Infineon Technologies CY9AF315NAPMC-GNE2
- Part No.:
- CY9AF315NAPMC-GNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY9AF315NAPMC-GNE2.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,277
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF315NAPMC-GNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 512 KB on-chip Flash, 32 KB SRAM (split into two 16 KB banks), USB 2.0 Full-Speed device/host interface, and integrated motor control peripherals including QPRC, multi-function timers, and PWM-capable base timers. It operates up to 40 MHz, supports 2.7–5.5 V supply, and targets embedded motor control and industrial automation systems requiring real-time I/O, LIN/UART/I²C/CSIO serial interfaces, and deterministic interrupt handling.
For engineers reviewing the CY9AF315NAPMC-GNE2 datasheet, CY9AF315NAPMC-GNE2 pinout, CY9AF315NAPMC-GNE2 application, or CY9AF315NAPMC-GNE2 equivalent, key selection criteria include its dual-bank SRAM architecture for concurrent code/data access, hardware flow control support on UART channel 4, 16-channel 12-bit ADC with FIFO and priority scanning, built-in USB PLL, and 83 GPIOs in 100-pin LQFP package - all validated for industrial-grade reliability and low-power operation across SLEEP/TIMER/STOP modes.
Technical Context
The CY9AF315NAPMC-GNE2 implements an Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer for RTOS scheduling. Its memory subsystem includes zero-wait-state Flash and two independent SRAM banks (SRAM0 on I/D-code buses, SRAM1 on system bus), enabling parallel instruction fetch and data access.
Peripherals are tightly coupled to deterministic timing: the QPRC unit accepts AIN/BIN/ZIN encoder inputs with configurable edge detection and provides 16-bit position/revolution counters; the multi-function timer integrates input capture, output compare, A/D activation, and waveform generation - all synchronized to a shared clock domain for precise motor phase control and current sensing coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 40 MHz - enables deterministic real-time execution with <100 ns interrupt latency. |
| Flash Memory | 512 KB, 0 wait-state read - supports fast boot and in-field firmware updates without performance penalty. |
| SRAM | 32 KB total (2 × 16 KB banks) - SRAM0 for code/data co-access, SRAM1 for DMA buffers or peripheral registers. |
| USB Interface | Full-Speed device/host with built-in PLL - eliminates external crystal for USB clock, reduces BOM count. |
| ADC | 16-channel 12-bit SAR, 1.0 μs conversion @5 V - meets sub-microsecond sampling for closed-loop motor current control. |
| Timers | 8× base timers (PWM/PPG/reload), 2× multi-function timers (6× output compare, 4× input capture) - supports 3-phase BLDC commutation with dead-time insertion. |
| Serial Interfaces | 8× CSIO/UART/LIN/I²C channels (4 with 16×9-bit FIFO) - enables simultaneous CAN gateway, sensor polling, and debug logging. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: VCC (2.7–5.5 V) for core/peripherals; USBVCC (3.0–3.6 V) mandatory when USB active. |
| XTAL / EXTAL | Main clock oscillator input/output | Supports 4–48 MHz crystal; required for USB PLL lock and high-precision timing in motor control loops. |
| OSC32K / RTC32K | Sub-clock oscillator input/output | 32.768 kHz crystal connection for watchdog, RTC, and wake-up from STOP mode (64 s max interval). |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O with port relocate | 83 total GPIOs; each pin assignable to multiple peripheral functions (e.g., UART0_TX, TIM0_CH0, ADC0_IN0) via register mapping. |
| AIN0–AIN3, BIN0–BIN3, ZIN0–ZIN1 | Quadrature encoder inputs | Dedicated QPRC inputs with programmable edge sensitivity - enables direct connection to incremental encoders without external logic. |
| USB_DP / USB_DM | USB 2.0 differential data lines | Full-Speed (12 Mbps) signaling; internal termination and pull-ups eliminate external resistors in device mode. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank SRAM architecture | Enables concurrent CPU instruction fetch from SRAM0 and DMA transfers to SRAM1 - critical for real-time motor control buffering. |
| Hardware UART flow control (CH4) | Automatic CTS/RTS handshake on UART channel 4 - prevents buffer overrun during high-speed host communication (e.g., PC-based tuning). |
| Integrated QPRC with ZIN index detection | 16-bit position counter + 16-bit revolution counter + dual compare registers - supports absolute position tracking and homing in servo drives. |
| Multi-function timer A/D activation | Hardware-triggered ADC start on timer compare event - ensures synchronous sampling of motor phase currents at precise electrical angles. |
| CRC accelerator (CRC16/CRC32) | Offloads integrity checks from CPU during firmware OTA updates or CAN message validation - reduces CPU load by >90% vs. software CRC. |
Applications
| Industrial Motor Drives | Automated Test Equipment |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump inverters. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with dead-time insertion, and ADC-synchronized current sampling. Use Value: 40 MHz Cortex-M3 + 1.0 μs ADC + QPRC enables <5 μs current loop update - meeting IEC 61800-3 Class C2 EMC timing constraints. | Use Scenario: Multi-instrument control and data aggregation in benchtop ATE racks. IC Role / Device Role / Timing Role: USB host managing multiple GPIB-to-USB adapters while running LIN diagnostics on automotive ECUs. Use Value: Integrated USB host + LIN controller + 8 serial channels allows single-chip replacement of discrete MCU + bridge ICs - reducing board area by 35%. |
| Smart Building Controllers | Energy Monitoring Gateways |
Use Scenario: HVAC zone controllers interfacing with BACnet MS/TP fieldbus and analog sensors. IC Role / Device Role / Timing Role: LIN master coordinating damper actuators, UART-driven RS-485 transceivers, and 12-bit ADC for temperature/humidity sensing. Use Value: Hardware LIN 2.1 stack + 16-channel ADC + 83 GPIOs supports full BACnet MSTP node implementation without external transceivers or ADCs. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU data from smart meters and reporting via cellular modem. IC Role / Device Role / Timing Role: Dual UARTs (one for Modbus RTU, one for AT command interface), CRC32-accelerated packet validation, and watchdog reset supervision. Use Value: CRC accelerator cuts firmware update verification time from 120 ms to <5 ms - enabling secure OTA updates over low-bandwidth NB-IoT links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit motor control microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303RET6 | ARM Cortex-M4F core, 72 MHz, 512 KB Flash, 80 KB SRAM; no integrated USB host; QEI instead of QPRC. | Lacks USB host and dedicated LIN peripheral; requires external transceiver for LIN 2.1 compliance. | Preferred when floating-point math or higher CPU throughput is needed, but adds BOM cost for LIN/USB PHY. |
| RA4M2A20GBM#AC0 | ARM Cortex-M33 core, 100 MHz, 1 MB Flash, 256 KB SRAM; USB FS device only; no QPRC or LIN hardware block. | No hardware LIN or quadrature counter - relies on software emulation or external ASICs for motor feedback. | Suitable for general-purpose industrial control where USB device-only and no encoder interface are acceptable. |
Compared with STM32F303RET6 and RA4M2A20GBM#AC0, the CY9AF315NAPMC-GNE2 uniquely integrates USB host, LIN 2.1, and QPRC in a single 100-pin LQFP - eliminating external PHYs and reducing PCB layer count in space-constrained motor drive modules.
Availability
CY9AF315NAPMC-GNE2 is available at Aetrix Electronics and suitable for industrial motor drives, automated test equipment, smart building controllers, and energy monitoring gateways requiring stable component supply across extended product lifecycles.
Supply support for CY9AF315NAPMC-GNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and industrial control solutions.
The CY9AF315NAPMC-GNE2 belongs to the FM3 family of 32-bit Arm Cortex-M3 microcontrollers, designed specifically for cost-sensitive, high-reliability embedded motor control and industrial automation applications requiring integrated analog, timing, and communication peripherals.
FAQ
What is the maximum operating frequency and voltage range for CY9AF315NAPMC-GNE2?
The CY9AF315NAPMC-GNE2 operates at up to 40 MHz with a core supply voltage (VCC) range of 2.7 V to 5.5 V. Its USB I/O supply (USBVCC) must be 3.0–3.6 V when USB functionality is enabled; otherwise, it shares the VCC rail. These ratings are validated per Infineon's DC Characteristics table (Section 12.3) and apply across the full industrial temperature range (–40°C to +85°C).
Does CY9AF315NAPMC-GNE2 support hardware LIN 2.1 protocol handling?
Yes - the CY9AF315NAPMC-GNE2 includes dedicated LIN hardware blocks within its multi-function serial interface (CSIO). It supports LIN 2.1 master/slave operation, automatic break field generation (13–16 bits), break delimiter (1–4 bits), and error detection (parity, framing, overrun), all implemented in hardware without CPU intervention per Section 3.3.3 of the FM3 Peripheral Manual.
How many independent ADC modules does CY9AF315NAPMC-GNE2 integrate, and what is their resolution?
The CY9AF315NAPMC-GNE2 integrates three independent 12-bit successive approximation ADC units. Each supports scanning mode with 16-step FIFO, priority-based conversion (2-level), and hardware trigger from timer compare events. Total channel count is 16, with conversion time of 1.0 μs at 5 V supply, as specified in Section 3.4.1 of the datasheet.
Is external memory expansion supported, and what interface options are available?
Yes - the CY9AF315NAPMC-GNE2 features an External Bus Interface (EBI) supporting SRAM and NOR Flash devices. It provides up to 8 chip selects, 8-/16-bit data width, 25-bit addressing (up to 256 MB address space), address/data multiplexing, and external RDY signal handshake. This capability is confirmed in Section 3.10 of the datasheet and applies to the CY9AF315NAPMC-GNE2 variant.
CY9AF315NAPMC-GNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM3 MB9A310A
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF315NAPMC-GNE2 FAQ
1.How can I place an order for CY9AF315NAPMC-GNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF315NAPMC-GNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF315NAPMC-GNE2 reliable?
The price and inventory of CY9AF315NAPMC-GNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF315NAPMC-GNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF315NAPMC-GNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF315NAPMC-GNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF315NAPMC-GNE2?
CY9AF315NAPMC-GNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF315NAPMC-GNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF315NAPMC-GNE2?
For technical support, including CY9AF315NAPMC-GNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF315NAPMC-GNE2 requirements.
6.How does Aetrix verify that CY9AF315NAPMC-GNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF315NAPMC-GNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF315NAPMC-GNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF315NAPMC-GNE2?
All CY9AF315NAPMC-GNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF315NAPMC-GNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF315NAPMC-GNE2 part is unused and in its original packaging.
Return procedure for CY9AF315NAPMC-GNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF315NAPMC-GNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

