GNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF314LAPMC1-GNE2 meets industry standards.

7.What is the process for return or replacement of CY9AF314LAPMC1-GNE2?

All CY9AF314LAPMC1-GNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF314LAPMC1-GNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY9AF314LAPMC1-GNE2 part is unused and in its original packaging.

Return procedure for CY9AF314LAPMC1-GNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY9AF314LAPMC1-GNE2 Tags

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