My Inquiry
My Account
Infineon Technologies CY9AF341LBPMC1-G-JNE2
- Part No.:
- CY9AF341LBPMC1-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY9AF341LBPMC1-G-JNE2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,577
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY9AF341LBPMC1-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M3 microcontroller with 256 KB dual-bank Flash, 32 KB SRAM, USB 2.0 Full-Speed device/host interface, 24-channel 12-bit ADC (2.0 µs conversion), and support for six low-power modes including Deep Standby RTC. It targets embedded motor control and industrial sensing systems requiring real-time responsiveness and code security.
For engineers reviewing the CY9AF341LBPMC1-G-JNE2 datasheet, CY9AF341LBPMC1-G-JNE2 pinout, CY9AF341LBPMC1-G-JNE2 application, or CY9AF341LBPMC1-G-JNE2 equivalent, key selection criteria include dual-bank Flash update capability, USB host/device coexistence, hardware CRC acceleration (CRC16/CRC32), and 5V-tolerant GPIO allocation via port relocate function.
Technical Context
This MCU implements an ARM Cortex-M3 r2p1 core operating up to 40 MHz with integrated NVIC (48 peripheral interrupts, 16 priority levels) and SysTick timer. Its memory subsystem includes two independent SRAM banks (SRAM0 on I/D-code bus, SRAM1 on system bus) enabling concurrent CPU and DMA access.
The peripheral set features a multi-function serial interface supporting UART/CSIO/I²C across eight channels, dual 32-/16-bit down counters, HDMI-CEC/remote receiver (2 channels), and a real-time clock with leap-year compensation and configurable alarm interrupts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M3 r2p1, 40 MHz max - enables deterministic real-time task scheduling with hardware divide and Thumb-2 instruction set. |
| Flash Memory | 256 KB dual-bank (240 KB upper + 16 KB lower), 0-wait-state read - supports background firmware updates without halting execution. |
| SRAM | 32 KB total (16 KB SRAM0 + 16 KB SRAM1) - SRAM0 accessible by CPU core for code/data; SRAM1 dedicated to DMA-peripheral transfers. |
| ADC | 24-channel 12-bit SAR, 2.0 µs conversion @ 2.7–3.6 V - meets sub-µs sampling requirements for closed-loop motor current sensing. |
| USB Interface | Full-Speed device/host with built-in PLL, 6 endpoints (EP0–EP5), double-buffered EP1–EP5 - enables simultaneous HID device and mass-storage host operation. |
| Low-Power Modes | Six modes including Deep Standby RTC with RAM retention - extends battery life in remote sensor nodes while preserving timekeeping and critical state. |
| Clock Sources | Five sources: 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz/100 kHz CR oscillators, Main PLL - allows fail-safe clock supervision and precise RTC calibration. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | General-purpose I/O with port relocate | Configurable as UART0 TX/RX, CSIO0, or I²C0 SDA/SCL; 5V-tolerant on select pins per datasheet Table 4-1. |
| P10–P17 | General-purpose I/O with port relocate | Support USB DP/DM when configured as USB0; also usable as Base Timer channel outputs or ADC inputs. |
| P20–P27 | General-purpose I/O with port relocate | Assignable to HDMI-CEC0/1 or Remote Control Receiver inputs; enable IR signal demodulation without external IC. |
| P30–P37 | General-purpose I/O with port relocate | Map to RTC alarm output, Watch Counter interrupt, or LVD reset assertion - critical for autonomous wake-up and fault recovery. |
| VCC / VSS | Power supply / Ground | Separate analog/digital VCC pins (AVCC/DVCC); requires 1.65–3.6 V operation (3.0–3.6 V mandatory when USB active). |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank Flash memory | Enables over-the-air firmware updates with zero downtime: one bank executes while the other is erased/written. |
| Hardware CRC accelerator | Offloads CCITT CRC16 and IEEE-802.3 CRC32 computation from CPU, reducing integrity-check latency in communication stacks. |
| Port relocate function | Allows dynamic assignment of peripheral functions (e.g., UART, I²C, CEC) to any GPIO group - simplifies PCB layout and avoids routing conflicts. |
| Deep Standby RTC mode | Maintains RTC counter and optional RAM retention using only sub-clock (32.768 kHz), drawing <1 µA - ideal for battery-backed timekeeping. |
| HDMI-CEC transmitter/receiver | Handles full CEC protocol stack (header, arbitration, ACK, EOM) in hardware - eliminates need for external CEC transceivers in AV control designs. |
Applications
| Industrial Motor Control | Smart Energy Metering |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, PWM generation, and field-oriented control. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm via Cortex-M3 core; ADC samples phase currents at 2.0 µs intervals; Base Timers generate synchronized 16-bit PWM signals. Use Value: Dual-bank Flash allows safe field firmware upgrades; hardware CRC validates parameter tables stored in Flash; 5V-tolerant GPIO interfaces directly with legacy Hall-effect sensors. | Use Scenario: DIN-rail mounted electricity meter with tamper detection, tariff switching, and RS-485 communication. IC Role / Device Role / Timing Role: RTC maintains accurate billing time with leap-year compensation; LVD2 triggers auto-reset during brownout; UART0 with hardware flow control communicates with metrology IC. Use Value: Deep Standby RTC preserves time and configuration during power loss; dual-stage LVD provides early warning (LVD1 interrupt) and hard reset (LVD2) for grid instability events. |
| Home Automation Gateway | Medical Sensor Hub |
Use Scenario: Zigbee-to-USB gateway bridging smart lighting, HVAC, and security peripherals. IC Role / Device Role / Timing Role: USB host enumerates HID devices (keyboards, remotes); USB device exposes CDC ACM interface to PC; HDMI-CEC controls AV equipment via IR blaster. Use Value: Single-chip dual-role USB eliminates external hub IC; port relocate assigns UART/CSIO to multiple wireless modules without pin conflict; low-power Stop mode extends battery backup duration. | Use Scenario: Portable pulse oximeter with SpO₂ sensor, OLED display, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: ADC digitizes analog photodiode signals; RTC timestamps measurements; SWJ-DP enables in-circuit debugging during clinical validation. Use Value: Sub-µs ADC conversion ensures accurate plethysmograph waveform capture; Sleep mode draws <100 µA while maintaining sensor bias; unique 41-bit ID enables device-level traceability per FDA UDI requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303VCT6 | ARM Cortex-M4F core, 72 MHz, 256 KB Flash, no USB host, no HDMI-CEC, 16-bit sigma-delta ADC | Lacks USB host and CEC; superior analog performance but no consumer AV control capability | Select when floating-point math or high-resolution analog measurement outweighs AV interoperability needs. |
| RA4M1 (R7FA4M1AB3CFM) | ARM Cortex-M4, 48 MHz, 256 KB Flash, USB device only, no CEC, 12-bit ADC (1.0 µs) | No USB host or HDMI-CEC; offers TrustZone security extension and higher ADC speed | Prefer for secure IoT edge nodes where USB host and CEC are unnecessary but code protection is critical. |
Compared with STM32F303VCT6 and RA4M1, CY9AF341LBPMC1-G-JNE2 uniquely integrates USB device/host dual-role and HDMI-CEC in a single Cortex-M3 package - essential for cost-sensitive AV control hubs where peripheral consolidation reduces BOM count and PCB area.
Availability
CY9AF341LBPMC1-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, home automation gateways, and medical sensor hubs requiring stable component supply across long-lifecycle deployments.
Supply support for CY9AF341LBPMC1-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions.
This part belongs to the FM3 family of 32-bit microcontrollers, designed specifically for cost-sensitive industrial and consumer embedded applications demanding low-power operation, peripheral flexibility, and robust real-time control.
FAQ
Does CY9AF341LBPMC1-G-JNE2 support USB host functionality?
Yes, it integrates a full-featured USB 2.0 Full/Low-speed host controller supporting bulk, interrupt, and isochronous transfers, automatic device detection, and up to 256-byte packet length. The built-in USB PLL generates the required 48 MHz clock from the main oscillator.
What is the maximum ADC sampling rate and resolution?
The device contains two 12-bit successive approximation ADC units supporting up to 24 input channels. Each conversion completes in 2.0 µs at 2.7–3.6 V supply, enabling sustained sampling rates up to 500 kSPS per unit under optimal timing conditions.
Can the Flash memory be updated while the application runs?
Yes, its dual-bank Flash architecture allows one bank (e.g., upper 240 KB) to execute code while the other (lower 16 KB work area) is erased and reprogrammed - enabling seamless firmware updates without system interruption or external memory.
Is hardware debug supported, and what interface is used?
It supports Serial Wire JTAG Debug Port (SWJ-DP) compliant with ARM CoreSight standards. This enables full-cycle debugging, flash programming, and real-time trace via standard tools like Segger J-Link or ST-Link v2, without requiring additional debug circuitry on the target board.
CY9AF341LBPMC1-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- FM3 MB9A340NB
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY9AF341LBPMC1-G-JNE2 FAQ
1.How can I place an order for CY9AF341LBPMC1-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY9AF341LBPMC1-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY9AF341LBPMC1-G-JNE2 reliable?
The price and inventory of CY9AF341LBPMC1-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY9AF341LBPMC1-G-JNE2 is usually 5 days.
3.What payment methods are accepted for CY9AF341LBPMC1-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY9AF341LBPMC1-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY9AF341LBPMC1-G-JNE2?
CY9AF341LBPMC1-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY9AF341LBPMC1-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY9AF341LBPMC1-G-JNE2?
For technical support, including CY9AF341LBPMC1-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY9AF341LBPMC1-G-JNE2 requirements.
6.How does Aetrix verify that CY9AF341LBPMC1-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All CY9AF341LBPMC1-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY9AF341LBPMC1-G-JNE2 meets industry standards.
7.What is the process for return or replacement of CY9AF341LBPMC1-G-JNE2?
All CY9AF341LBPMC1-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with CY9AF341LBPMC1-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY9AF341LBPMC1-G-JNE2 part is unused and in its original packaging.
Return procedure for CY9AF341LBPMC1-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY9AF341LBPMC1-G-JNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
